• 한국의류학회지
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• 제34권7호
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• pp.1162-1174
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• 2010

Excavated gold brocade, often shows signs of serious damage and contamination from environmental factors such as exposure to soil or human remains. Therefore, most of the conservation procedures are focused on the consolidation of the gold thread and on cleaning with water or organic solvents. Indiscreet cleaning using solvents could damage the gold leaf, which identifies the features of fabric. There is a need to develop cleaning protocols appropriate for relics through the careful analysis of the condition of the relics. This study finds the appropriate cleaning method for the excavated gold brocade. Four different cleaning methods, vacuum cleaning, kneaded rubber eraser cleaning, immersion wet cleaning, and absorption wet cleaning were applied to the excavated gold brocade. The degree of cleaning and damage were examined depending on the cleaning methods, changes to the physical condition (before and after cleaning) were also analyzed through the surface observation. Although immersion cleaning showed the best cleaning result, this method had a risk of damage to the gold thread. Absorption wet cleaning safely eliminated the various soluble contaminants and the rotten smell of relics. Kneaded rubber eraser was suitable for the excavated gold brocade fabric because it can be applied to selective parts, intentionally excluding some sensitive parts such as the gold thread. The vacuum cleaning method required special attention because of a possibility of suctioning off loosely attached gold leaf. Dual cleaning, the kneaded rubber eraser cleaning, followed by the absorption cleaning was the most effective method to preserve and clean excavated gold brocade.

• Journal of Biosystems Engineering
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• 제31권4호
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• pp.376-384
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• 2006

This study was conducted to perform for comparative analysis of the cleaning efficiency on 3 kinds of cleaning liquid state, 3 steps of cleaning temperature $(45^{\circ}C,\;60^{\circ}C,\;70^{\circ}C,\;)$ and 6 steps of cleaning time (2.5, 5, 7.5, 10, 12.5, 15 minute). 3 kinds of cleaning liquid state are the non fluidized bed, liquid fluidized bed and liquid/solid fluidized bed. UV spectrophotometer was used in estimation of cleaning efficiency, which it is experimental equipment using the absorptiometric analysis method. Cleaning efficiency by cleaning time was increase from 2.5 minutes to 15 minutes, liquid/siolid fluidized bed was indicated the highest cleaning efficiency among the 3 kinds of cleaning liquid state and $70^{\circ}C$ of cleaning temperature at liquid/solid fluidized bed was indicated the highest cleaning efficiency as 98% among the 3 steps of cleaning temperature.

• 한국산업융합학회 논문집
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• 제25권6_3호
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• pp.1315-1324
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• 2022

The need for remanufacturing ships and various mechanical components continues to increase along with environmental problems. Research on remanufacturing is being carried out in various fields, but research on cleaning is quite insufficient. In particular, there is no research on the cleaning-ability of diverse mechanical components. In order to increase the life cycle of mechanical components, remanufacturing must be considered from the step of design. Particularly, it is also very important to evaluate the degree of easiness in cleaning to remove various pollutants generated by long-term use quickly as well as easily. In this study, the degree of easiness in cleaning is defined as cleaning-ability. In fact, remanufacturing components can be easily done only when cleaning-ability is set high from the step of design. The purpose of this study is to evaluate the cleaning-ability of ships and various mechanical components. The details of easiness in cleaning are cleaning and drying identification, accessibility to cleaning tools, convenience in cleaning, and convenience in drying. This study presents a quantitative procedure to evaluate cleaning-ability, derived various factors influencing each of the details of easiness and their ranges, and gave scores to the factors according to their ranges. The weight was also calculated for the details of easiness in cleaning and the factors. Lastly, this researcher suggests a scoring procedure to evaluate cleaning-ability quantitatively and the total weight of cleaning-ability.

• 한국분무공학회지
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• 제12권4호
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• pp.185-190
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• 2007

There is a growing interest to develop a new cleaning technology to overcome the disadvantages of wet cleaning technologies such as environmental pollution and the cleaning difficulty of contaminants on integrated circuits. Laser cleaning is a potential technology to remove various pollutants on a wafer surface. However, there is no fundamental data about cleaning efficiencies and cleaning mechanisms of contaminants on a wafer surface using a laser cleaning technology. Therefore, the cleaning characteristics of a wafer surface using an excimer laser were investigated in this study. Fingerprint consisting of inorganic and organic materials was chosen as a representative of pollutants and the effectiveness of a laser irradiation on a wafer cleaning has been investigated qualitatively and quantitatively. The results have shown that cleaning degree is proportional to the laser irradiation time and repetition rate, and quantitative analysis conducted by an image processing method also have shown the same trend. Furthermore, the cleaning efficiency of a wafer contaminated by fingerprint strongly depended on a photothermal cleaning mechanism and the species were removed in order of hydrophilic and hydrophobic contaminants by laser irradiation.

• 로봇학회논문지
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• 제7권4호
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• pp.243-251
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• 2012

In this paper, developing of a pool cleaning robot is addressed. First, we analyze commercial pool cleaning robot mechanisms, and the merits and demerits of wireless version of a pool cleaning robot is introduced. And then the water-jet moving mechanism for a pool cleaning robot is proposed to improve energy efficiency and mechanical design advantage, which is one of the strong candidates for wireless pool cleaning robots. Next, the method of cleaning performance evaluation of pool cleaning robots is firstly defined with five key factors, and it was verified by experimental results. If the cleaning performance can be quantitatively defined, we can design optimally a pool cleaning robot, which results in the cost down.

• 한국의상디자인학회지
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• 제21권1호
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• pp.181-189
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• 2019

The washability, redeposition, fill power, and fabric damage of wet cleaning and dry cleaning solvents were measured to identify the optimal type of washing that would increase washability while maintaining dimensional stability. The soiled fabric is a polyester cotton blend and the types of soil were wine, blood, make-up and sebum with carbon black. Petroleum and silicone solvents were used in dry cleaning. Results from this study are as follows. First, detergency is significantly influenced by the type of washing and type of soil. Wet cleaning is superior to dry cleaning. Wet cleaning shows a strong washing performance against hydrophilic soils, whereas, dry cleaning is stronger against hydrophobic soils. Second, redeposition is significantly affected by the type of washing, fabrics, and soils. Redeposition occurred little on cotton during wet cleaning, but showed a high rate for nylon. However, when the two types of fabric were dry cleaned, redeposition occurred on both types. Third, the fill power of duck-down is very affected by the type of washing. Resilience is the best in wet cleaning; and in dry cleaning, petroleum solvents showed a higher resilience when as compared to silicone solvents. Last, the level of fabric damage to cotton fabrics is highly influenced by the type of washing. Wet cleaning damages cotton fabrics significantly more than dry cleaning. For dry cleaning, petroleum solvents damage these fabrics slightly more than silicone solvents. In conclusion, the type of soil must initially be identified to determine the optimal type of washing. Special caution is required when textiles with particulate soil and nylon are washed. When considering the resilience of duck-down clothing, wet cleaning is more appropriate than dry cleaning. Dry cleaning, especially when using silicone-based solvents, is more suitable than wet cleaning for maintaining the shape of clothing.

• Tribology and Lubricants
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• 제31권6호
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• pp.239-244
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• 2015

Chemical mechanical polishing (CMP) is one of the most important processes for enabling sub-14 nm semiconductor manufacturing. Moreover, post-CMP defect control is a key process parameter for the purpose of yield enhancement and device reliability. Due to the complexity of device with sub-14 nm node structure, CMP-induced defects need to be fixed in the CMP in-situ cleaning module instead of during post ex-situ wet cleaning. Therefore, post-CMP in-situ cleaning optimization and cleaning efficiency improvement play a pivotal role in post-CMP defect control. CMP in-situ cleaning module normally consists of megasonic and brush scrubber processes. And there has been an increasing effort for the optimization of cleaning chemistry and brush scrubber cleaning in the CMP cleaning module. Although there have been many studies conducted on improving particle removal efficiency by brush cleaning, these studies do not consider the effects of brush contamination. Depending on the process condition and brush condition, brush cross contamination effects significantly influence post-CMP cleaning defects. This study investigates brush cross contamination effects in the CMP in-situ cleaning module by conducting experiments using 300mm tetraethyl orthosilicate (TEOS) blanket wafers. This study also explores brush pre-treatment in the CMP tool and proposes recipe effects, and critical process parameters for optimized CMP in-situ cleaning process through experimental results.

• 대한기계학회논문집A
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• 제33권10호
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• pp.1023-1028
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• 2009

Cleaning is required following CMP (chemical mechanical planarization) to remove particles. The minimization of particle residue is required with each successive technology generation, and the cleaning of wafers becomes more complicated. In copper damascene process for interconnection structure, it utilizes 2-step CMP consists of Cu and barrier CMP. Such a 2-steps CMP process leaves a lot of abrasive particles on the wafer surface, cleaning is required to remove abrasive particles. In this study, the chemical mechanical cleaning(CMC) is performed various conditions as a cleaning process. The CMC process combined mechanical cleaning by friction between a wafer and a pad and chemical cleaning by CMC solution consists of tetramethyl ammonium hydroxide (TMAH) / benzotriazole (BTA). This paper studies the removal of abrasive on the Cu wafer and the cleaning efficiency of CMC process.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2000년도 춘계학술대회 논문집
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• pp.743-746
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• 2000

The removal of contaminants of silicon wafers has been investigated by various methods. Laser cleaning is the new dry cleaning technique to replace wafer wet cleaning in the near future. A dry laser cleaning uses inert gas jet to remove contaminant particles lifted off by the action of a KrF excimer laser. A laser cleaning model is developed to simulate the cleaning process and analyze the influence of contaminant particles and experimental parameters on laser cleaning efficiency. The model demonstrates that various types of submicrometer-sized particles from the front sides of silicon wafer can be efficiently removed by laser cleaning. The laser cleaning is explained by a particle adhesion model. including van der Waals forces and hydrogen bonding, and a particle removal model involving rapid thermal expansion of the substrate due to the thermoelastic effect. In addition, the experiment of wafer laser cleaning using KrF excimer laser was conducted to remove various contaminant particles.

• 전기학회논문지
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• 제61권1호
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• pp.94-98
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• 2012

The behavior of ozone micro bubble cleaning system was investigated to evaluate the solution as a new method of solar cell wafer cleaning in comparison with former conventional RCA cleaning. We have developed the ozone dissolution system in the ozonated water for more efficient cleaning conditions. The optimized cleaning conditions for solar cell wafer process were 10 ppm of ozone concentration and 12 minutes in cleaning periods, respectively. We have confirmed the cleaning reliability and cell efficiencies after ozone micro bubble cleaning. Using this new cleaning technology, it was possible to obtain higher efficiency, higher productivity, and fast tact time for applying cleaning in the fields on bare ingot wafer, LED wafers as well as the solar cell wafer.