• 제목/요약/키워드: Chemical vapor deposition process

검색결과 651건 처리시간 0.033초

광통신 모듈용 분포 귀환형 InGaAsP/InP 레이저 다이오드 제작 및 소자 특성평가 (Fabrication process and device characterization of distributed feedback InGaAsP/InP laser diodes for optical fiber communication module)

  • 전경남;김근주
    • 반도체디스플레이기술학회지
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    • 제10권4호
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    • pp.131-138
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    • 2011
  • We fabricated distributed feedback InGaAsP/InP laser diodes for optical fiber communication module and characterized the lasing properties in continuous wave operation. The active layer of 7-period InGaAsP(1.127 eV)/InGaAsP(0.954 eV) multi-quantum well structure was grown by the metal-organic chemical vapor deposition. The grating for waveguide was also fabricated by the implementation of the Mach-Zehender holographic method of two laser beams interference of He- Cd laser and the fabricated laser diode has the dimension of the laser length of $400{\mu}m$ and the ridge width of $1.2{\mu}m$. The laser diode shows the threshold current of 3.59 mA, the threshold voltage of 1.059 V. For the room-temperature operation with the current of 13.54 mA and the voltage of 1.12 V, the peak wavelength is about 1309.70 nm and optical power is 13.254 mW.

Controlled Growth of Large-Area Mono-, Bi-, and Few-Layer Graphene by Chemical Vapor Deposition on Polycrystalline Copper Surfaces

  • Kim, Yooseok;Song, Wooseok;Lee, Suil;Cha, Myoung-Jun;Park, Chong-Yun
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2013년도 제44회 동계 정기학술대회 초록집
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    • pp.614-614
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    • 2013
  • The effect of graphene growth parameters on the number of graphene layers were systematically studied and growth mechanism on copper substrate was proposed. Parameters that could affect the thickness of graphene growth include the pressure in the system, gas flow rate, growth pressure, growth temperature, and cooling rate. We hypothesis that the partial pressure of both the carbon sources and hydrogen gas in the growth process, which is set by the total pressure and the mole fraction of the feedstock, could be the factor that controls the thickness of the graphene. A synthetic method to produce such large area graphene films with precise thickness from mono- to few-layer would be ideal for chemists and physicists to explore the promising electronic applications of these materials. Here, large-area uniform mono-, bi-, and few-layer graphene films were successfully synthesized on copper surface in selective growth windows, with a finely tuned total pressure and $CH_4$/$H_{2gas}$ ratio. Our findings may facilitate both the large-area synthesis of well-controlled graphene features and wide range of applications of graphene.

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Growth Mechanism of Self-Catalytic Ga2O3 Nano-Burr Grown by RF Sputtering

  • 박신영;최광현;강현철
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2013년도 제44회 동계 정기학술대회 초록집
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    • pp.462-462
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    • 2013
  • Gallium Oxide (Ga2O3) has been widely investigated for the optoelectronic applications due to its wide bandgap and the optical transparency. Recently, with the development of fabrication techniques in nanometer scale semiconductor materials, there have been an increasing number of extensive reports on the synthesis and characterization of Ga2O3 nano-structures such as nano-wires, nanobelts, and nano-dots. In contrast to typical vaporliquid-solid growth mode with metal catalysts to synthesis 1-dimensional nano-wires, there are several difficulties in fabricating the nanostructures by using sputtering techniques. This is attributed to the fact that relatively low growth temperatures and higher growth rate compared with chemical vapor deposition method. In this study, Ga2O3 chestnut burr were synthesized by using radio-frequency magnetron sputtering method. In contrast to typical sputtering method with sintered ceramic target, a Ga2O3 powder (99.99% purity) was used as a sputtering target. Several samples were prepared with varying the growth parameters, especially he growth time and the growth temperature to investigate the growth mechanism. Samples were characterized by using XRD, SEM, and PL measurements. In this presentation, the details of fabrication process and physical properties of Ga2O3 nano chestnut burr will be reported.

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실리콘 카바이드 박막 제조를 위한 증착 반응연구 (A study on chemical vapor deposition process for the proparation of thin SiC films)

  • 고준호;우성일
    • E2M - 전기 전자와 첨단 소재
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    • 제4권4호
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    • pp.344-353
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    • 1991
  • 무정형 SiC 박막을 수평형 CVD반응기로부터 SiH$_{4}$ 및 H$_{2}$를 반응기체로 하여 실리콘 웨이퍼위에 증착시켜 제조하였다. 박막 성장 속도는 상압에서 650.deg.C와 850.deg.C범위에서 측정되었다. 반응기체의 유량은 1000sccm으로 고정하였으며 SiH$_{4}$와 CH$_{4}$의 유량을 변화시켰다. 증착 반응속도식으로 표면 반응이 율속단계인 Eley-Rideal 모델과 SiH$_{4}$와 CH$_{4}$의 종도에 m차로 비례하는 두가지 속도식을 가정하였다. 증착시간에 따른 SiC 박막두께의 측정으로부터 얻은 증착 반응 속도로부터 회귀 분석법에 의하여 두가지 반응속도식의 반응속도 상수를 구하였다. 얻어진 반응속도식에 의해서 계산된 값과 실험치를 비교한 결과 0.15차의 반응속도식이 Eley-Rideal반응기구보다 약산 더 잘 맞음을 알 수 있으나 두 모델 다 약간씩 실험결과와 차이가 나고 있다. 이것은 본 실험의 증착 조건의 율속단계가 확산 단계와 표면 반응 단계의 전이영역 즉 본 실험의 증착조건에서 확산속도와 표면 반응속도가 비슷하기 때문으로 생각된다. 또한 Eley-Rideal 반응기구에서 부터 얻어진 SiH$_{4}$ 및 CH$_{4}$의 흡착평형상수 $K_{s}$$K_{c}$ 값을 비교하면 1000K이하에서는 $K_{s}$$K_{c}$ 보다 큰 값을 가지는데 이것은 Gibbs 자유에너지 최소화 방법에서 구한 결과와 일치하였다.

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극한 환경 MEMS용 2" 3C-SiC기판의 직접접합 특성 (Direct Bonding Characteristics of 2" 3C-SiC Wafers for Harsh Environment MEMS Applications)

  • 정귀상
    • 한국전기전자재료학회논문지
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    • 제16권8호
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    • pp.700-704
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    • 2003
  • This paper describes on characteristics of 2" 3C-SiC wafer bonding using PECVD (plasma enhanced chemical vapor deposition) oxide and HF (hydrofluoride acid) for SiCOI (SiC-on-Insulator) structures and MEMS (micro-electro-mechanical system) applications. In this work, insulator layers were formed on a heteroepitaxial 3C-SiC film grown on a Si (001) wafer by thermal wet oxidation and PECVD process, successively. The pre-bonding of two polished PECVD oxide layers made the surface activation in HF and bonded under applied pressure. The bonding characteristics were evaluated by the effect of HF concentration used in the surface treatment on the roughness of the oxide and pre-bonding strength. Hydrophilic character of the oxidized 3C-SiC film surface was investigated by ATR-FTIR (attenuated total reflection Fourier transformed infrared spectroscopy). The root-mean-square suface roughness of the oxidized SiC layers was measured by AFM (atomic force microscope). The strength of the bond was measured by tensile strength meter. The bonded interface was also analyzed by IR camera and SEM (scanning electron microscope), and there are no bubbles or cavities in the bonding interface. The bonding strength initially increases with increasing HF concentration and reaches the maximum value at 2.0 % and then decreases. These results indicate that the 3C-SiC wafer direct bonding technique will offers significant advantages in the harsh MEMS applications.ions.

Electrochemical Evaluation of Si-Incorporated Diamond-Like Carbon (DLC) Coatings Deposited on STS 316L and Ti Alloy for Biomedical Applications

  • Kim, Jung-Gu;Lee, Kwang-Ryeol;Kim, Young-Sik;Hwang, Woon-Suk
    • Corrosion Science and Technology
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    • 제6권1호
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    • pp.18-23
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    • 2007
  • DLC coatings have been deposited onto substrate of STS 316L and Ti alloy using r.f. PACVD (plasma-assisted chemical vapor deposition) with a mixture of $C_{6}H_{6}$ and $SiH_{4}$ as the process gases. Corrosion performance of DLC coatings was investigated by electrochemical techniques (potentiodynamic polarization test and electrochemical impedance spectroscopy) and surface analysis (scanning electron microscopy). The electrolyte used in this test was a 0.89% NaCl solution of pH 7.4 at temperature $37^{\circ}C$. The porosity and protective efficiency of DLC coatings were obtained using potentiodynamic polarization test. Moreover, the delamination area and volume fraction of water uptake of DLC coatings as a function of immersion time were calculated using electrochemical impedance spectroscopy. This study provides the reliable and quantitative data for assessment of the effect of substrate on corrosion performance of Si-DLC coatings. The results showed that Si-DLC coating on Ti alloy could improve corrosion resistance more than that on STS 316L in the simulated body fluid environment. This could be attributed to the formation of a dense and low-porosity coating, which impedes the penetration of water and ions.

영교차율과 가우시안 혼합모델을 이용한 박막증착장비의 세라믹 히터 결함 검출 (Fault Detection for Ceramic Heater in CVD Equipment using Zero-Crossing Rate and Gaussian Mixture Model)

  • 고진석;무향빈;임재열
    • 반도체디스플레이기술학회지
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    • 제12권2호
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    • pp.67-72
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    • 2013
  • Temperature is a critical parameter in yield improvement for wafer manufacturing. In chemical vapor deposition (CVD) equipment, crack defect in ceramic heater leads to yield reduction, however, there is no suitable ceramic heater fault detection system for conventional CVD equipment. This paper proposes a short-time zero-crossing rate based fault detection method for the ceramic heater in CVD equipment. The proposed method measures the output signal ($V_{pp}$) of RF filter and extracts the zero-crossing rate (ZCR) as feature vector. The extracted feature vectors have a discriminant power and Gaussian mixture model (GMM) based fault detection method can detect fault in ceramic heater. Experimental results, carried out by measured signals provided by a CVD equipment manufacturer, indicate that the proposed method detects effectively faults in various process conditions.

Effect of FTO coated on stainless steel bipolar plate for PEM fuel cells

  • 박지훈;장원영;변동진;이중기
    • 한국재료학회:학술대회논문집
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    • 한국재료학회 2009년도 춘계학술발표대회
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    • pp.55.2-55.2
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    • 2009
  • A polymer electrolyte membrane (PEM) fuel cell has been getting large interest as a typical issue in useful applications. The PEMFC is composed of a membrane, catalyst and the bipolar plate. SnOx:F films on SUS316 stainless steel were prepared as a function of substrate with using electron cyclotron resonance-metal organic chemical vapor deposition (ECR-MOCVD) in order to achieve the corrosion-resistant and low contact resistance bipolar plates for PEM fuel cells. The SnOx:F films coated on SUS316 substrate at surface plasma treatment for excellent stability, before/after heat treatment for good crystalline structure and microwave power for were characterized by X-ray diffraction (XRD), auger electron microscopy (AES) and field emission-scanning electron microscopy (FE-SEM). The SnOx:F film coated on SUS316 substrate with various process parameters were able to observe optimum interfacial contact resistance (ICR) and corrosion resistance. It can be concluded that fluorine-doping content plays an important function in electrical property and characteristic of corrosion-protective film.

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전기적 기법을 통한 플렉서블 OLED 봉지막의 파괴특성 연구 (Fracture Analysis of a $SiN_x$ Encapsulation Layer for Flexible OLED using Electrical Methods)

  • 김혁진;오승하;김성민;김형준
    • 반도체디스플레이기술학회지
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    • 제13권4호
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    • pp.15-20
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    • 2014
  • The fracture analysis of $SiN_x$ layers, which were deposited by low-temperature plasma enhanced chemical vapor deposition (LT-PECVD) and could be used for an encapsulation layer of a flexible organic light emitting display (OLED), was performed by an electrical method. The specimens of metal-insulator-metal (MIM) structure were prepared using Pt and ITO electrodes. We stressed MIM specimen mechanically by bending outward with a bending radius of 15mm repeatedly and measured leakage current through the top and bottom electrodes. We also observed the cracks, were generated on surface, by using optical microscope. Once the cracks were initiated, the leakage current started to flow. As the amount of cracks increased, the leakage current was also increased. By correlating the electrical leakage current in the MIM specimen with the bending times, the amount of cracks in the encapsulation layer, generated during the bending process, was quantitatively estimated and fracture behavior of the encapsulation layer was also closely investigated.

HoMnO3 박막의 강유전 특성의 결정상 의존성 (Dependence of Ferroelectric Properties on the Crystalline Phases of HoMnO3 Thin Film)

  • 김응수;강동호
    • 한국재료학회지
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    • 제16권6호
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    • pp.394-399
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    • 2006
  • Ferroelectric $HoMnO_3$ thin films were deposited on the Si(100) substrate at $700^{\circ}C$ for 2 hrs by metalorganic chemical vapor deposition (MOCVD) and post-annealed at 850oC by rapid thermal process (RTP). Electrical properties and crystalline phases of $HoMnO_3$ thin films were investigated as a function of postannealing time. Single phase of hexagonal symmetry with c-axis preferred orientation was obtained from $HoMnO_3$ thin films post-annealed at $850^{\circ}C$ for 5 min, while the c-axis preferred orientation was decreased with the increase of post-annealing time, and the thin films post-annealed at $850^{\circ}C$ for 15 min showed the mixture phases of hexagonal and orthorhombic symmetry. P-E (Polarization-Electric field) hysteresis loop of ferroelectric $HoMnO_3$ thin films was observed only for the single phase of hexagonal symmetry, but that was not observed for the mixture phases of the hexagonal and orthorhombic symmetry, which was discussed with the bond valence of Mn ion of crystalline phase. Leakage current density was dependent on the microstructure of thin films as well as the change of valence of Mn ion.