• 제목/요약/키워드: Carrier leakage

검색결과 109건 처리시간 0.024초

RF통신용 대전력증폭기의 선형화에 관한 연구 (A Design of linearize for High Power Amplifier using RF communication)

  • 원용규;이상철;정찬수
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 2003년도 학술대회 논문집 전문대학교육위원
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    • pp.31-33
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    • 2003
  • Power amplifier linearity plays a major role in the design of RF communication systems. In this paper, predistortion type linearizer was designed an independently controllable AM/AM and AM/PM predistortion linearizers. This linearizer allows independent adjustment of the AM/AM and AM/PM curves by using two adjustable voltages to compensate the power amplifier non-linearities. The predistortion linearizer was improved the ACPR by 6dB with cdma2000 multi carrier signals. Applying this linearizer to two-tone 880MHz power amplifier, an improvement of adjacent channel leakage power up to 5dBm has been achieved.

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5-MeV Proton-irradiation characteristics of AlGaN/GaN - on-Si HEMTs with various Schottky metal gates

  • Cho, Heehyeong;Kim, Hyungtak
    • 전기전자학회논문지
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    • 제22권2호
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    • pp.484-487
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    • 2018
  • 5 MeV proton-irradiation with total dose of $10^{15}/cm^2$ was performed on AlGaN/GaN-on-Si high electron mobility transistors (HEMTs) with various gate metals including Ni, TaN, W, and TiN to investigate the degradation characteristics. The positive shift of pinch-off voltage and the reduction of on-current were observed from irradiated HEMTs regardless of a type of gate materials. Hall and transmission line measurements revealed the reduction of carrier mobility and sheet charge concentration due to displacement damage by proton irradiation. The shift of pinch-off voltage was dependent on Schottky barrier heights of gate metals. Gate leakage and capacitance-voltage characteristics did not show any significant degradation demonstrating the superior radiation hardness of Schottky gate contacts on GaN.

Improvement of Carrier Mobility on Silicon-Germanium on Insulator MOSFET Devices with a Strained-Si Layer

  • Cho, Won-Ju;Koo, Hyun-Mo;Lee, Woo-Hyun;Koo, Sang-Mo;Chung, Hong-Bay
    • 한국전기전자재료학회논문지
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    • 제20권5호
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    • pp.399-402
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    • 2007
  • The effects of heat treatment on the electrical properties of strained-Si/SiGe-on-insulator (SGOI) devices were examined. We proposed the optimized heat treatment processes for improving the back interfacial electrical properties in SGOI-MOSFET. By applying the additional pre-RTA (rapid thermal annealing) before gate oxidation step and the post-RTA after source/drain dopant activation step, the electrical properties of strained-Si channel on $Si_{1-x}Ge_x$ layer were greatly improved, which resulting the improvement of the driving current, transconductance, and leakage current of SGOI-MOSFET.

Laser CVD법에 의해 퇴적된 OXYNITRIDE막의 특성에 관한 고찰 (A study on the characteristics of the OXYNITRIDE film deposited by Laser CVD)

  • 김강덕;신상우;정문남;김종관;성영권
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 1996년도 하계학술대회 논문집 C
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    • pp.1428-1430
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    • 1996
  • Thin Silicon oxynitride(SiON) films have been chemically deposited using 193nm ArF Excimer Laser CVD, with $Si_{2}H_{8}$, $N_{2}O$, and $NH_3$ as the reactive gases and $N_2$ as the carrier gas. Experimental results show that deposition rate and refractive index have a strong dependence on substrate temperature, chamber pressure, gas ratio, laser power and laser beam height. Electrical characterization of oxynitride films demonstrates that for $NH_{3}/N_{2}O$ flow ratios ranging from 0.25 to 1, the leakage currents, the interface trap density and the capacitances (dielect ric constant) increase and the dielectric breakdown fields decrease

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다결정 실리콘 박막 트랜지스터 제조공정 기술 (Polycrystalline Silicon Thin Film Transistor Fabrication Technology)

  • 이현우;전하응;우상호;김종철;박현섭;오계환
    • 한국진공학회지
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    • 제1권1호
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    • pp.212-222
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    • 1992
  • To use polycrystalline Si Thin Film Transistor (poly-Si TFT) in high density SRAM instead of High Load Resistor (HLR), TFT is needed to show good electrical characteristics such as large carrier mobility, low leakage current, high driver current and low subthreshold swing. To satisfy these electrical characteristics, the trap state density must be reduced in the channel poly. Technological issues pertinent to the channel poly fabrication process are investigated and discussed. They are solid phase growth (SPG), Si-ion implantation, laser annealing and hydrogenation. The electrical properties of several CVD oxides used as the gate oxide of TFT are compared. The dependence of the electrical characteristics of TFT on source-drain ion-implantation dose, drain offset length and dopant lateral diffusion are also described.

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반응성 이온 식각에 의해 손상된 실리콘의 세정에 관한 연구 (A study on cleaning process of RIE damaged silicon)

  • 이은구;이재갑;김재정
    • E2M - 전기 전자와 첨단 소재
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    • 제7권4호
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    • pp.294-299
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    • 1994
  • CHF$_{3}$/CH$_{4}$Ar 플라즈마에 의해 형성된 산화막 식각 잔류물의 화학구조와 이 잔류물의 제거를 위한 세정방법을 x-ray photoelectron spectroscopy를 이용하여 조사하였다. 잔류무르이 구조는 CF$_{x}$-polymer와 Si-C, Si-O 결합으로 이루어진 SiO$_{y}$ C$_{z}$ 이었다. CF$_{4}$O$_{2}$ 플라즈마에 의한 silicon light etch는 산화막 식각 잔류물인 SiO$_{y}$ C$_{z}$ 층과 손상된 실리콘 표면을 제거하엿으며 NH$_{4}$OH-H$_{2}$O$_{2}$과 HF용액으로 완전히 제거되는 CF$_{x}$-polymer/SiO$_{x}$층을 남겼다. 100.angs.정도의 silicon light etch는 minority carrier life time과 thermal wave signal값을 초기 웨이퍼 수준까지 회복시켰으며 접합누설 전류도 거의 습식 식각 공정수준까지 감소시켰다.

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Buried Channel 다결정 실리콘 박막 트랜지스터의 설계 및 제작 (Design and Fabrication of Buried Channel Polycrystalline Silicon Thin Film Transistor)

  • 박철민;강지훈;유준석;한민구
    • 전자공학회논문지D
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    • 제35D권12호
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    • pp.53-58
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    • 1998
  • 다결정 실리콘 박막 트랜지스터를 이용한 회로의 성능 향상을 위하여 새로운 구조의 4-terminal buried channel poly-Si TFT(BCTFT)를 설계하고 제작하였다. BCTFT는 moderate 도핑이 된 buried channel을 이용하므로 기존의 다결정 실리콘 TFT보다 ON-전류와 전계 효과 이동도가 n-형과 p-형 소자 각각 5배와 10배 향상되었다. BCTFT는 moderate 도핑된 buried 채널과 counter 도핑된 body 사이의 junction 공핍에 의하여 캐리어의 이동이 억제 되므로 OFF-전류가 증가하지 않았다.

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대전력증폭기의 AM/AM과 AM/PM을 독립적으로 제어하는 전치외곡보상기 설계 (A Design of Predistorter for Independently Controllable AM/AM and AM/PM of High Power Amplifier)

  • 원용규;정찬수
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 2003년도 하계학술대회 논문집 D
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    • pp.2690-2692
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    • 2003
  • Amplifier linearity plays a major role in the design of mordern communication systems. An independently controllable AM/AM and AM/PM predistortion linearizers that consists of two bias feed resistance linearizers is proposed. This linearizer allows independent adjustment of the AM/AM and AM/PM curves by using two adjustable voltages to compensate the power amplifier non-linearities. The predistortion linearizer can improve the ACPR by SdB with cdma2000 multi carrier signals. By applying this linearizer to two-tone 880MHz power amplifier, an improvement of adjacent channel leakage power up to 5dBm has been achieved.

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Comparing the Passivation Quality of Ozone and H2O Oxidant of Atomic Layer Deposited Al2O3 by Post-annealing in N2 and Forming Gas Ambients for Passivated Emitter and Rear Cell (PERC)

  • Cho, Young Joon;Chang, Hyo Sik
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2014년도 제46회 동계 정기학술대회 초록집
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    • pp.462-462
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    • 2014
  • The effect of rear passivation for passivated emitter and rear cell (PERC) using ozone and H2O oxidant of atomic layer deposited (ALD) Al2O3 was studied by post-annealing in N2 and forming gas ambients. Rear surface of PERC solar cell was passivated by Al2O3 grown by ALD with ozone and H2O oxidant. Al2O3 grown by ALD with ozone oxidant has been known to have many advantages, such as lower interface defects, low leakage current density. Its passivation quality is better than Al2O3 with H2O. Al2O3 layer with 10 nm and 20 nm thickness was grown at $150^{\circ}C$ with ozone oxidant and at $250^{\circ}C$ with H2O oxidant. And then each samples were post-annealled at $450^{\circ}C$ in N2 ambients and at $850^{\circ}C$ in forming gas ambients. The passivation quality was investigated by measuring the minority carrier lifetime respectively. We examined atomic layer deposited Al2O3 such as growth rate, film density, thickness, negative fixed charge density at AlOx/Si interface, and reflectance. The influences of process temperature and heat treatment were investigated using Sinton (WCT-120) by Quasi-Steady State Photoconductance (QSSPC) mode. Ozone-based ALD Al2O3 film shows the best carrier lifetime at lower deposition temperature than H2O-based ALD.

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Sol-Gel법에 의한 ${Ta_2}{O_5}$ 박막의 전기전도와 광학적 특성 (The Electrical Conduction and Optical Properties of ${Ta_2}{O_5}$ Thin Films by Sol-Gel Method)

  • 유영각
    • 한국전기전자재료학회논문지
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    • 제13권7호
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    • pp.575-582
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    • 2000
  • The Electrical conduction and optical properties of Ta$_{2}$/O$_{5}$ thin films as the insulators in DRAM capacitors were studied. Liquid Ta/sib 2//O sub 5/ were prepared by a sol-gel processing and multiple layers were applied by spin-coating up to thickness of 800$\AA$. At annealing temperature of 300~$600^{\circ}C$ the electrical conduction and specific dielectric constant were discussed the behaivor of carrier were observed by the Thermally Stimulated Current (TSC) at the temperature range of 30~23$0^{\circ}C$. At annealing temperature of 300~$600^{\circ}C$ the samples were found to be amorphous below $600^{\circ}C$ and crystalline over it. The electrical strength was about 2.2 MV/cm at 40$0^{\circ}C$. In spite of noncrystallization over 50$0^{\circ}C$ the increasing of leakage current due to pinholes and increasing creak. The refractive index was obtained maximum (2.2) at 40$0^{\circ}C$. The dielectric constant was obtained maximum(18.6) at 40$0^{\circ}C$. TSC was observed one peak at the temperature range of 30~23$0^{\circ}C$ from sample at 40$0^{\circ}C$. In the case of collecting voltage the peak size is decreased in proportion to collecting voltage and then the peak may be thought carrier to be a ionic space charge.e.

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