A Study for Global Planarization of Mutilevel Metal by CMP (Chemical Mechanical Polishing (CMP) 공정을 이용한 Mutilevel Metal 구조의 광역 평탄화에 관한 연구)
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- Journal of the Korean Institute of Electrical and Electronic Material Engineers
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- v.11 no.12
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- pp.1084-1090
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- 1998