• 전기전자학회논문지
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• 제7권2호
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• pp.245-252
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• 2003

디지털 보정 기능을 갖는 CMOS 압력 센서의 인터페이스 회로를 설계하였다. 인터페이스 회로는 아날로그 부분과 디지털 부분으로 구성되어 있다. 아날로그 부분은 센서로부터 발생한 약한 신호를 증폭시키는 역할을 담당하고 디지털 부분은 온도 보상 및 오프셋 보정 기능을 담당하며 센서 칩과 보정을 조정하는 마이크로컨트롤러와의 통신을 담당한다. 디지털 부분은 I2C 직렬 인터페이스, 메모리, 트리밍 레지스터 및 제어기로 구성된다. I2C 직렬 인터페이스는 IO 핀 수 및 실리콘 면적 면에서 실리콘 마이크로 센서의 요구에 맞게 최적화 되었다. 이 설계의 주요 부분은 최적화된 I2C 프로토콜을 구현하는 제어 회로를 설계하는 것이다. 설계된 칩은 IDEC의 MPW를 통하여 제작되었다. 칩의 테스트를 위하여 테스트 보드를 제작하였으며 테스트 결과 예상한대로 디지털 보정기능이 잘 수행됨을 확인하였다.

• Journal of the Korean Wood Science and Technology
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• 제27권4호
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• pp.57-64
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• 1999

This research was carried out to investigate the effects of density, resin and particle types on the physical and mechanical properties of the composites made from various wood particles mixed with coating paper. The experiment was designed to apply with three particles (flake, chip, and fiber) and three resin types (urea, phenol and PMDI resin). The mixed ratio of coating paper to wood particle was fixed on 50 to 50% in each board making. And also it was designed to apply for four density levels (0.6, 0.7, 0.8 and 0.9 g/$cm^3$) and four mixed formulations of coating paper to wood particle (10:90, 20:80, 30:70, and 40:60 %) to analyze clearly the effects of PMDI resin. Coating paper-wood particle composites have acceptable bending strength (MOR, MOE) though the mixed ratio of coating paper was increased, but have low internal bond strength and poor dimensional stability (WA, TS, LE). Composites with high density had higher mechanical properties but showed lower physical properties than composites with low density. In conclusion, at least up to 20% mixed ratios, coating paper-wood particle composites have acceptable physical and mechanical properties, and PMDI resin has possibility for coating paper-wood particle composite manufacture.

• Journal of Communications and Networks
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• 제13권1호
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• pp.70-76
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• 2011

This paper presents the unified user equipment (UE) baseband modulation and demodulation (modem) hardware platform architecture to support multiple radio access technologies. In particular, this platform selectively supports two systems; one is HEDGE system, which is the combination of third generation partnership project (3GPP) Release 7 high speed packet access evolution (HSPA+) and global system for mobile communication (GSM)/general packet radio service (GPRS)/enhanced data rates for GSM evolution (EDGE), while the other is LEDGE system, which is the combination of 3GPP Release 8 long term evolution (LTE) and GSM/GPRS/EDGE. This is done by applying the flexible pin multiplexing scheme to a hardwired pin mapping process. On the other hand, to provide stable connection, high portability, and high debugging ability, the stacking structure is employed. Here, a layered board architecture grouped by functional classifications is applied instead of the conventional one flatten board. Based on this proposed configuration, we provide a framework for the verification step in wireless cellular communications. Also, modem function/scenario test and inter-operability test with various base station equipments are verified by system requirements and scenarios.

• 정보처리학회논문지C
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• 제19C권3호
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• pp.179-184
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• 2012

NIST(National Institute of Standards and Technology)는 SHA-2의 대체 알고리즘 부재로 SHA-3 개발 프로젝트를 진행 되고 있는 중 이다. 2010년 최종 라운드 후보 5개가 발표되었고, SHA-3 최종 라운드 5개의 후보에 대한 부채널 공격 시나리오가 제안되었다. 본 논문에서는 SHA-3 최종 라운드 후보 중 Skein에 대한 부채널 공격 시나리오를 32비트 레지스터를 사용하는 ARM Chip을 이용하여, 8 비트의 블록단위로 Divide and Conquer 분석이 가능함을 실험을 통해 증명한다. 9700개의 파형으로 128비트 키의 모든 비트를 찾을 수 있음을 실험으로 검증하였다.

• Tribology and Lubricants
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• 제21권2호
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• pp.71-76
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• 2005

This paper compares of mechanical tensile properties of 6 kinds of copper foil. The beam lead made with copper foil. Different from other package type such as plastic package, Chip Size Package has a reliability problem in beam lead rather than solder joint in board level. A new tensile loading system was developed using voice-coil actuator. The new tensile loading system has a load cell with maximum capacity of 20 N and a non-contact position measuring system based on the principle of capacitance micrometry with 0.1nm resolution for displacement measurement. Strain was calculated from the measured displacement using FE analysis. The comparison of mechanical properties helps designer of package to choose copper for ensuring reliability of beam lead in early stage of semiconductor development.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2001년도 하계종합학술대회 논문집(1)
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• pp.155-158
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• 2001

A 640Gb/s high-speed ATM switching system that is based on the technologies of advanced MCM, 0.25um CMOS and optical WDM interconnection is fabricated for future N-ISDN services. A 40 layer, 160mm$\times$114mm ceramic MCM realizes the basic ATM switch module with 80Gbps throughput. The basic unit ATM switch module with 80Gb/s throughput. The basic unit ATM switch MCM consists of in 8 chip advanced 0.25um CMOS VLSI and 32 chip I/O Bipolar VLSIs. The MCM employs an 40 layer, very thin layer ceramic MCM and a uniquely structured closed loop type liquid colling system is adopted to cope with the MCM's high-power dissipation of 230w. The MCM is Mounted on a 32cm$\times$50cm mother board. A three stage ATM switch is realized by optical WDM interconnection between the high-performance MCM.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2015년도 제46회 하계학술대회
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• pp.1285-1285
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• 2015

현재 전력난에 의해 에너지 절감이라는 말은 가정 및 산업 현장 곳곳에서 들을 수 있다. 에너지 절감 대책 중 하나가 몇 년전 정부에서 발표한 백열등 수입 및 유통금지가 있다. 그 효과로 LED 산업이 각광 받게 되었다. 다양한 LED 산업 및 기술에서도 신뢰성 및 성능 분야는 항상 진화하고 많은 기업들이 집중하고 있다. LED에서 중요한 요소인 방열성능을 개선시키기 위해 많은 연구를 행하고 있다. 그리고 광원 개발분야에서도, 반도체 광원의 LED PKG의 다량 실장으로 고출력을 행하는 것 보다는 기판위에 Blue Chip을 실장하여 제작하는 고출력 광원의 기술로 집중되고 있다. 이 논문에서는 고출력 광원인 COB(Chip On Board) LED의 방열성능 개선을 다루었다. 기판의 구조 변형으로 방열특성 개선 대안을 제시하였다. Via hole과 Cavity를 이용한 구조를 제안하였다. 그에 대한 해석 방법으로는, 구조적인 해석과 수치적인 해석을 활용하였다. 그 결과로는 약 13~40%의 방열성능 개선을 나타내었다.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2004년도 학술대회 논문집 정보 및 제어부문
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• pp.388-390
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• 2004

In this paper, we performed the implementation of image transmission server system using embedded system that is for the specified object and easy to install at any places and move to wherever. Since the embedded system has lower capability than PC, we have to reduce the quantity of calculation and transmission. The image compression like JPEG, needs that the server calculates for making compressed image, makes the server carry the load. So we compresses the image at the server and transmit the codes to the clients connected, then the received codes from server are decoded and displayed at the clients. In this process to make the image compression and transmission effectively, we decrease the procedure as simple as possible to transmit the data in almost real-time. We used the Redhat linux 9.0 OS at the host PC and the target board based on embedded linux. The image sequences are obtained from the camera attached to the FPGA board with ALTERA chip. For effectiveness and avoiding some constraints, we made the device driver. Generally the image transmission server is PC, but using the embedded system as a server makes the server portable and cheaper than the system based on PC.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2002년도 춘계 기술심포지움 논문집
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• pp.138-141
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• 2002

There are continuous efforts in the electronics industry to a reduced electronic package size. Reducing the size of electronic packages can be achieved by a variety of means, and for ball grid array(BGA) packages an effective method is to decrease the pitch between the individual balls. Chip scale package(CSP) and BGA are now one of the major package types. However, a reduced package size has the negative effect of reducing board-level reliability. The reliability concern is for the different thermal expansion rates of the two-substrate materials and how that coefficient CTE mismatch creates added stress to the BGA solder joint when thermal cycled. The point of thermal fatigue in a solder joint is an important factor of BGA packages and knowing at how many thermal cycles can be ran before failure in the solder BGA joint is a must for designing a reliable BGA package. Reliability of the package was one of main issues and underfill was required to improve board-level reliability. By filling between die and substrate, the underfill could enhance the reliability of the device. The effect of underfill on various thermomechanical reliability issues in $\mu$BGA packages is studied in this paper.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2003년도 학술회의 논문집 정보 및 제어부문 B
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• pp.563-566
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• 2003

We have designed the power control unit which belongs to the power cabinet and controls the power supplied to Control Rod Drive Mechanism(CRDM) as a digital system based on Digital Signal Processor(DSP). The power control unit dualized as the form of Master/Slave has had its increased reality. The Central Process Unit(CPU) board of a power control unit possesses two Digital Signal Processors(DSPs) of the control DSP for performing the tasks of power control and system monitoring and the communication of the Control DSP and the Communication DSP. To accomplish the functions requested in the power control unit effectively, we have installed Field Programmable Gate Arrays(FPGAS) on the CPU board and have FPGAs perform the memory mapping, the generation of each chip selection signal, the giving and receiving of the signals between the power controllers dualized, the fault detection and the generation of the firing signals.