Planarizaiton of Cu Interconnect using ECMP Process |
Jeong, Suk-Hoon
(부산대학교 정밀기계공학과)
Seo, Heon-Deok (부산대학교 정밀기계공학과) Park, Boum-Young (부산대학교 정밀기계공학과) Park, Jae-Hong (부산대학교 정밀기계공학과) Jeong, Hae-Do (부산대학교 정밀정형 및 금형가공 연구소) |
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