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http://dx.doi.org/10.9725/kstle.2005.21.2.071

Evaluation of Mechanical Properties and FEM Analysis on Thin Foils of Copper  

Kim Yun-Jae (Korea University)
An Joong-Hyok (Department of Mechanical Engineering, Korea University)
Park Jun-Hyub (Department of Mechatronics, Tongmyong University of Information Technology)
Kim Sang-Joo (Department of Mechanical and Information Engineering, University of Seoul)
Kim Young-Jin (Sungkyunkwan University)
Lee Young-Ze (Sungkyunkwan University)
Publication Information
Tribology and Lubricants / v.21, no.2, 2005 , pp. 71-76 More about this Journal
Abstract
This paper compares of mechanical tensile properties of 6 kinds of copper foil. The beam lead made with copper foil. Different from other package type such as plastic package, Chip Size Package has a reliability problem in beam lead rather than solder joint in board level. A new tensile loading system was developed using voice-coil actuator. The new tensile loading system has a load cell with maximum capacity of 20 N and a non-contact position measuring system based on the principle of capacitance micrometry with 0.1nm resolution for displacement measurement. Strain was calculated from the measured displacement using FE analysis. The comparison of mechanical properties helps designer of package to choose copper for ensuring reliability of beam lead in early stage of semiconductor development.
Keywords
thin film; mechanical property; chip size package;
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