• Journal of the Korea Computer Industry Society
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• v.6 no.5
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• pp.741-748
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• 2005

Power saving module which is consisted of ferroelectric ceramic capacitor and time delay switching circuit was installed into electronic ballast in order to enhance energy efficacy and extend life time of fluorescent lamp. The impedance matching of negative resistance characteristics of F/L was optimized with the characteristics of ferroelectric ceramics capacitor to increase the light efficiency of the electronic ballast. The high efficiency of the electronic ballast was achieved by minimizing wasted power at the filament of F/L during the lighting by using the switching function of time delay circuit from preheating mode to non-preheating mode. The life time of F/L was also extended by eliminating the reverse electromotive force using time delay circuits to minimize the impacts to the filament of F/L from unwanted high voltage peaks during light-up period. As the results, the electronic ballast with the first grade energy efficiency was developed using ferroelectric ceramics and time delay module.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1997.04a
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• pp.289-292
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• 1997

BaTiO$_3$thin film capacitor were prepared on Pt(100)/SiO$_2$/Si(100)wafer by RF sputtering technique. Dielectric and electrical characteristics of the thin film capacitor are investigated. The Dielectric constant and loss were about 683 and 5[%], respectively. We found that the leakage current of thin film capacitor is depend on RF power during deposition. Because of increase of activation energy, leakage current inclosed at high RF power and sheet resistivity of the films was decreased. Swithching voltage of thin film capacitor was 4.4[V]

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1996.11a
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• pp.79-81
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• 1996

We fabricated SrTiO$_3$thin film capacitor on the Ag/Si-wafer by RF sputtering deposition. And I-V characteristics and structual analysis of the thin film capacitor are investigated. We found that the leakage current of the films during deposition is strongly denpent on the ambient gas and substrate temperature. Because of increase of activation energy, leakage current increased at high temperature and resistivity of the films was decreased. According to the increase of oxygen gas flow rate, the conductivity of thin film capacitor was increased and leakage current was decreased.

• Proceedings of the KIEE Conference
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• 2007.07a
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• pp.1355-1356
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• 2007

SMD type 압전레조네이터 제작을 위한 압전 조성물을 찾고자 PLT 세라믹스에 B-site Ti 자리에 Mn을 치환시키고 소결첨가제로서 CuO를 첨가하였다. $0{\sim}0.4wt%$ CuO를 첨가하여 1150, 1200, $1250^{\circ}C$로 각각 소결한 후 소결온도 및 CuO 첨가량에 따른 압전 및 유전특성을 관찰하였다. CuO 첨가량에 따라 1150, $1200^{\circ}C$ 소결시 밀도가 증가하였고, $1250^{\circ}C$ 소결시 기계적 품질계수가 증가하였다. 소결온도 $1250^{\circ}C$, 0.1wt% CuO 첨가시 밀도, 전기기계 결합계수(kp), 유전상수, 기계적 품질계수는 7.5[g/cm3], 0.1, 253, 1776을 각각 나타내었다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.311-312
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• 2007

In this study, composite $BaSrTiO_3$ has been studied for high frequency device applications. Composite $Ba_{0.5}Sr_{0.5}TiO_3$ has high dielectric permittivity and low loss tangent at the relative frequency range from MHz to GHz. 10,30 and 50 wt% of epoxy doped $Ba_{0.5}Sr_{0.5}TiO_3$ powders were prepared with bisphenol A and F polymer employing ball milling process. Epoxy/($BaSrTiO_3$) composites thick films were screen printed on the Cu plated PCB substrates through screen printing methods. The specimens were designed for the embedded capacitor applications. Temperature dependent dielectric permittivity of Epoxy doped $BaSrTiO_3$ ceramics was measured.

• Proceedings of the Korean Ceranic Society Conference
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• 2003.04a
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• pp.191.1-191
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• 2003

• Journal of Powder Materials
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• v.16 no.1
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• pp.37-42
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• 2009

In this study, the feasible test for the mechanical property characterization of $BaTiO_3$ ceramics and multi-layer ceramic capacitor(MLCC) was performed with nanoindentation technique. In case of $BaTiO_3$ ceramics, hardness and elastic modulus are dependent on the densification of specimen showing the highest hardness and elastic modulus values of 12.3 GPa and 155 GPa, respectively at $1260^{\circ}C$. In case of MLCC chip, hardness of dielectric layer was lower than that of margin region. The nanoindentation method could be useful tool for the measurement of mechanical property within $BaTiO_3$ dielectric layer of very thin thickness in high capacitance MLCC.

• Transactions on Electrical and Electronic Materials
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• v.13 no.6
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• pp.283-286
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• 2012

(1-X)$(Na_{0.5}K_{0.5})NbO_3-XK_{5.4}Cu_{1.3}Ta_{10}O_{29}$ (NKN-KCT) lead-free piezoelectric ceramics have been synthesized by the conventional solid state sintering method, and their sinterability and piezoelectric properties were investigated. Typically, this material is sintered between 1,025 and $1,100^{\circ}C$ for 2 hours to achieve the required densification. Crystalline structures and Microstructures were analyzed by X-ray diffraction and scanning electron microscope. The density, dielectric constant (${\varepsilon}_r$), piezoelectric constant $d_{33}$, electromechanical coupling factor $k_p$ and mechanical quality factor $Q_m$ value of the NKN ceramics depended upon the KCT content and the sintering temperature. In particular, the KCT addition to NKN greatly improved the mechanical quality factor $Q_m$ value. The ceramic with X = 1.0 mol% sintered at $1,050^{\circ}C$ exhibited optimum properties (${\varepsilon}_r$=246, $d_{33}$=95, $k_p$=0.38 and $Q_m$=1,826). These results indicate that the ceramic is a promising candidate material for applications in lead free piezoelectric transformer and filter materials.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.07b
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• pp.760-763
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• 2003

Low Temperature Cofired Ceramics (LTCC) technology is a promising technology to integrate many devices in a module by embedding passive components. For the module substrate, most LTCC structures have dielectric constants below 10 to reduce signal delay time. Some components, which need high dielectric constants, have not been yet embedded in LTCC module. So, embedding capacitor with high capacitance by applying another dielectrics with high dielectric constants in LTCC is an important issue to maximize circuit density in LTCC module. In this study, electrical properties of embedded capacitor fabricated by dielectric paste of high dielectric constants (K-100) and co-firing behavior with LTCC were investigated. To prevent camber development of co-fired structure, constrained sintering process was tested. Dielectric properties of embedded capacitors were calculated from their capacitance and impedance value. Temperature coefficient of capacitance were also measured.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.11a
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• pp.33-34
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• 2008

Barium titanate (BaTiO3) is one of the most important dielectric materials for the electronic devices, such as MLCC (Multilayer Ceramic Capacitor). The thickness of the dielectric thin film in MLCC has become thinner and reached about 0.8 ${\mu}m$. Further down sizing is required for the higher performance. For this reason, we should take into account for the size effect of Barium titanate powders. In this study, we demonstrated that size effect for BaTiO3 (0.2 ~ 0.5 ${\mu}m$, hydrothermal BT) could be estimates by using dielectric properties analysis together with the powder properties.