• 제어로봇시스템학회:학술대회논문집
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• 제어로봇시스템학회 2003년도 ICCAS
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• pp.1060-1065
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• 2003

This paper contributes to development of a new chip mounting head system for flip chip. Recently, the LDM(Linear DC Motor) has been widely used, because it has particular merits than the rotary type motors. In this paper, we proposed a macro/micro positioning system for force control of a chip mounting system. In the proposed macro/micro system, the macro actuator provide the system with a gross motion while the micro device yields fine tuned motion to reduce the harmful impact force that occurs between very small sized electronic parts and PCB surface. In order to prove the effectiveness of the proposed macro/micro chip mounting system, we compared the proposed chip mounting head with the conventional chip mounting head equipped with a macro actuator only. A series of experiments were executed under the mounting conditions of various access velocities and PCB stiffness. As a result of this study, a satisfactory voice coil actuator as the micro actuator has been developed, and its performance meet well the specifications desired for the design of the chip mounting head system and show good correspondence between theoretical analysis and experimental results.

• ETRI Journal
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• 제19권3호
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• pp.228-241
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• 1997

In this paper, we present a design of modem and vocoder digital signal processor (DSP) chips for CDMA mobile station. The modem chip integrates CDMA reverse link modulator, CDMA forward link demodulator and Viterbi decoder. This chip contains 89,000 gates and 29 kbit RAMs, and the chip size is $10 mm{\times}10.1 mm$ which is fabricated using a $0.8{\mu}m$ 2 metal CMOs technology. To carry out the system-level simulation, models of the base station modulator, the fading channel, the automatic gain control loop, and the microcontroller were developed and interfaced with a gate-level description of the modem application specific integrated circuit (ASIC). The Modem chip is now successfully working in the real CDMA mobile station on its first fab-out. A new DSP architecture was designed to implement the Qualcomm code exited linear prediction (QCELP) vocoder algorithm in an efficient way. The 16 bit vocoder DSP chip has an architecture which supports direct and immediate addressing modes in one instruction cycle, combined with a RISC-type instruction set. This turns out to be effective for the implementation of vocoder algorithm in terms of performance and power consumption. The implementation of QCELP algorithm in our DSP requires only 28 million instruction per second (MIPS) of computation and 290 mW of power consumption. The DSP chip contains 32,000 gates, 32K ($2k{\times}16\;bit$) RAM, and 240k ($10k{\times}24\;bit$) ROM. The die size is $8.7\;mm{\times}8.3\;mm$ and chip is fabricated using $0.8\;{\mu}m$ CMOS technology.

• 한국생산제조학회지
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• 제7권3호
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• pp.118-125
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• 1998

Chip control is a major problem in automatic machining process, especially in finish turning operation. In this case, chip breaker is one of the important factors to be determined. As unbroken chips are grown. these deteriorate the surface roughness. and proces automation can not be carried out. In this study to get rid of chip curling problem while turning internal hole. optimal chip breaker is selected from the experiment. The experiment is planned with Taguchi's method that is based on the orthogonal arrary of design factors. From the response table. cutting speed, feedrate, depth of cut and tool geometry turn to be major factors affecting chip formation. Then, optimal chip breaker is selected. and this is verified as good enough for chip control from the experiment.

• 전자공학회논문지A
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• 제31A권10호
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• pp.161-172
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• 1994

This paper describes the design of a neurochip with on-chip learning capability in hardware with multiple processing elements. A digital architecture is adopted because its flexiblity and accuracy is advantageous for simulating the various application systems. The proposed chip consists of several processing elements to fit the large computation of neural networks, and has on-chip learning capability based on error back-propagation algorithm. It also minimizes the number of blobal control signals for processing elements. The modularity of the system makes it possible to buil various kinds of boards to match the expected range of applications.

• 한국전자파학회논문지
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• 제25권4호
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• pp.483-486
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• 2014

일반적으로 플립 칩은 와이어 본딩에 비해 신호 무결성을 저해하는 기생 성분이 작지만, 60 GHz 대역에서는 설계하기에 따라서 2 dB 이상의 삽입 손실 차이가 난다. 본 논문에서는 플립 칩 구조의 여러 설계 변수들에 따라 삽입 손실이 어떻게 변하는 지를 분석함으로써 설계를 최적화하는 방법을 제시한다.

• 한국CDE학회논문집
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• 제5권2호
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• pp.175-183
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• 2000

Proposed in this paper is a model-bated AFA (automatic feedrate-adjustment) method for maintaining smooth cutting-loads (i.e., cutting-force) during 2D-profile milling. Before the cutting-force model was established, some assumptions were verified through a series of preliminary cutting experiments (The results found that the curving-force was independent of the cutting speed and the cutting action at the cutter bosom). From the data obtained during the main cutting experiments, a “chip-load/cutting-force model”representing the cutting-force as a function of the chip-load (i.e., effective cutting-depth) and a feedrate is proposed. Based on the model. an AFA scheme for maintaining smooth cutting-force by adjusting the feedrate (i.e., F-code) according to the changes in chip-load was proposed. To check the validity of the proposed AFA scheme. another set of cutting experiments was conducted by using feedrate-adjusted NC-data while monitoring the actual machining processes using an accelerometer. The experimental results showed that the proposed AFA-scheme was quite effective.

• 한국반도체및디스플레이장비학회:학술대회논문집
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• 한국반도체및디스플레이장비학회 2003년도 추계학술대회 발표 논문집
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• pp.154-159
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• 2003

Semiconductor chip encapsulation process is employed to protect the chip and to achieve optimal performance of the chip. Expert decision-making to obtain the appropriate package design or process conditions with high yields and high productivity is quite difficult. In this paper, an expert system for semiconductor chip encapsulation has been constructed which combines a knowledge-based system with CAE software.

• 한국통신학회논문지
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• 제34권8C호
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• pp.806-813
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• 2009

본 논문은 고속 무선 통신을 위한 모뎀 설계에 관한 것이다. 고속 통신을 위한 기술에는 여러 가지가 있는데, 그 중 넓은 주파수를 사용하고 여타 서비스에 주파수 간섭을 일으키지 않는 기술인 MB-OFDM (Multi-Band Orthogonal Frequency Division Multiplexing) 방식의 UWB (Ultra-Wideband) 모뎀의 SoC (System-on-Chip) 칩을 설계하였다. 개발된 모뎀 SoC 칩의 기저대역 시스템은 WiMedia에서 정의한 표준안을 따라서 설계되었다. 설계된 SoC 칩은 코어 부분인 FFT/lFFT (Fast Fourier Transform/lnverse Fast Fourier Transform), 송신부, 심볼동기 및 주파수 오프셋 추정부, 비터비 디코더, 그리고 기타 수신부등으로 구성되어 있다. 반도체 공정은 90nm CMOS (Complementary Metal-Oxide-Semiconductor) 공정을 사용하였고, 칩 사이즈는 약 5mm x 5mm 이다. 2009년 7월 20일에 fab-out되었다.

• ETRI Journal
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• 제22권1호
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• pp.20-29
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• 2000

In this paper, we present a design of video and audio single chip encoder/decoder for portable multimedia application. The single-chip called as video audio signal processor (VASP) consists of a video signal processing block and an audio single processing block. This chip has mixed hardware/software architecture to combine performance and flexibility. We designed the chip by partitioning between video and audio block. The video signal processing block was designed to implement hardware solution of pixel input/output, full pixel motion estimation, half pixel motion estimation, discrete cosine transform, quantization, run length coding, host interface, and 16 bits RISC type internal controller. The audio signal processing block is implemented with software solution using a 16 bits fixed point DSP. This chip contains 142,300 gates, 22 Kbits FIFO, 107 kbits SRAM, and 556 kbits ROM, and the chip size is $9.02mm{\times}9.06mm$ which is fabricated using 0.5 micron 3-layer metal CMOS technology.

• 대한전자공학회논문지SD
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• 제44권8호
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• pp.80-88
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• 2007

매우 복잡한 시스템의 보다 효율적인 설계를 위한 차세대 SoC를 위해 중요한 것은 시스템의 고적용성과 고확장성이다. 이를 위해 최근 들어 급속히 관심이 높아지는 것이 계산 모듈중심의 시스템 설계를 탈피하여 통신 중심으로 시스템 설계를 보는 communication-based 설계 방법론이며, 그 중 대표적으로 많은 관심을 모으고 있는 것이 Network-on-Chip (NoC)이다. 이는 모듈간의 직접적인 연결에 의한 데이터의 통신 구조를 가진 일반적인 SoC 설계에서의 취약한 확장성과 통신 구조의 고정성을 극복하기 위해, 데이터를 패킷화하고, 이를 네트워크 인터페이스 및 라우터에 의한 가변적인 구조에 의해 전송함으로써 통신 구조의 적용성과 확장성을 제공하려는 노력이다. 하지만 확장성과 적용성에 치중하다 보면 성능과 면적에 대한 비용이 너무 커져서 실제로 기존의 연결 방법과 비교하여 실용성이 없을 수 있다. 그래서 본 연구에서는 통신 패턴의 면밀한 분석을 통하여 매우 성능에 중요하고 또 빈번한 통신 패턴에 대해서는 기존의 연결 방식을 고수하면서, 전체적인 연결성 및 확장성을 유지하는 알고리즘을 제시한다. 이 방법을 통해서 최소 30%의 네트워크 인터페이스 및 라우터 구조가 훨씬 간단한 구조로 바뀔 수 있었으며, 이로 인한 연결성 (connectivity) 및 확장성에 대한 손실은 거의 없었다. 시뮬레이션 결과에 의하면 통신 구조의 최적화를 통해서 연결에 소요되는 시간적 성능은 49.19% 향상되었고 면적의 측면에서도 24.03% 향상되었음이 입증되었다.