• Journal of the Institute of Electronics Engineers of Korea SD
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• v.41 no.10
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• pp.31-39
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• 2004

This paper illustrates the noise characteristics under chip's core operations according to types of packages and modules for DDR DRAM For analyzing this, the impedance profiles and power noises are analyzed with DRAM chips having commercial TSOP package and commercial FBGA package on TSOP-based DIMM and FBGA-based DIMH In controversy with common concepts, we find that the noise-isolation characteristics of FBGA package are more weak and sensitive on transferred noises than those of the TSOP package. In addition, the simulated results show that the decoupling capacitor locations of modules are more important to control the self and transfer noise characteristics than the lead inductance of the packages. Therefore, satisfying the target spec of the noise suppression and isolation can be achieved through the design of power distribution systems only with considering not only the package types but also the whole module system.

• Smart Structures and Systems
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• v.6 no.5_6
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• pp.661-673
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• 2010

This paper presents recent developments in an extremely compact, wireless impedance sensor node (the WID3, $\underline{W}$ireless $\underline{I}$mpedance $\underline{D}$evice) for use in high-frequency impedance-based structural health monitoring (SHM), sensor diagnostics and validation, and low-frequency (< ~1 kHz) vibration data acquisition. The WID3 is equipped with an impedance chip that can resolve measurements up to 100 kHz, a frequency range ideal for many SHM applications. An integrated set of multiplexers allows the end user to monitor seven piezoelectric sensors from a single sensor node. The WID3 combines on-board processing using a microcontroller, data storage using flash memory, wireless communications capabilities, and a series of internal and external triggering options into a single package to realize a truly comprehensive, self-contained wireless active-sensor node for SHM applications. Furthermore, we recently extended the capability of this device by implementing low-frequency analog-to-digital and digital-to-analog converters so that the same device can measure structural vibration data. The compact sensor node collects relatively low-frequency acceleration measurements to estimate natural frequencies and operational deflection shapes, as well as relatively high-frequency impedance measurements to detect structural damage. Experimental results with application to SHM, sensor diagnostics and low-frequency vibration data acquisition are presented.

• ETRI Journal
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• v.30 no.4
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• pp.597-599
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• 2008

This letter presents the design of a small and low-profile RFID tag antenna in the UHF band that can be mounted on metallic objects. The designed tag antenna, which uses a ceramic material as a substrate, consists of a radiating patch and a microstrip line with two shorting pins for a proximity-coupled feeding structure. Using this structure, impedance matching can be simply obtained between the antenna and tag chip without a matching network. The fractional impedance bandwidth for $S_{11}$ <3 dB and radiation efficiency are about 1.4% and 56% at 911 MHz, respectively. The read range is approximately from 5 m to 6 m when the tag antenna is mounted on a metallic surface.

• Proceedings of the IEEK Conference
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• 2002.06b
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• pp.233-236
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• 2002

This paper has been designed and fabricated C-type micro, high-performance solenoid RF chip inductors with the size of 1.58$\times$0.82r0.94m0. The high frequency characteristics of simulated results obtained by HFSS were compared to those of measured results obtained by RF Impedance/Material Analyzer (HP16193A). Although the simulated inductance values were two times larger than the measured values and there are discrepancies in SRFs between simulated and measured values, it was observed that tile Q-factor values for fabricated inductors could be predicted from the simulated values.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.9 no.5
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• pp.1089-1095
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• 2005

This paper presents a new low-cost Built-In Self-Test (BIST) circuit for 50Hz low noise amplifier (LNA). The BIST circuit is designed for system-on-chip (SoC) transceiver environment. The proposed BIST circuit measures the LNA specifications such as input impedance, voltage gaih, noise figure, and input return loss all in a single SoC environment.

• Journal of Biomedical Engineering Research
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• v.31 no.4
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• pp.292-301
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• 2010

To restore visual sensation of blind patients, we have proposed a fully implantable retinal prosthesis comprising an three dimensionally (3D) stacked retinal chip for transforming optical signal to electrical signal, a flexible cable with stimulus electrode array for stimulating retina cells, and coupling coils for power transmission. The 3D stacked retinal chip is consisted of several LSI chips such as photodetector, signal processing circuit, and stimulus current generator. They are vertically stacked and electrically connected using 3D integration technology. Our retinal prosthesis has a small size and lightweight with high resolution, therefore it could increase the patients` quality of life (QOL). For realizing the fully implantable retinal prosthesis, we developed a retinal prosthesis module comprising a retinal prosthesis chip and a flexible cable with stimulus electrode array for generating optimal stimulus current. In this study, we used a 2D retinal chip as a prototype retinal prosthesis chip. We fabricated the polymide-based flexible cable of $20{\mu}m$ thickness where 16 channels Pt stimulus electrode array was formed in the cable. Pt electrode has an impedance of $9.9k{\Omega}$ at 400Hz frequency. The retinal prosthesis chip was mounted on the flexible cable by an epoxy and electrically connected by Au wire. The retinal prosthesis chip was cappted by a silicone to pretect from corrosive environments in an eyeball. Then, the fabricated retinal prosthesis module was implanted into an eyeball of a rabbit. We successfully recorded electrically evoked potential (EEP) elicited from the rabbit brain by the current stimulation supplied from the implanted retinal prosthesis module. EEP amplitude was increased linearly with illumination intensity and irradiation time of incident light. The retinal prosthesis chip was well functioned after implanting into the eyeball of the rabbit.

• Journal of Navigation and Port Research
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• v.32 no.5
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• pp.363-368
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• 2008

This paper presents a miniaturization design technique of radio frequency identification (RFID) tag antenna operated in 910 MHz band. Miniaturization structure design for a tag antenna is performed by structure application of the folded dipole and meander line. In order to realize the maximum power transmission, imaginary part of a chip impedance and a tag antenna impedance is matched by complex conjugate number. The optimized tag antenna size is $50\;nm\;{\times}\;40\;nm\;{\times}\;1.6\;nm$ and its size is reduced about 62 % comparison with antenna size of reference [4]. The measured results of fabricated tag antenna are confirmed the reasonable agreement with prediction. The read range of the tag antenna with chip observed about 5 m.

• Journal of Advanced Marine Engineering and Technology
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• v.32 no.8
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• pp.1248-1256
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• 2008

In this paper, basic characteristics of transmission line employing PPGM (periodically perforated ground metal) were investigated using theoretical and experimental analysis.According to the results, unlike the conventional PBG (photonic band gap) structures, the characteristic impedance of the transmission line employing PPGM structure showed a real value, which exhibited a very small dependency on frequency. The transmission line employing PPGM structure showed a loss (per quarter wave length) higher by $0.1{\sim}0.2\;dB$ than the conventional microstrip line. According to the investigation of the dependency of RF characteristic on ground condition, the RF characteristic of the transmission line employing PPGM structure was hardly affected by the ground condition in the frequency lower than Ku band, but fairly affected in the frequency higher than Ku band, which indicated that coplanar waveguide employing PPGM structure was optimal for RF characteristic and reduction of size. Considering above results, impedance transformer was developed using coplanar waveguide with PPGM structure for the first time, and good RF characteristics were observed from the impedance transformer. In case that {\lambda}/4$ impedance transformer with a center frequency of 9 GHz was fabricated for a impedance transformation from 20 to10 {\Omega}$, the line width and length were 20 and $500\;{\mu}m$, respectively, and its size was only 0.64 % of the impedance transformer fabricated with conventional microstrip lines. Above results indicate that the transmission line employing PPGM is a promising candidate for a development of matching and passive elements on MMIC.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.20 no.12
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• pp.1264-1271
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• 2009

In this paper, the chip slot antenna which is used for mobile devices and designed for multi-band is proposed. The proposed antenna is comprised of a chip antenna(10 mm$\times$20 mm$\times$1.27 mm) and a system circuit board(30 mm$\times$60 mm$\times$0.8 mm). The chip slot antenna is mounted on the system circuit board and the end of F-type strip line which is patterned on the chip antenna is connected by a via with a ground plane of the system circuit board. So, a chip antenna radiates effectively the energy by transition between a microstrip line of the system circuit board and a open slot structure of the chip antenna. In the results of proposed antenna, impedance bandwidth of 3:1 VSWR(-6 dB return loss) is 1.98 GHz(1.61~3.59 GHz) and 0.8 GHz(5.2~6 GHz). So, it can cover multi-band of DCS, PCS, UMTS, WLAN. The proposed antenna can be applied to mobile devices.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.17 no.4
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• pp.8-12
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• 2003

Characteristics of optical transceiver module in radio frequency(RF) band were investigated with TO-can packaged Fabry-Perot laser diode(FP-LD). R-L-C parameters for equivalent circuit model of the LD were extracted with an impedance analyzer. With this model, impedance matching to the packaged LD could be performed by eliminating inductive components of the leads in the package by using lumped chip capacitors that have opposite reactance, while it shows resonance dip in low frequency band. The resonance dip could be removed using lumped elements for impedance matching by shifting the resonance frequency to the region out of interest.