Evaluation of Mechanical Properties and FEM Analysis on Thin Foils of Copper |
Kim Yun-Jae
(Korea University)
An Joong-Hyok (Department of Mechanical Engineering, Korea University) Park Jun-Hyub (Department of Mechatronics, Tongmyong University of Information Technology) Kim Sang-Joo (Department of Mechanical and Information Engineering, University of Seoul) Kim Young-Jin (Sungkyunkwan University) Lee Young-Ze (Sungkyunkwan University) |
1 | Lee, Y. J. and Eyre, M. W., 'Effects of Lead Bonding Process on Reliability of Chip Scale Package,' Proceedings of Electronic Components &Technology Conference, 50th, pp 1392-1397, 2000 |
2 | Ghaffarian, R. and Kim, N. P., 'Reliability and Failure Analyses of Thermally Cycled Ball Grid Array Assemblies,' Components and Packaging Technologies, IEEE Transactions, Vol. 23, No3, pp 528-534, 2000 DOI ScienceOn |
3 | Tu, P. L., Chan, Y. C., Hung, K. C. and Lai, J. K. L., 'Comparative Study of Micro-BGA Reliability Bending Stress,' Advanced Packaging, IEEE Transactions, Vol. 23, No 4, pp 750-756, 2000 DOI ScienceOn |
4 | Mertol, A., 'Application of the Taguchi method to chip scale package (CSP) design,' Advanced Packaging, IEEE Transactions, Vol. 23, No 2, pp 266-276, 2000 DOI ScienceOn |
5 | Fu, U. Y., Ume, I. C., and McDowell, D. L., 'Thermal Stress and Fatigue Analysis of Plated - Through Holes Using an Internal State Variable Constitutive Model,' Finite Elements in Analysis and Design, Vol. 30, pp 1-17, 1998 DOI ScienceOn |
6 | Kim, Yun-Jae, Huh, Nam-Su, Kim, Young-Jin, Yang, Jun-Seok, 'Engineering Leak-Before-Break Analyses of Pressurized Piping: Part -Crack Opening Displacement,' JSME International Journal, Series A, Vol. 47, No.4, pp 591-599, 2004 DOI ScienceOn |
7 | Xie, D. J., Chan, Van C., Lai, J. K. L., and Hui, I. K., 'Fatigue Life Estimation of Surface Mount Solder Joints,' IEEE Transactions on Components, Packaging, and manufacturing Technology - Part B, Vol. 19, No. 3, pp 669-678, 1996 DOI ScienceOn |
8 | Park, Jun-Hyub, Lee, Hyouk, Moon, Ho Jeong and Oh, Se Yong, 'An Experimental Study of Fatigue Strength Characteristics of Beam Lead Material in MicroBGA Package,' Proceedings of Electronics Manufacturing Technology Symposium, Twenty-Fourth IEEE/CPMT, pp 222, 1999 |
9 | Wang, Z. P., et al, 'Board Level Reliability of Chip Scale Package,' Proceedings of IMAPS98, pp 513-518, 1998 |
10 | Qiao, Q., Gordon, M. H., Schmidt, W. F., Li, L., Ang, S. S. and Huang, B., 'Development of a WaferLevel Burn-in Test Socket for Fine-Pitch BGA Inter-connect,' Proceedings of Electronic Components & Technology Conference, 50th, pp 1147-1151, 2000 |
11 | Yu, Q. and Shiratori, M., 'Fatigue-Strength Prediction of Microelectronics Solder Joints Under Thermal Cyclic Loading,' IEEE Transactions on Components, Packaging, and Manufacturing Technology - Part A, Vol. 20, No.3, pp 266-273, 1997 |
12 | Lee, Soon-Bok and Ham, Suk-Jin, 'Accelerated Testings and Reliability Assessments of Soler Joints in Electronics Packaging,' Proceedings of SEMICON Korea Technical Symposium, 99, pp 205-212, 1999 |
13 | Gurumurthy, C. K., Jiao, J., Norris, L. G., Hui, C. Y., and Krammer, E. J., 'A Thermo-Mechnical Approach for Fatigue Testing of Polymer Bimaterial Interfaces,' Journal of Electronic Packaging, Transactions of the ASME, Vol. 120, pp 372-378, 1998 DOI ScienceOn |