• Journal of the Microelectronics and Packaging Society
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• v.8 no.4
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• pp.11-15
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• 2001

In this paper, hermetic sealing technology was studied for wafer level packaging of the RF-MEMS devices. With the flip-chip bonding method. this non-conductive B-stage epoxy sealing will be profit to the MEMS device sealing. It will be particularly profit to the RF-MEMS device sealing. B-stage epoxy can be cured by 2-step and hermetic sealing can be obtained. After defining 500 $\mu\textrm{m}$-width seal-lines on the glass cap substrate by screen printing, it was pre-baked at $90^{\circ}C$ for about 30 minutes. It was, then, aligned and bonded with device substrate followed by post-baked at $175^{\circ}C$ for about 30 minutes. By using this 2-step baking characteristic, the width and the height of the seal-line could be maintained during the sealing process. The height of the seal-line was controlled within $\pm$0.6 $\mu\textrm{m}$ in the 4 inches wafer and the bonding strength was measured to about 20MPa by pull test. The leak rate, that is sealing characteristic of the B-stage epoxy, was about $10^{-7}$ cc/sec from the leak test.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.42 no.6 s.336
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• pp.1-8
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• 2005

In this paper, CMOS A/D converter with 6bit 2GSPS Nyquist input at 1.8V is designed. In order to obtain the resolution of 6bit and the character of high-speed operation, we present an Interpolation type architecture. In order to overcome the problems of high speed operation, a novel One-zero Detecting Encoder, a circuit to reduce the Reference Fluctuation, an Averaging Resistor and a Track & Hold, a novel Buffered Reference for the improved SNR are proposed. The proposed ADC is based on 0.18um 1-poly 3-metal N-well CMOS technology, and it consumes 145mW at 1.8V power supply and occupies chip area of 977um $\times$ 1040um. Experimental result show that SNDR is 36.25 dB when sampling frequency is 2GHz and INL/DNL is $\pm$0.5LSB at static performance.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.47 no.3
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• pp.28-34
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• 2010

In this paper, the transceiver for RFID reader using 13.56MHz as a carrier frequency and meeting International Standard ISO 14443 type A, 14443 type B and 15693 is presented. The receiver is composed of envelope detector, VGA(Variable Gain Amplifier), filter, comparator to recovery the received signal. The proposed automatic reference voltage generator, positive peak detector, negative peak detector, and data slicer circuit can adjust the decision level of reference voltage over the received signal amplitudes. The transmitter is designed to drive high voltage and current to meet the 15693 specification. By using inductor loading circuit which can swing more than power supply and drive large current even under low impedance condition, it can control modulation rate from 30 percent to 5 percent, 100 perccnt and drive the output currents from 5 mA to 240 mA depending on standards. The 13.56 MHZ RFID reader is implemented in $0.18\;{\mu}m$ CM08 technology at 3.3V single supply. The chip area excluding pads is $1.5mm\;{\times}\;1.5mm$.

• Journal of the Institute of Electronics and Information Engineers
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• v.50 no.9
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• pp.68-73
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• 2013

In this paper, we proposed a readout circuit of pulse waveform and rate for a U-health system to monitor health condition. For long-time operation without replacing or charging a battery, either pulse waveform or pulse rate is selected as the output data of the proposed readout circuit according to health condition of a user. The proposed readout circuit consists of a simple digital logic discriminator and a dual-mode ADC which operates in the ADC mode or in the count mode. Firstly, the readout circuit counts pulse rate for 4 seconds in the count mode using the dual-mode ADC. Health condition is examined after the counted pulse rate is accumulated for 1 minute in the discriminator. If the pulse rate is out of the preset normal range, the dual-mode ADC operates in the ADC mode where pulse waveform is converted into 10-bit digital data with the sampling frequency of 1 kHz. These data are stored in a buffer and transmitted by 620 kbps to an external monitor through a RF transmitter. The data transmission period of the RF transmitter depends on the operation mode. It is generally 1 minute in the normal situation or 1 ms in the emergency situation. The proposed readout circuit was designed with $0.11{\mu}m$ process technology. The chip area is $460{\times}800{\mu}m^2$. According to measurement, the power consumption is $161.8{\mu}W$ in the count mode and $507.3{\mu}W$ in the ADC mode with the operating voltage of 1 V.

• Journal of the Korea Society of Computer and Information
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• v.17 no.4
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• pp.1-9
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• 2012

As we are turnning into the aged society, accidents by falling down are increasing in the aged people's group. In this paper, we design the system with the 3-Axis acceleration sensor which is composed by a single chip. The body activity signal is measured with the signal detector and RF communicator in this proposed system and the and falling by the entering signal pattern analysis with 3-Axis acceleration sensor. For the RF communication, we are using nRF24L01p and 8bits ATmega uC for the processor. The error of energy expenditure estimation between motor driven treadmill and proposed a body activity module was 7.8% respectively. Human activities and falling is monitored according to analyze and judge the critical value of the Signal Vector. as falled down if they don't turn off the alarm after specific period and the aged person's after falling down activities are their position and more.

• The Journal of the Korea Contents Association
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• v.6 no.9
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• pp.98-107
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• 2006

By improving performance of mobile machine(3D engine, 3D accelerator chip set, etc) and developing wireless network technology, a demand for actual contents of users is being increased rapidly. But, there are some difficulties yet for the speedy development of actual contents because of the limitation of development resources that is dependent on each mobile device's different performance. In general, much of the animated character-creation work for mobile environment is still done manually by experienced animator with the method of key frame processing. However, it needs a lot of time and more costs for creating motion. Additionally, it is possible to cause a distortion of motion. In this paper, I solved the difficulties by using a optical motion capture system, it was able to acquire accurate motion data more easily and quickly, and then it was possible to make 3D dance contents efficiently. Also, I showed techniques of key reduction and controlling frame number for using huge amounts of motion capture data in mobile environment which requires less resources. In making 3D dance contents, using an optical motion capture system was verified that it was more efficient to make and use actual-reality contents by creating actual character motion and by decreasing processing time than existing method.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.43 no.6 s.348
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• pp.53-61
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• 2006

In high speed flash type or pipelining type A/D Converter, the faster sampling frequency is, the more the effect of DC reference fluctuation is increased by clock feed-through and kick-back. When we measure A/D Converter, further, external noise increases reference voltage fluctuation. Thus reference fluctuation reduction circuit must be needed in high speed A/D converter. Conventional circuit simply uses capacitor but layout area is large and it's not efficient. In this paper, a reference fluctuation reduction circuit using transmission gate is proposed. In order to verify the proposed technique, we designed and manufactured 6bit 2GSPS CMOS A/D converter. The A/D converter is based on 0.18um 1-poly 5-metal N-well CMOS technology, and it consumes 145mW at 1.8V power supply. It occupies chip area of $977um\times1040um$. Experimental result shows that SNDR is 36.25 dB and INL/DNL ${\pm}0.5LSB$ when sampling frequency is 2GHz.

• Journal of Intelligence and Information Systems
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• v.20 no.2
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• pp.163-178
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• 2014

Following research proposes "Virtualization of Smart Cards (ViSCa)" which is a security system that aims to provide a multi-device platform for the deployment of services that require a strong security protocol, both for the access & authentication and execution of its applications and focuses on analyzing Virtualization of Smart Cards (ViSCa) platform-based mobile payment service by comparing with other similar cases. At the present day, the appearance of new ICT, the diffusion of new user devices (such as smartphones, tablet PC, and so on) and the growth of internet penetration rate are creating many world-shaking services yet in the most of these applications' private information has to be shared, which means that security breaches and illegal access to that information are real threats that have to be solved. Also mobile payment service is, one of the innovative services, has same issues which are real threats for users because mobile payment service sometimes requires user identification, an authentication procedure and confidential data sharing. Thus, an extra layer of security is needed in their communication and execution protocols. The Virtualization of Smart Cards (ViSCa), concept is a holistic approach and centralized management for a security system that pursues to provide a ubiquitous multi-device platform for the arrangement of mobile payment services that demand a powerful security protocol, both for the access & authentication and execution of its applications. In this sense, Virtualization of Smart Cards (ViSCa) offers full interoperability and full access from any user device without any loss of security. The concept prevents possible attacks by third parties, guaranteeing the confidentiality of personal data, bank accounts or private financial information. The Virtualization of Smart Cards (ViSCa) concept is split in two different phases: the execution of the user authentication protocol on the user device and the cloud architecture that executes the secure application. Thus, the secure service access is guaranteed at anytime, anywhere and through any device supporting previously required security mechanisms. The security level is improved by using virtualization technology in the cloud. This virtualization technology is used terminal virtualization to virtualize smart card hardware and thrive to manage virtualized smart cards as a whole, through mobile cloud technology in Virtualization of Smart Cards (ViSCa) platform-based mobile payment service. This entire process is referred to as Smart Card as a Service (SCaaS). Virtualization of Smart Cards (ViSCa) platform-based mobile payment service virtualizes smart card, which is used as payment mean, and loads it in to the mobile cloud. Authentication takes place through application and helps log on to mobile cloud and chooses one of virtualized smart card as a payment method. To decide the scope of the research, which is comparing Virtualization of Smart Cards (ViSCa) platform-based mobile payment service with other similar cases, we categorized the prior researches' mobile payment service groups into distinct feature and service type. Both groups store credit card's data in the mobile device and settle the payment process at the offline market. By the location where the electronic financial transaction information (data) is stored, the groups can be categorized into two main service types. First is "App Method" which loads the data in the server connected to the application. Second "Mobile Card Method" stores its data in the Integrated Circuit (IC) chip, which holds financial transaction data, which is inbuilt in the mobile device secure element (SE). Through prior researches on accept factors of mobile payment service and its market environment, we came up with six key factors of comparative analysis which are economic, generality, security, convenience(ease of use), applicability and efficiency. Within the chosen group, we compared and analyzed the selected cases and Virtualization of Smart Cards (ViSCa) platform-based mobile payment service.

• Clean Technology
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• v.29 no.4
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• pp.255-261
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• 2023

Power semiconductors are semiconductors used for power conversion, transformation, distribution, and control. Recently, the global demand for high-voltage power semiconductors is increasing across various industrial fields, and optimization research on high-voltage IGBT components is urgently needed in these industries. For high-voltage IGBT development, setting the resistance value of the wafer and optimizing key unit processes are major variables in the electrical characteristics of the finished chip. Furthermore, the securing process and optimization of the technology to support high breakdown voltage is also important. Etching is a process of transferring the pattern of the mask circuit in the photolithography process to the wafer and removing unnecessary parts at the bottom of the photoresist film. Ion implantation is a process of injecting impurities along with thermal diffusion technology into the wafer substrate during the semiconductor manufacturing process. This process helps achieve a certain conductivity. In this study, dry etching and wet etching were controlled during field ring etching, which is an important process for forming a ring structure that supports the 3.3 kV breakdown voltage of IGBT, in order to analyze four conditions and form a stable body junction depth to secure the breakdown voltage. The field ring ion implantation process was optimized based on the TEG design by dividing it into four conditions. The wet etching 1-step method was advantageous in terms of process and work efficiency, and the ring pattern ion implantation conditions showed a doping concentration of 9.0E13 and an energy of 120 keV. The p-ion implantation conditions were optimized at a doping concentration of 6.5E13 and an energy of 80 keV, and the p+ ion implantation conditions were optimized at a doping concentration of 3.0E15 and an energy of 160 keV.

• Journal of Korean Society of Forest Science
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• v.110 no.2
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• pp.217-232
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• 2021

This study calculated the productivity and cost of extraction and processing of logging residues by cut-to-length (CTL) and whole-tree (WT) harvesting methods. In addition, the comparative analysis of the characteristics of wood chip fuel to examine whether it was suitable for the fuel conditions of the energy facility. In the harvesting and processing system to produce the wood chips of logging residues the system productivity and cost of the CTL harvesting system were 1.6 Gwt/SMH and 89,865 won/Gwt, respectively. The productivity and cost of the WT harvesting system were 2.9 Gwt/SMH and 72,974 won/Gwt, respectively. The WT harvesting productivity increased 1.3times while harvesting cost decreased by 18.7% compared to the CTL harvesting system. The logging residues of wood chips were not suitable for CTL wood chips based on International Organization for Standardization (ISO 17225-4:2021) and South Korea standard (NIFoS, 2020), but the quality (A2, Second class) was improved through screening operation. The WT-unscreened wood chips conformed to NIFoS standard (second class) and did not conform to ISO but were improved through screening operation (Second class). In addition to the energy facility in plant A, all wood chips except CTL-unscreened wood chips were available through drying processing. The WT-unscreened wood chips were the lowest at 99,408 won/Gwt. Plants B, C, and D had higher moisture content than plant A, so WT-unscreened wood chips without drying processing were the lowest at 57,204 won/Gwt. Therefore, the production of logging residues should improve with operation methods that improve the quality of wood chips required for applying the variable biomass and energy facility.