• Transactions of the Korean Society for Noise and Vibration Engineering
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• v.19 no.6
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• pp.614-619
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• 2009

The STW(servo track writing) system which is the process of writing servo signals on disks before assembling in drives uses the spindle motor-chuck mechanism to realize low cost because the spindle motor-chuck mechanism has merit which can simultaneously write multi-disk by piling up disks in hub. Therefore, when the spindle motor-chuck mechanism of horizontal type operates in high rotation speed it is necessary to reduce the effect of RRO(repeatable run-out) and NRRO(non-repeatable run-out) to achieve the high precision accuracy of nano-meter level during the STW process. In this paper, we analyzed that the slip in assembly surfaces can be caused by the mechanical tolerance and clamping force in hub-chuck mechanism and can affect NRRO performance. We designed springs for centering and clamping considering centrifugal force by the rotation speed and assembly condition. The experimental result showed NRRO performance improves about 30 % than case of weak clamping force. The result shows that the optimal design of the spindle motor-chuck mechanism can effectively reduce the effect of NRRO and RRO in STW process.

• Journal of the Semiconductor & Display Technology
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• v.8 no.1
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• pp.1-5
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• 2009

Typically, single-wafer wet etching is done by dispensing chemical onto the front and back side of spin wafer. The wafer is fixed by a number of chuck pins, which obstruct the chemical flow and would result in the incomplete removal of the remaining film, which can become a source of contamination in the next process. In this paper, we introduce a novel design of wafer chuck, in which chuck pins are groupped into two and each group of pins fixes the substrate alternatively. Two groups of chuck pins fix the high-speed spin substrate with non contact method using a magnetic material. The actual process has been executed to observe the effectiveness of this new wafer chuck. It was found that the new wafer chuck performed better than the conventional wafer chuck for removing the remaining film from the bevel and edge side of substrate.

• Tribology and Lubricants
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• v.24 no.6
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• pp.326-331
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• 2008

The contact surfaces between mold and target should be in parallel for a proper imprinting process. However, large size of contacting area makes it difficult for both mating surfaces (mold and target planes) to be in all uniform contact with the expected precision level in terms of thickness and position. This is caused by the waviness of mold and target although it is very small relative to the area scale. The gripping force for both mold and target by the vacuum chuck is other major effect to interrupt the uniform contact, which must be avoided in imprinting mechanism. In this study, the cause of non-conformal contact mechanism between mold and target is investigated with the consideration of deformation due to the vacuum gripping for the size $470{\times}370\;mm^2$ LCD panel.

• Proceedings of the Korean Society Of Semiconductor Equipment Technology
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• 2006.05a
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• pp.269-272
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• 2006

Surface contacts between mold and target should be in parallel for the imprinting mechanism. However, the size of contacting area makes it difficult for both mating surfaces to be in all contact because of precision level of the imprinting machine and the waviness of mold and target. The gripping force for both mold and target with the vacuum chuck is also major effect to interrupt the full contact, which must be avoided in imprinting mechanism. In this study, the preliminary study for the causes of non-uniformity of contacting surfaces such as mold and target is performed with $470{\times}370mm^2$ LCD panel size.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.30 no.10 s.253
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• pp.957-965
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• 2006

A high-performance hot chuck is designed as a heating device for an ultra-precision flip-chip bonder with infrared alignment system. Analysis of design requirements for thermal performance leads to a radiative heating mechanism employing two halogen lamps as heating source. The heating tool is made of silicon carbide characterized by high thermal diffusivity and small thermal expansion coefficient. Experimental tests are performed to assess heat-up performance and temperature uniformity of the heating tool. It is revealed that the initial design of hot chuck results in a good heat-up speed but there exist a couple of troubles associated with control and integrity of the device. As a means to resolve the raised issues, a revised version of heating tool is proposed, which consists of a working plate made of silicon carbide and a supporting structure made of stainless steel. The advantages of this two-body heating tool are discussed and the improved features are verified experimentally.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.15 no.1
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• pp.10-15
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• 2005

Effects of CH₄/H₂ flow rate ratio, chuck bias and microwave power on the structural properties and particle densities of diamond thin films deposited on Ti substrates in microwave plasma CVD were examined. High quality diamond thin films were deposited on Ti substrates in 2∼3 CH₄ Vol.% conditions due to the preferential formation of sp³-bonus ana selective removal of sp²-bonus in the CH₄/H₂ mixtures, and the mechanism for the formation of diamond particles on Ti was analysed. Diamond particle density increased with increasing negative chuck bias to Ti substrate due to bias-enhanced nucleation of diamond and the threshold voltage was found at ∼-50 V. With increasing microwave power the evolution from micro-crystalline graphite layer to diamond layer was observed.

• Proceedings of the Korean Information Science Society Conference
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• 2007.06a
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• pp.240-241
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• 2007

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2004.05a
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• pp.219-219
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• 2004

지금까지 식품, 약품 및 음료 산업 등에서 내용물을 충전 후 밀봉하기 위한 방법이 다양하게 개발되어 사용되고 있으며, 특히 뚜껑을 체결하는 인라인 캐핑머신(In-line capping machine)은 포장 공정에 필수적인 장치이다. 이와 같은 장치의 설계 시 고려되어야 할 사항으로서 작업 공정이 연속적인데 있다. 또한, 어느 한 제품을 용기에 채운 후 완전한 상품으로 조립하기까지, 캐핑머신의 신뢰성은 공정의 연속성과 생산성을 좌우하기 때문에 매우 중요한 요소이다.(중략)

• Journal of KIISE:Computing Practices and Letters
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• v.14 no.8
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• pp.808-812
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• 2008

In recent years, the software vulnerability becomes an important problem to the safety in operating system kernel. Many organizations endeavor to publish patches soon after discovery of vulnerability. In spite of the effort, end-system administrators hesitate to apply the patches to their system. The reasons of hesitation are the reboot disruption and the distrust of patches. To solve this problem we propose a dynamic update system for non-updatable kernel, named DUNK. The DUNK provides: 1) a dynamic update mechanism at function-level granularity to overcome the reboot disruption and 2) a safety verification mechanism to overcome the distrust problem, named MAFIA. In this paper, we describe the design of DUNK and detailed algorithm of MAFIA.

• Proceedings of the Korean Information Science Society Conference
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• 2008.06a
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• pp.343-344
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• 2008

최근 시스템의 복잡도가 증자함에 따라 보안 취약점 문제가 더욱 많이 발생하고 있다. 이를 해결하기 위해 보안 패치가 배포되고 있지만, 시스템 서비스의 중단이 필요하고 패치 자체의 안정성이 검증되지 못해 패치의 적용이 늦어지는 문제가 발생한다. 우리는 이러한 문제를 해결하기 위해 업데이트성이 없는 커널을 위한 함수 단위 동적 업데이트 시스템인 DUNK를 설계 하였다. DUNK는 서비스 중단 없는 업데이트를 가능케 하고, 보안 기법인 MAFIA를 이용해 안전한 업데이트를 수행한다. MAFIA는 바이너리 패치 코드의 접근 행위를 분석함으로써 패치된 함수가 기존 함수의 접근 권한을 상속받도록 하고, 이를 검증하는 기술을 제공한다. 본 논문에서는 DUNK의 설계와 MAFIA의 알고리즘 및 수행에 대해 기술한다.