• 한국전기전자재료학회논문지
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• 제20권3호
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• pp.213-217
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• 2007

Copper has been used as an interconnect material in the fabrication of semiconductor devices, because of its higher electrical conductivity and superior electro-migration resistance. Chemical mechanical polishing(CMP) technique is required to planarize the overburden Cu film in an interconnect process. Various problems such as dishing, erosion, and delamination are caused by the high pressure and chemical effects in the Cu CMP process. But these problems have to be solved for the fabrication of the next generation semiconductor devices. Therefore, new process which is electro-chemical mechanical polishing(ECMP) or electro-chemical mechanical planarization was introduced to solve the technical difficulties and problems in CMP process. In the ECMP process, Cu ions are dissolved electrochemically by the applying an anodic potential energy on the Cu surface in an electrolyte. And then, Cu complex layer are mechanically removed by the mechanical effects between pad and abrasive. This paper focuses on the manufacturing of ECMP system and its process. ECMP equipment which has better performance and stability was manufactured for the planarization process.

• Bulletin of the Korean Chemical Society
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• 제33권5호
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• pp.1603-1607
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• 2012

The effects of plating process on the surface coverage of the accelerator were investigated in terms of Cu superfilling for device metallization. When a substrate having 500 nm-wide trench patterns on it was immersed in an electrolyte containing poly (ethylene glycol) (PEG)-chloride ion ($Cl^-$)-bis(3-sulfopropyl) disulfide (SPS) additives without applying deposition potential for such a time of about 100s, voids were generated inside of the electrodeposit. In time-evolved electrochemical analyses, it was observed that the process (immersion without applying potential) in the electrolyte led to the build-up of high initial coverage of SPS-Cl on the surface, resulting in the fast saturation of the coverage. Repeated experiments suggested that the fast saturation of SPS-Cl failed in superfilling while a gradual increase in the SPS-Cl coverage through competition with initially adsorbed PEG-Cl enabled it. Consequently, superfilling was achievable only in the case of applying the plating potential as soon as the substrate is dipped in an electrolyte to prevent rapid accumulation of SPS-Cl on the surface.

• Korean Chemical Engineering Research
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• 제50권4호
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• pp.678-683
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• 2012

세리아 미세입자는 자동차, 석유공정, 폐수처리 등 다양한 분야에서 촉매로서 널리 쓰이고 있는 중요한 물질이다. 이제까지, 세리아 미세입자를 제조하기 위한 다양한 제조법이 연구되었는데, 본 연구에서는 짧은 반응시간과 간단한 공정이 가능한 초임계 메탄올을 이용하는 입자 제조 공정을 통해 세리아 나노입자를 제조하였다. 회분식 반응기를 이용하여 짧은 시간 안에 세리아 나노입자를 제조하는데 성공하였다. 초임계 메탄올을 이용하여 세리아 나노입자를 제조하는 경우, 다른 첨가제 없이도 약 6 nm의 크기를 갖는 나노입자를 합성할 수 있었다. 이 크기는 같은 온도와 압력조건의 초임계수를 이용하여 표면개질제 없이 합성한 입자보다 훨씬 작은 크기이다. 이는 초임계수와 초임계 메탄올의 밀도 차이와, 초임계 메탄올에서의 세리아 표면에서 일어나는 결정성장을 제한하는 반응, 그리고 초임계 메탄올과 초임계수의 임계점의 차이에서 기인하는 것이다. 또한 여러 가지 유기물을 표면개질제로 첨가하여 표면을 개질한 세리아 나노입자를 제조하였으며, FT-IR과 HR-TEM, TGA를 통해 이를 확인할 수 있었다. 표면을 개질한 세리아 나노입자는 표면개질을 하지 않은 세리아 나노입자와는 다르게, 유기용매에 대한 분산성이 뛰어났으며, 표면개질제로 사용하는 유기물의 양과 종류를 조절함으로써 세리아 나노입자의 크기와 모양을 조절할 수 있었다.

• 제어로봇시스템학회:학술대회논문집
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• 제어로봇시스템학회 1997년도 한국자동제어학술회의논문집; 한국전력공사 서울연수원; 17-18 Oct. 1997
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• pp.1516-1519
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• 1997

With disseminationof Distributed Control Systems(DCS), the huge amounts of process operation data could have been available and led to figure out process behaviors better on the statistical basis. Until now, the statistical modeling technology has been susally applied to process monitoring and fault diagnosis. however, it has been also thought that these process information, extracted from statistical analysis, might serve a great opportunity for process operation improvements and process improvements. This paper proposed a general methodolgy for process operation improvements including data analysis, backing up the result of analysis based on the methodology, and the mapping physical physical phenomena to the Principal Components(PC) which is the most distinguished feature in the methodology form traditional statistical analyses. The application of the proposed methodology to the Balst Furnace(BF) process has been presented for details. The BF process is one of the complicated processes, due to the highly nonlinear and correlated behaviors, and so the analysis for the process based on the mathematical modeling has been very difficult. So the statisitical analysis has come forward as a alternative way for the useful analysis. Using the proposed methodology, we could interpret the complicated process, the BF, better than any other mathematical methods and find the direction for process operation improvement. The direction of process operationimprovement, in the BF case, is to increase the fludization and the permeability, while decreasing the effect of tapping operation. These guide directions, with those physical meanings, could save fuel cost and process operator's pressure for proper actions, the better set point changes, in addition to the assistance with the better knowledge of the process. Open to set point change, the BF has a variety of steady state modes. In usual almost chemical processes are under the same situation with the BF in the point of multimode steady states. The proposed methodology focused on the application to the multimode steady state process such as the BF, consequently can be applied to any chemical processes set point changing whether operator intervened or not.

• 제어로봇시스템학회논문지
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• 제21권9호
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• pp.875-880
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• 2015

Traditional semiconductor process control has been performed through statistical process control techniques in a constant process-recipe conditions. However, the complexity of the interior of the etching apparatus plasma physics, quantitative modeling of process conditions due to the many difficult features constraints apply simple SISO control scheme. The introduction of the Advanced Process Control (APC) as a way to overcome the limits has been using the APC process control methodology run-to-run, wafer-to-wafer, or the yield of the semiconductor manufacturing process to the real-time process control, performance, it is possible to improve production. In addition, it is possible to establish a hierarchical structure of the process control made by the process control unit and associated algorithms and etching apparatus, the process unit, the overall process. In this study, the research focused on the methodology and monitoring improvements in performance needed to consider the process management of future developments in the semiconductor manufacturing process in accordance with the age of the APC analysis in real applications of the semiconductor manufacturing process and process fault diagnosis and control techniques in progress.

• 한국생물공학회:학술대회논문집
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• 한국생물공학회 2005년도 생물공학의 동향(XVI)
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• pp.490-490
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• 2005

• 한국가스학회:학술대회논문집
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• 한국가스학회 2005년도 추계학술발표회 논문집
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• pp.49-58
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• 2005

화학공장의 취약점을 파악하여 안전성을 경제적으로 확보할 수 있는 대안에 대한 설비별 안전투자비용과 그에 따른 편익을 산출하고, 분석함으로써 경제적인 안전 투자 대안을 사업주에게 제시함으로써 안전투자 의사결정의 기초자료로 활용하도록 한다. 이를 통하여 화학공장의 안전 활동 및 안전 투자의 효율성을 증진시키고 안전성 향상을 위한 화학공장의 안전투자가치를 정립하기 위함이다.

• 제어로봇시스템학회:학술대회논문집
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• 제어로봇시스템학회 1999년도 제14차 학술회의논문집
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• pp.53-56
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• 1999

The control performance of a chemical process is determined by process structure as well as the performance of controllers. Therefore, the concept of“controllability”should be introduced in the early design stage. Structural information makes controllability assessment possible by giving insights on the pathways of disturbances in the process. In this study, a simple procedure to evaluate controllability is suggested to screen out design alternatives using relative order analysis and structural decomposition. The effectiveness of the proposed method was validated by comparing the results with the case of dynamical simulation.

• 한국반도체및디스플레이장비학회:학술대회논문집
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• 한국반도체및디스플레이장비학회 2005년도 춘계 학술대회
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• pp.157-162
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• 2005

The wafer's size has been increased up to 300mm according as the devices have been integrated sophisticatedly. For this process to make 300mm-wafer, it is required strict level which removes the particulates on the surface of wafer. Therefore we need new type wet-station which can reduce DI water and chemical in the cleaning process. Moreover, it is very important to control the temperature and the concentration of chemical wet-stat ion. The chemical supply system which is used currently is not only difficult to make a fit mixing rate of chemical in cleaning process, but also it is difficult to make fit quantity and temperature. We propose new chemical supply system, which overcomes the problems via analysis of fluid and thermal transfer on chemical supply system,

• Biotechnology and Bioprocess Engineering:BBE
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• 제8권3호
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• pp.167-172
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• 2003

Foam fractionation can be used to enrich a hydrophobic protein such as bromelain from an aerated dilute protein solution because the protein foams. On the other hand, a protein such as invertase, which is hydrophilic, is not likely to foam under similar aerated conditions. While a foam fractionation process may not be appropriate for recovering a hydrophilic protein alone, it is of interest to see how that non-foaming protein affects the foaming protein when the two are together in a mixture. The bromelain enrichment, activity and mass recovery were observed as a function of the solution pH in order to explore how invertase can affect the recovery of bromelain in a foam fractionation process.