• Proceedings of the IEEK Conference
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• 1998.10a
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• pp.1069-1072
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• 1998

Recently the development of design and automation technology and manufacturing method, has reduced the cost of chip, but it becomes more difficult to test IC chip because test technique doesn't keep up with these techniques. In case of IC testing, obtaining test vectors to be able to detect good chip or bad one is very important, but according to increasing complexity, it is very complex and difficult. Another problem is that during testing, there could be capability of physical and electrical damage on chip. Also there is difficulty in synchronization between CUT (circuit under test) and Test equipment〔1〕. Because of these difficulties, built in self test has been proposed. Not only obtaining test vectors but also reducing test time becomes hot issues nowadays. This paper presents a new test BIST(built in self test) method. Proposed BIST implementation reduces test time and obtains high fault coverage. By searching internal nodes in which are inserted test_point_cells〔2〕and allocating TPG(test pattern generation) stages, test length becomes much shorter.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.16 no.2
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• pp.30-36
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• 2007

In order to estimate the maximum undeformed chip thickness in grinding operation, it is necessary to obtain the successive cutting point spacing. In the past it was obtained by experiments. In this paper, the average successive cutting point spacing has been obtained using the given grinding input conditions and it is possible to estimate the maximum undeformed chip thickness without using any experimentally obtained data. The validity of the proposed analysis has been verified based on two sets of grinding scratch tests using WA and CBN grinding wheels.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2001.10a
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• pp.155-160
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• 2001

In the use of glass fiber reinforced plastics(GFRP) it is often necessary to cut the components, but the cutting of GFRP is often made difficult by the delamination of the compositions and short tool life. Experimental investigation was conducted to evaluate the chip formation of the glass fiber reinforced plastics during orthogonal cutting. The chip formation process, cutting force, and thrust force were studied. The chip formation processes were studied through the use of quick-stop device. Chip-tool contact areas were obtained with the use of the quick-stop device, and observed using optical microscopy after polishing. Cutting force and thrust force were measured through the use of the tool dynamometer.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.10 no.1
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• pp.30-35
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• 2001

Nickel-based heat resisting alloys are commonly used for high temperature application such as in aircraft engines and gas turbines. In this paper, the machinability of Nickel-based heat resisting alloys was investigated with respect to the wear and the chip formation by tool type and cutting condition. Relationship between three types of tool and chip formation was experimentally investigated. Among the three types of tool tested, coated tools(CVD, PVD) ara available for the difficult-to-cut-materials such as Nickel-based heat resisting alloys and etc.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2003.04a
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• pp.454-459
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• 2003

The paper will present chip formation mechanism and surface integrity generation mechanism based on the systematical experimental tests. Some basic factors such as the end milling cutter tooth number, cutting forces, cutting temperature, cutting vibration, the chip status, the surface roughness, the hardness distribution and the metallographic texture of the machined surface layer are involved. the chip formation mechanism is typical thermal plastic shear localization at high cutting speed with less number og shear ribbons and bigger shear angle than at low speed, which means lack of chip deformation. The high cutting speed with much more cutting teeth will be beneficial to the reduction of cutting forces, enlarge machining stability region, depression of temperature increment, auti-fatigability as well as surface roughness. The burrs always exists both at low cutting speed and at high cutting speed. So the deburr process should be arranged for milling titanium alloy in any case.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2000.04a
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• pp.264-269
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• 2000

Nickel-based heat resisting alloys are commonly used for high temperature applications such as in aircraft engines and gas turbines. In this paper, the machinability of Nickel-based heat resisting alloy was investigated with respect to the wear and the chip formation by tool type and cutting condition. Relationship between three types of tool and chip formation was experimentally investigated. Among the three types of tool tested, coated tools(CVD, PVD) are available for the difficult-to-cut-materials such as Nickel-based heat resisting alloy and etc..

• Journal of Sensor Science and Technology
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• v.15 no.1
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• pp.7-12
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• 2006

The multi-functional one-chip sensor has been fabricated to reduce output variation under various water environment. There were a temperature sensor, a piezoresistive type pressure sensor, and a electrode type conductivity sensor in the fabricated one-chip sensor. This sensor was measured water depth in the range of $0{\sim}180cm$, temperature in the range of $0{\sim}50^{\circ}C$, and salinity in the range of 0 $0wt%{\sim}5wt%$, respectively. Since the change of water depth in solution environment depends on various factors such as salinity, latitude, temperature, and atmospheric pressure, the water depth sensor is needed to be compensated. We tried to compensate the salinity and temperature dependence for the pressure in water by using lookup-table method.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.16 no.8
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• pp.740-743
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• 2003

A multi-layer ceramic (MLC) chip type band-pass filter (BPF) is presented. The MLC chip BPF has the benefits of low cost and small size. The BPF consists of coulped stripline resonators and coupling capacitors. The BPF is designed to have an attenuation pole at below the passband for a receiver band of IMT-2000 handset. The computer-aided design technology is applied for analysis of the BPF frequency characteristics. The passband and attenuation pole depend on the coupling between resonators and coupling capacitance. The frequency characterics of the passband and attenuation pole are analyzed with the variation of the coupling between resonators and coupling capacitance. An equivanlent circuit and structure of MLC chip BPF are proposed. The frequency characteristics of the BPF is well acceptable for IMT-2000 application.

• Proceedings of the KIEE Conference
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• 2006.07c
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• pp.1319-1321
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• 2006

This research aims to develop the multiple channel electrochemical DNA chip that has the above characteristic and be able to solve the problems. At first, we fabricated a high integration type DNA chip array by lithography technology. It is able to detect a plural genes electrochemically after immobilization of a plural probe DNA and hybridization of non-labeling target DNA on the electrodes simultaneously. It suggested that this DNA chip could recognize the sequence specific genes. It suggested that multichannel electrochemical DNA microarray is useful to develop a portable device for clinical gene diagnostic system.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.04a
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• pp.35-40
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• 2000

MCM technology languished troughout most of the 1990's due to high costs resulting from low yields and issues with known god die. During the last five years of the decade new developments in chip scale packages and high density, build up multi-layer printed wiring boards created new opportunities to design and produce ultra miniaturized modules using conventional surface mount manufacturing capabilities. Focus on the miniaturization of substrate based packages such as ball grid arrays (BGAs) resulted in chip scale packages (CSPs) offering many of the benefits of flip chip along with the handling, testing, manufacturing and reliability capabilities of packaged deviced. New developments in the PWB industry sought to reduce the size, weight, thickness and cost of high density interconnect (HDI) substrates. Shrinking geometries of vias and new constructions significantly increased the interconnect density available for MCM-L applications. This paper describes the most promising CSP and HDI technologies for portable products, high performance computing and dense multi-chip modules.