• Journal of Software Assessment and Valuation
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• v.15 no.1
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• pp.55-62
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• 2019

The needs for small size and low power consumption of information devices is being implemented with SOC technology that implements the program on a single chip in Internet of Thing. Copyright disputes due to piracy are increasing in semiconductor chips as well, arising from disputes in the chip implementation of the design house and chip implementation by the illegal use of the source code. However, since the final chip implementation is made in the design house, it is difficult to protect the copyright. In this paper, we deal with the analysis method for extracting similarity and the criteria for setting similarity judgment in the dispute of source code written in HDL language. Especially, the chip which is manufactured based on the same specification will be divided into the same configuration and the code type.

• ETRI Journal
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• v.35 no.3
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• pp.554-557
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• 2013

This letter presents a power amplifier (PA) with an on-chip power detector for 2.4-GHz wireless local area network application. The power detector consists of a clamp circuit, a diode detector, and a coupled line directional coupler. A series inductor for an output matching network in the PA is combined with a through line of the coupler, which reduces the coupling level. Therefore, the coupler employs a metamaterial-based transformer configuration to increase coupling. The amount of coupling is increased by 2.5 dB in the 1:1 symmetric transformer structure and by 4.5 dB from two metamaterial units along the coupled line.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1995.10a
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• pp.1059-1062
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• 1995

In cutting system, relative displacement between rool and workpiece is very important. Even though there have been so many works for modeling cutting process of end-milling, most of them have considered only one displacement of either tool or workpiece instead of both. In this paper, the relative displacement between tool and workpiece is considered for modeling cutting process of end-milling using simple experimental modal analysis and cutting force simulation program is developed. In cutting force model, instantaneous uncut chip thickness model is used and Runge-Kutta method is used for the simulation of time varying cutting system.

• Proceedings of the KIEE Conference
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• 2015.07a
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• pp.1249-1250
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• 2015

We report a plasma-on-a-chip (POC) which provides a non-thermal atmospheric plasma for superbacteria infection treatment A three-electrode configuration allows an initiation carrier injection prior to a primary discharge, leading to a significant reduction in a breakdown voltage. A stable non-thermal argon plasma is generated using a pulsed glow discharge and inactivation of anti-biotic resistant bacteria, for example MRSA, is successfully demonstrated by exposing the bacteria to the argon plasma in a couple of minutes.

• Proceedings of the Korean Institute of IIIuminating and Electrical Installation Engineers Conference
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• 2003.11a
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• pp.251-257
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• 2003

In this paper, a new distributed intelligent control module based on LonWorks fieldbus for air handling unit(AHU) of heating, ventilating and air-conditioning(HVAC) is proposed to replace with a conventional direct digital control(DDC) with 32 bit microprocessor. The proposed control architecture has a excellent features such as highly compact and flexible function design, a low priced smart front-end and reliable performance with various functions. This also addresses issues in control network configuration, logical design of field devices by S/W tool, Internet networking and electronic element installation. Experimental results showing the system performance are also included in this paper.

• IEIE Transactions on Smart Processing and Computing
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• v.5 no.1
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• pp.55-62
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• 2016

In this paper, we propose a hybrid multi.system-on-chip (H-MSoC) architecture that provides a high-flexibility system in a rapid development time. The H-MSoC approach provides a flexible system-on-chip (SoC) architecture that is easy to configure for physical- and application-layer development. The physical- and application-layer aspects are dynamically designed and modified; hence, it is important to consider a design methodology that supports rapid SoC development. Physical layer development refers to intellectual property cores or other modular hardware (HW) development, while application layer development refers to user interface or application software (SW) development. H-MSoC is built from multi-SoC architectures in which each SoC is localized and specified based on its development focus, either physical or application (hybrid). Physical HW development SoC is referred to as physical-SoC (Phy-SoC) and application SW development SoC is referred to as application-SoC (App-SoC). Phy-SoC and App-SoC are connected to each other via Ethernet. Ethernet was chosen because of its flexibility, high speed, and easy configuration. For prototyping, we used a LEON3 SoC as the Phy-SoC and a ZYNQ-7000 SoC as the App-SoC. The proposed design was proven in real-time tests and achieved good performance.

• Proceedings of the KIEE Conference
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• 2003.11b
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• pp.171-174
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• 2003

In this paper, a Learning module for a reconfigurable neural network processor(ERNIE) was proposed for an On-chip learning. The existing reconfigurable neural network processor(ERNIE) has a much better performance than the software program but it doesn't support On-chip learning function. A learning module which is based on Back Propagation algorithm was designed for a help of this weak point. A pipeline structure let the learning module be able to update the weights rapidly and continuously. It was tested with five types of alphabet font to evaluate learning module. It compared with C programed neural network model on PC in calculation speed and correctness of recognition. As a result of this experiment, it can be found that the neural network processor(ERNIE) with learning module decrease the neural network training time efficiently at the same recognition rate compared with software computing based neural network model. This On-chip learning module showed that the reconfigurable neural network processor(ERNIE) could be a evolvable neural network processor which can fine the optimal configuration of network by itself.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.24 no.8A
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• pp.1245-1251
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• 1999

A 1.25Gb/s path control switch chip has been designed and implemented with COMPASS tool and 0.8${\mu}{\textrm}{m}$ CMOS gate-array of LG semiconductor. This device controls the path of digital singnals in SDH-based transmission system. The proposed switch chip is suitable for self-healing operations both in a linear network and an unidirectonal ring, The self-healing operation of the switch is effectively done by the configuration information stored in the resisters of the switch. The test device adapted to SDH-based transmission system, show immediate restoration and a 10-11~10-12 bit error raito. And 2.5Gb/s or more high throughput can be realized by combining rwo identical or more switches with the parallel architecture.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2003.10a
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• pp.990-994
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• 2003

This paper describes the VoIP(Voice over Internet Protocol) SoC(System on Chip) Design and the test board development for the function verification to support voice communication services using Internet. To implement the simple system of configuration, we designed the VoIP SoC which have ARM922T of 32bit microprocessor, IP network interface, voice signal interface, various user interface function. Also we developed test program and communication protocol to verify the function of this chip. We used several tools of design and simulation, developed and tested a test board with Excalibur which includes ARM922T microprocessor and FPGA.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.29 no.4
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• pp.237-240
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• 2016

The improvement of irradiation intensity and irradiation uniformity is essential for large area and high power UVA light source application. In this study, large number of chips bonded by micro soldering technique were driven by low current, and current limiting diodes were configured to supply constant current to parallel circuits consisting of large number of series strings. The dimension of light source module circuit board was $350{\times}90mm^2$ and 16,650 numbers of 385 nm flip chip LEDs were used with a configuration of 90 parallel and 185 series strings. The space between LEDs in parallel and series strings were maintained at 1.9 mm and 1.0 mm distance, respectively. The size of the flip chip was $750{\times}750{\mu}m^2$ were used with contact pads of $260{\times}669{\mu}m^2$ size, and SAC (96.5 Sn/3.0 Ag/0.5 Cu) solder was used for flip chip bonding. The fabricated light source module with 7.5 m A supply current showed temperature rise of $66^{\circ}C$, whereas irradiation was measured to be $300mW/cm^2$. Inaddition, 0.23% variation of the constant current in each series string was demonstrated.