• Title/Summary/Keyword: Chip Antenna

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Design Consideration of the Voltage Multiplier of UHF RFID Tag for Increased Reading Range (인식거리 향상을 위한 UHF 대역 RFID 태그용 전압체배기 설계)

  • Lee, Jong-Wook;Lee, Bom-Son
    • Proceedings of the IEEK Conference
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    • 2005.11a
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    • pp.587-590
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    • 2005
  • We investigated the input impedance characteristics of UHF-band RFID tag chip for increased reading range. A voltage multiplier designed using 0.4 ${\mu}m$ $zero-V_T$ MOSFET showed that DC output voltage of 2 V can be obtained using standard CMOS process. The input impedance of the voltage multiplier was examined to achieve impedance level for maximum reading distance using analytical and numerical approaches. The input impedance of the voltage multiplier could be varied in a wide range by selecting the size of MOSFET and the number of multiplying stages of the voltage multiplier, and thus, the impedance level required for the tag antenna can be obtained in presence of other tag circuit blocks.

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Design of internal dielectric ceramic antennas for IMT-2000 handset (IMT-2000용 단말기 내장형 유전체 세라믹 안테나 설계)

  • 심성훈;강종윤;박용욱;윤석진;윤영중;김현재
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2001.07a
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    • pp.968-971
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    • 2001
  • In this paper, internal antennas for IMT-2000 handset(1.92∼2.17 GHz) were designed to be capable of being mounted on the circuit-board with a CPW(coplanar waveguide) feeding structure. The chip antennas were miniaturized to a greater extent by fabricating multilayer high dielectric ceramic($\varepsilon$$\sub$r/=7.8) hexahedron. The proposed antennas has λ/4 monopole element with helical structure in the multilayer dielectric ceramic hexahedron. The simulated and measured results were invesgated with width, length, and thickness of helical structure in the hexahedron.

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A Study on the Data Anti-collision using Time-domain Procedure on RFID(Radio Frequency Identification) System (무선인식 시스템에서 시간절차를 이용한 데이터 충돌 방지에 관한 연구)

  • 강민수;신석균;이준호;이동선;유광균;박영수;이기서
    • Journal of the Korean Society for Railway
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    • v.4 no.4
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    • pp.155-161
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    • 2001
  • In this paper, the method is suggested to prevent data collision or damage on RFID(Radio Frequency Identification) system, in case a reader reading multi-tag simultaneously, using binary-search algorithm and Time-domain anti-collision procedure at reader and tag, respectively. The RFID system is designed that Reader enable to communicate with Tag on 13.56MHz bandwidth which is ISM(Industrial Science Medical) bandwidth, antennas of Tag part are designed using MCRF335 Chip. When RF communication is achieved between reader and tag, in case that data is transmitted to reader pass through multiple tags simultaneously, a study on the anti-collision method for the situation that the data collision occurs is performed.

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A Study on the Implementation of RFID for Korean Defense (RFID 군 적용방안 연구)

  • Lee, Jea-Youl;Kim, Seong-Won;Choi, Sang-Young
    • Journal of the military operations research society of Korea
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    • v.31 no.1
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    • pp.58-72
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    • 2005
  • RFID(Radio Frequency Identification) is one of key technologies in ubiquitous computing. RFID system comprises tag, reader, and computer application. The tag is a small electronic chip, which is attached to a thing such as item, pallet, container. The reader has an tiny antenna obtaining the identification information of the things by radio frequency, and provides the information to the computer application for a business. In this paper we have proposed the military application of RFID and its implementation policy for the Korean armed forces. We believe that The principle application area would be logistics TAV(total asset visibility) and resource management, and the implementation should be achieved step by step considering the advancement of RFID technology and government policy.

BER Performance of Cooperative Transmission for the Uplink of TDD-CDMA Systems

  • Van, Khuong Ho;Kong, Hyung-Yun
    • ETRI Journal
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    • v.28 no.1
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    • pp.17-30
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    • 2006
  • In time division duplex (TDD) code division multiple access (CDMA) systems, chip-synchronous transmission in the uplink is obtainable, thus leading to free multiple access interference in flat Rayleigh fading channels plus additive white Gaussian noise. This motivates us to develop a novel cooperative transmission strategy that allows single-antenna devices to benefit from spatial diversity using orthogonal signature sequences. The proposed cooperation is applicable to many digital modulation methods and achieves the fullest diversity level, low implementation complexity, and a full data rate. Closed-form bit-error-rate expressions were also derived and compared to simulation results in order to evaluate its validity. A variety of numerical results demonstrated the cooperation's superiority over single transmission under the same transmit power constraint.

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Thin Film Effects on Side Channel Signals (부 채널 신호에 대한 박막의 영향)

  • Sun, Y.B.
    • Journal of the Semiconductor & Display Technology
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    • v.12 no.2
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    • pp.51-56
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    • 2013
  • Even if transmissions through normal channel between ubiquitous devices and terminal readers are encrypted, any extra sources of information retrieved from encrypting module can be exploited to figure out the key parameters, so called side channel attack. Since side channel attacks are based on statistical methods, making side channel signal weak or complex is the proper solution to prevent the attack. Among many countermeasures, shielding the electromagnetic signal and adding noise to the EM signal were examined by applying different thicknesses of thin films of ferroelectric (BTO) and conductors (copper and gold). As a test vehicle, chip antenna was utilized to see the change in radiation characteristics: return loss and gain. As a result, the ferroelectric BTO showed no recognizable effect on both shielding and adding noise. Cu thin film showed increasing shielding effect with thickness. Nanometer Au exhibited possibility in adding noise by widening of bandwidth and red shifting of resonating frequencies.

A Wideband H-Band Image Detector Based on SiGe HBT Technology

  • Yoon, Daekeun;Kaynak, Mehmet;Tillack, Bernd;Rieh, Jae-Sung
    • Journal of electromagnetic engineering and science
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    • v.15 no.1
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    • pp.59-61
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    • 2015
  • A wideband H-band detector operating near 300 GHz has been developed based on SiGe HBT technology. The detector consists of an on-chip antenna and a HBT differential pair for square-law detection. It showed responsivity of more than 1,700 V/W and noise equivalent power (NEP) smaller than $180pW/Hz^{0.5}$ for the measured frequency range of 250-350 GHz. The maximum responsivity and the minimum NEP were 5,155 V/W and $57pW/Hz^{0.5}$, respectively; both were obtained at 330 GHz with DC power dissipation at 9.1 W.

Fabrication and Properties of Dielectric Materials used for Mobile Phone Antenna Chip Type (고주파 이동통신기기용 칩형 세라믹 안테나를 위한 유전체재료의 제조 및 특성 평가)

  • Lee H.K.;Lee Y.S.;Hwang S.J.;Kang W.H.
    • Proceedings of the KAIS Fall Conference
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    • 2004.06a
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    • pp.86-88
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    • 2004
  • 본 연구에서는 고주파 이동통신 기기용 칩형 세라믹 안테나의 사용을 위한 저유전율 및 저온동시소성이 가능한 CaO-B2O3-SiO2계 유리를 제조하고자 하였다. 제조된 CaO-B2O3-SiO2계 유리는 열분석을 통하여 낮은 연화온도를 갖는 안정한 유리조성을 선정하였다. 유리분말을 이용하여 성형된 샘플은 소결온도에 따른 특성을 조사하였다. 소결온도변화에 따라 유전율(${\epsilon}_r$)은 4-4.5값을 나타냈으며, 유전손실(tan$\delta$)은 <$0.1\%$ 보였으나, 품질계수(Q$\times$f)는 큰 변화폭을 보였다.

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Development of Wide-Band Planar Active Array Antenna System for Electronic Warfare (전자전용 광대역 평면형 능동위상배열 안테나 시스템 개발)

  • Kim, Jae-Duk;Cho, Sang-Wang;Choi, Sam Yeul;Kim, Doo Hwan;Park, Heui Jun;Kim, Dong Hee;Lee, Wang Yong;Kim, In Seon;Lee, Chang Hoon
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.30 no.6
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    • pp.467-478
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    • 2019
  • This paper describes the development and measurement results of a wide-band planar active phase array antenna system for an electronic warfare jamming transmitter. The system is designed as an $8{\times}8$ triangular lattice array using a $45^{\circ}$ slant wide-band antenna. The 64-element transmission channel is composed of a wide-band gallium nitride(GaN) solid state power amplifier and a gallium arsenide(GaAs) multi-function core chip(MFC). Each GaAs MFC includes a true-time delay circuit to avoid a wide-band beam squint, a digital attenuator, and a GaAs drive amplifier to electronically steer the transmitted beam over a ${\pm}45^{\circ}$ azimuth angle and ${\pm}25^{\circ}$ elevation angle scan. Measurement of the transmitted beam pattern is conducted using a near-field measurement facility. The EIRP of the designed system, which is 9.8 dB more than the target EIRP performance(P), and the ${\pm}45^{\circ}$ azimuth and ${\pm}25^{\circ}$ elevation beam steering fulfill the desired specifications.

Chip-level NFP Calibration and Verification Using Improved Probe for NFS Standardization (NFS 표준을 위한 개선된 프로브를 이용한 칩 수준 NFP 측정값 교정 및 검증)

  • Lee, Pil-Soo;Wee, Jae-Kyung;Kim, Boo-Gyoun;Choi, Jai-Hoon;Yeo, Soon-Il
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.49 no.6
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    • pp.25-34
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    • 2012
  • New calibration method for the near-field scanning (NFS) system is presented. The proposed calibration method consisted of a new near-field antenna (NFP) and newly devised patterns as circular patch patterns (CPPs) and meander patterns (MPs). The proposed patterns were used for improving spatial resolutions and simplifying a calibration procedure of the NFP compared to the conventional method defined in the IEC61967-3 and 6. Also, the effect of the length of NFPs on attenuation characteristics was investigated with length of 8mm and 30mm. For them, we designed and fabricated CPPs of diameter (D) = 20, 40, 60, and 100mm and MPs of various widths and spaces. We found the reverse relations between spatial resolutions and heights of measuring points by using simplified calibration procedure. The testing result shows that the spatial resolution of $120{\mu}m$ at height of $200{\mu}m$ was verified without complex correlation algorithms under 8GHz. For manufacturing cost all patterns and the NFP were realized with low-cost fabrication using PCB (FR-4) not by a conventional LTCC process. For verification of chip-level EMC from the results, near-field scanning system (NFSS) having step resolution of Sub-micron scale was produced and by using the proposed NFSS and proposed NFP measurement of chip shows accurately the shape of the resolution of $200{\mu}m$ patterns for securing a high level of chip-level EMC verification.