• Proceedings of the IEEK Conference
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• 2002.07c
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• pp.1984-1987
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• 2002

This paper describes the design and implementation of a single-chip digitally synthesized 0-35MHz agile function generator. The chip comprises an integrated direct digital synthesizer (DDS) with a 10-bit on- chip digital-to-analog converter (DAC) using an n-well single-poly triple-metal 0.5-$\mu\textrm{m}$ CMOS technology. The main features of the chip include maximum clock frequency of 100 MHz at 3.3-V supply voltage, 32-bit frequency tuning word resolution, 12-bit phase tuning word resolution, and an on-chip 10-bit DAC. The chip provides sinusoidal, ramp, saw-tooth, and random waveforms with phase and frequency modulation, and power-down function. At 100-MHz clock frequency, the chip covers a bandwidth from dc to 35 MHz in 0.0233-Hz frequency steps with 190-ns frequency switching speed. The complete chip occupies 12-mm$^2$die area and dissipates 0.4 W at 100-MHz clock frequency.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.13 no.7
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• pp.583-591
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• 2000

It this paper the multilayer chip band pass filter for next generation mobile communication phone is fabricated and designed. For the design the multilayer chip filter of non-contented equivalent circuit and contented equivalent circuit with attenuation pole is presented. Finally it is fabricated and designed using the multilayer chip filter of contented equivalent circuit with attenuation pole. The size insertion loss center frequency and band width of multilayer chip filter are 4.5$\times$3.2$\times$2.0[mm], 3.0[d.B] and 1945$\pm$25 MHz respectively. The multilayer chip filter was fabricated by screen printing with Ag electrode after tape casting. Simulation results of multilayer chip filter are compared with experimental results and found to be in excellent agreements.

• Proceedings of the KIEE Conference
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• 2003.11c
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• pp.924-927
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• 2003

In this paper, we design the memory tester chip set playing an important role in the memory tester as central parts. Memory tester has the sixteen inner instructions to control the test sequence and the address and data signals to DUT. These instructions are saved in memory with each chip such as sequence chip and address/data generator chip. Sequence chip controls the test sequence according to instructions saved in the memory. And Generator chip generates the address and data signals according to instructions saved in the memory, too.

• Smart Media Journal
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• v.1 no.1
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• pp.27-35
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• 2012

In this paper, the performance analysis for multimedia video codec(MPEG-4, H.264) on on-chip network communication architecture is presented. The On-Chip Network (OCN) is the new communication architecture of multimedia SoC design that overcomes the limits of On-Chip Bus architecture by providing higher data traffic bandwidth, reusability and higher scalability. We compared the performance of MPEG-4, H.264 decoder based on-chip network and AMBA on-chip bus. Experimental results show that the performance of MPEG-4, H.264 based on on-chip network is improved over 33~56% compared to the design based on AMBA on-chip bus.

• Journal of electromagnetic engineering and science
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• v.11 no.4
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• pp.282-289
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• 2011

GHz electromagnetic interference (EMI) characteristics are analyzed for a 3dimensional (3D) stacked chip power distribution network (PDN) with through silicon via (TSV) connections. The EMI problem is mostly raised by P/G (power/ground) noise due to high switching current magnitudes and high PDN impedances. The 3D stacked chip PDN is decomposed into P/G TSVs and vertically stacked capacitive chip PDNs. The TSV inductances combine with the chip PDN capacitances produce resonances and increase the PDN impedance level in the GHz frequency range. These effects depend on stacking configurations and P/G TSV designs and are analyzed using the P/G TSV model and chip PDN model. When a small size chip PDN and a large size chip PDN are stacked, the small one's impedance is more seriously affected by TSV effects and shows higher levels. As a P/G TSV location is moved to a corner of the chip PDNs, larger PDN impedances appear. When P/G TSV numbers are enlarged, the TSV effects push the resonances to a higher frequency range. As a small size chip PDN is located closer to the center of a large size chip PDN, the TSV effects are enhanced.

• Proceedings of the KIEE Conference
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• 1999.07f
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• pp.2758-2760
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• 1999

ASIC chip design for motor control has been a subject of increasing interest since effective system-on-a-chip design methodology was developed. This paper investigates the design and implementation of ASIC chip for speed control of induction motor using VHDL which is a standarded hardware description language. The presented system is implemented using a simple electronic circuit based on FPGA.

• Journal of the Korean Society of Industry Convergence
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• v.15 no.2
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• pp.55-58
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• 2012

This study is concerned about the design and structural analysis of high integrated Chip Bonding Machine. Recently, many studies have been undergoing to reduce a working time in a field of Chip Bonding Machine. Chip Bonding Machine belongs to reduce a stand-by time by Chip Moving time. The developed system can save tool moving distance in small space than other machine. The analysis is carried out by SoldEdge & Ansys software.

• Journal of the Korean Institute of Telematics and Electronics C
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• v.34C no.2
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• pp.19-28
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• 1997

This paper presents the design of an SSIC chip for synchronization between main and sub pictures in the multi channel TV system (MUCTS). This chip can resolve problems in MUCTS, such as passing through and vertical jolt phenomena. In addition, this chip rpvivides compatibility for normal/doulble scan, interlace/progressive and normal (4:3)/wide (16:9) systems and has high hjorizontal and vertical resolutions (340) dots and 150 lines). In each mode there are 1 channel, 3 channel, and 4 position display functions. This MUCTS chip including three A/D coverters, a D/A converter and seven line memories was fabricated with one chip by using the $0.8\mu\textrm{m}$ CMOS technology. The application areas of this MUCTS ASIC chip include the wide TV, projection TV and te next generation TV for the DBS (direct broadcast system).

• 제어로봇시스템학회:학술대회논문집
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• 2005.06a
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• pp.190-195
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• 2005

The hearing aid chip described in this paper is an analog & digital mixed system. The design focuses on the$\mu$DSP core. This $\mu$DSP core includes internal time delays to two inputs from front and rear microphones. The paper consists of two parts; one is the composure and signal processing algorithm of digital hearing aids and the other is Verilog HDL codes for$\mu$DSP cores. All digital modules in the design were coded and synthesized by Verilog HDL codes which were verified by Mentor Graphics and Synopsis semiconductor chip design tools.

• Proceedings of the KIEE Conference
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• 2000.07b
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• pp.1102-1104
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• 2000

Recently effective system-on-a-chip design methodology is developed, and ASIC chip design is much studied for motor control. This paper investigates the design and implementation of ASIC chip for sensorless speed control of induction motor using VHDL which is a standarded hardware description language. The sensorless control strategy is to design an adaptive state observer for flux estimation and to estimate the rotor speed from the estimated rotor flux and stator current. The presented system is implemented using a simple electronic circuit based on FPGA.