• 한국결정성장학회지
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• 제26권4호
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• pp.131-134
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• 2016

Czochralski 법으로 성장한 RE : YAG ($RE=Nd^{3+}\;,Er^{3+}\;,Yb^{3+}$) 단결정의 표면 결함을 측정하는 chemical polishing 및 etching 조건에 대하여 조사하였다. 최적의 chemical polishing 조건은 시편을 수직 방향으로 고정하고 85 % $H_3PO_4$ 용액에서 $330^{\circ}C$, 30분 동안 진행한 것이었다. 또한 최적의 chemical etching 조건은 85 % $H_3PO_4$ 용액에서 $260^{\circ}C$, 1시간 동안 진행한 것이었고, (111) 면에 $70~80{\mu}m$ 크기의 삼각형 etch pit들이 관찰되었다. 결함 밀도 분석 결과, Nd(1 %) : YAG는 $1.9{\times}10^3$개/$cm^2$, Er(7.3 %) : YAG는 $4.3{\times}10^2$개/$cm^2$, Yb(15 %) : YAG는 $5.1{\times}10^2$개/$cm^2$로 측정되었다.

• 대한전기학회논문지:전기물성ㆍ응용부문C
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• 제50권9호
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• pp.438-443
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• 2001

In the shallow trench isolation(STI)-chemical mechanical polishing(CMP) process, the key issues are the optimized thickness control, within-wafer-non-uniformity, and the possible defects such as pad oxide damage and nitride residue. The defect like nitride residue and silicon (or pad oxide) damage after STI-CMP process were discussed to accomplish its optimum process condition. To understand its optimum process condition, overall STI related processes including reverse moat etch, trench etch, STI fill and STI-CMP were discussed. Consequently, we could conclude that law trench depth and high CMP thickness can cause nitride residue, and high trench depth and over-polishing can cause silicon damage.

• KIEE International Transactions on Electrophysics and Applications
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• 제2C권5호
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• pp.262-267
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• 2002

In this paper, we first studied the factors affecting the motor current (MC) signal, which was strongly affected by the systematic hardware noises depending on polishing such as pad conditioning and arm oscillation of platen and recipe, head motor. Next, we studied the end point detection (EPD) for the chemical mechanical polishing (CMP) process of shallow trench isolation (STI) with reverse moat structure. The MC signal showed a high amplitude peak in the fore part caused by the reverse meal. pattern. We also found that the EP could not be detected properly and reproducibly due to the pad conditioning effect, especially when conventional low selectivity slurry was used. Even when there was no pad conditioning effect, the EPD method could not be applied, since the measured end points were always the same due to the characteristics of the reverse moat structure with an open nitride layer.

• 한국윤활학회:학술대회논문집
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• 한국윤활학회 1998년도 제28회 추계학술대회
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• pp.272-277
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• 1998

Chemical-Mechanical Polishing (CMP) refers to a material removal process done by rubbing a work piece against a polishing pad under load in the presence of chemically active, abrasive containing slurry. CMP process is a combination of chemical dissolution and mechanical action. The mechanical action of CMP involves tribology. The liquid slurry is trapped between the wafer(work piece) and pad(tooling) forming a lubricating film. For the first step to understand material removal rate of the CMP process, the lubricational analyses were done with commercial 100mm diameter silicon wafers to get nominal clearance of the slurry film, roll and pitch angle at the steady state. For this purpose, we calculate slurry pressure, resultant forces and moments at the steady state in the range of typical industrial polishing conditions.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1999년도 춘계학술대회 논문집
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• pp.501-504
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• 1999

In the shallow trench isolation(STI) chemical mechanical polishing(CMP) process, the key issues are the optimized thickness control within- wafer-non-uniformity, and the possible defects such as nitride residue and pad oxide damage. These defects after STI CMP process were discussed to accomplish its optimum process condition. To understand its optimum process condition, overall STI related processes including reverse moat etch, trench etch, STI filling and STI CMP were discussed. It is represented that the nitride residue can be occurred in the condition of high post CMP thickness and low trench depth. In addition there are remaining oxide on the moat surface after reverse moat etch. It means that reverse moat etching process can be the main source of nitride residue. Pad oxide damage can be caused by over-polishing and high trench depth.

• KIEE International Transactions on Electrophysics and Applications
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• 제3C권1호
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• pp.28-32
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• 2003

In this paper, we have studied the in-situ end point detection (EPD) for direct chemical mechanical polishing (CMP) of shallow trench isolation (STI) structures without the reverse moat etch process. In this case, we applied a high selectivity $1n (HSS) that improves the silicon oxide removal rate and maximizes oxide to nitride selectivity Quite reproducible EPD results were obtained, and the wafer-to-wafer thickness variation was significantly reduced compared with the conventional predetermined polishing time method without EPD. Therefore, it is possible to achieve a global planarization without the complicated reverse moat etch process. As a result, the STI-CMP process can be simplified and improved using the new EPD method.

• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 2004년도 춘계학술대회 논문집
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• pp.27-33
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• 2004

Electro-theological fluid is recently used for the micro polishing of 3-dimensional micro-aspherical lens. It's also used for polishing small area defects on the wide flat wafer. Since ER fluid shows a behavior of viscosity changing under certain electric fields. micro polishing efficiency may be enhanced for certain cases. In this paper, a perfluorinated carbonyl fluoride oil based ER fluids was used to improve surface polishing rate and submicron-scale accuracy. As the polishing electrodes, micro size cylindrical tools had been used for maximizing the electric field. An experimental device, which was applied for micro polishing a number of wafers of 4inches in size and other workpiece. was made on a precision polishing system. It consisted of a steel electrode. a wafer fixture. l0㎃ current and DC 5㎸ power supply unit, and a controller unit. From the Experiments. the ER fluid is applicable for micro polishing of small parts.

• 한국정밀공학회지
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• 제21권5호
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• pp.32-37
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• 2004

Polishing processes are widely used in the glass, optical, die and semiconductor industries. Chemical Mechanical Polishing (CMP) especially is becoming one of the most important ULSI processes for the 0.25m generation and beyond. CMP is conventionally carried out using abrasive slurry and a polishing pad. But the surface of the pad has irregular pores, so there is non-uniformity of slurry flow and of contact area between wafer and the pad, and glazing occurs on the surface of the pad. This paper introduces the basic concept and fabrication technique of the next generation CMP pad using micro-molding method to obtain uniform protrusions and pores on the pad surface.

• Transactions on Electrical and Electronic Materials
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• 제8권2호
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• pp.79-83
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• 2007

The implications of a theory of lubricated pad asperity wafer contact are traced through several fundamental areas of chemical-mechanical polishing. The hypothesized existence of a nanolubrication layer underlies a high accuracy model of polish rates. It also provides a quantitative explanation of a power law relationship between the coefficient of friction and a measure of pad surface flattening. The theory may further be useful for interpreting friction changes during polishing, and may explain why the coefficient of friction is sometimes observed to have a temperature or velocity dependence.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 하계학술대회 논문집 Vol.5 No.2
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• pp.1308-1311
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• 2004

It is very important that get polishing characteristic that to be stable that accomplish planarization of high efficiency in chemical mechanical polishing, and there is repeatability Groove of pad causes much effects in flow of slurry among various factors that influence in polishing characteristic, is expected to cause change of lubrication state and polishing characteristic in contact between wafer and pad. Therefore, divided factors of pad groove by groove pattern, groove profile, groove dimensions. This research wishes to study effect that dimension of pad groove gets in polishing performance. When changed dimension (width, depth, pitch of groove) of groove, measured change of removal rate and friction force. According as groove dimension changes, could confirm that removal rate and friction force change. While result of this experiment studies effect of pad groove in CMP, it is expected to become small help.