• ETRI Journal
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• v.36 no.3
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• pp.361-366
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• 2014

In this paper, a new, simple capacitive tilt sensor with a metallic ball is proposed. The proposed tilt sensor has only two electrodes and a metallic ball, and this design assists in managing the inherent contact problem in measuring tilt angles. Capacitive sensing, compared with other types of tilt sensor, has many advantages such as simplicity, noncontact measurement, long-throw linear displacement, and sub-micron plate spacing. Its design and fabrication process are significantly simpler than previous types of tilt sensors. The dimensions of the prototype tilt sensor are $20mm{\times}20mm$, and the diameter of the polystyrene tube is 5 mm with a tube thickness of 0.15 mm. An analytical study of the prototype capacitive tilt sensor was undertaken, and the experimental results demonstrate the relationship between the tilt angles and measured capacitances compared with the analytical study.

• International Journal of Fuzzy Logic and Intelligent Systems
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• v.6 no.4
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• pp.304-313
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• 2006

This paper describes a novel way of applying capacitive sensing technology to a mobile user interface. The key idea is to use grip-pattern, which is naturally produced when a user tries to use the mobile device, as a clue to determine an application to be launched. To this end, a capacitive touch sensing system is carefully designed and installed underneath the housing of the mobile device to capture the information of the user's grip-pattern. The captured data is then recognized by dedicated recognition algorithms. The feasibility of the proposed user interface system is thoroughly evaluated with various recognition tests.

• Journal of the Microelectronics and Packaging Society
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• v.23 no.3
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• pp.21-29
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• 2016

In this paper, we developed a flexible transparent capacitive pressure sensor which can recognize X and Y coordinates and the size of force simultaneously by sensing a change in electrical capacitance. The flexible transparent capacitive pressure sensor was composed of 3 layers which were top electrode, pressure sensing layer, and bottom electrode. Silver nanowire(Ag NW)/poly(3,4-ethylenedioxythiophene): poly(styrenesulfonate) (PEDOT:PSS) hybrid film was used for top and bottom flexible transparent electrode. The fabricated capacitive pressure sensor had a total size of 5 inch, and was composed of 11 driving line and 19 sensing line channels. The electrical, optical properties of the Ag NW/PEDOT:PSS and capacitive pressure sensor were investigated respectively. The mechanical flexibility was also investigated by bending tests. Ag NW/PEDOT:PSS exhibited the sheet resistance of $44.1{\Omega}/square$, transmittance of 91.1%, and haze of 1.35%. Notably, the Ag NW/PEDOT:PSS hybrid electrode had a constant resistance change within a bending radius of 3 mm. The bending fatigue tests showed that the Ag NW/PEDOT:PSS could withstand 200,000 bending cycles which indicated the superior flexibility and durability of the hybrid electrode. The flexible transparent capacitive pressure sensor showed the transmittance of 84.1%, and haze of 3.56%. When the capacitive pressure sensor was pressed with the multiple 2 mm-diameter tips, it can well detect the force depending on the applied pressure. This indicated that the capacitive pressure sensor is a promising scheme for next generation flexible transparent touch screens which can provide multi-tasking capabilities through simultaneous multi-touch and multi-force sensing.

• Journal of the Korean Institute of Telematics and Electronics D
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• v.36D no.2
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• pp.62-70
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• 1999

This paper introduces a possibility of a low-cost, high-resolution fingerprint sensor chip. The test chip is composed of $64{\times}256$ sensing cells(chip size : $2.7mm{\times}10.8mm$). A new detection circuit of charge sharing is proposed, which eliminates the influences of internal parasitic copacitances. This the reduced sensing-capacitor size enables a high resolution of 600dpi, using even conventional 0.6${\mu}m$ CMOS process. The partial fingerprint image captured therefrom are synthesized into a full fingerprint image with a image synthesis algorithm. The problems and possibilities of image synthesis technique are also analyzed and discussed.

• Proceedings of the IEEK Conference
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• summer
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• pp.82-85
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• 2004

This paper proposes an advanced circuit for the capacitive type fingerprint sensor signal processing and an effective isolation structure for minimizing an electrostatic discharge(ESD) influence and for removing a signal coupling noise of each sensor pixel. The proposed detection circuit increases the voltage difference between a ridge and valley about $80\%$ more than old circuit. The test chip is composed of $160\;\times\;192$ array sensing cells $(9,913\times11,666\;um^2).$ The sensor plate area is $58\;\times\;58\;um^2$ and the pitch is 60um. The image resolution is 423 dpi. The chip was fabricated on a 0.35um standard CMOS process. It successfully captured a high-quality fingerprint image and performed the registration and identification processing. The sensing and authentication time is 1 sec(.) with the average power consumption of 10 mW at 3.0V. The reveal ESD tolerance is obtained at the value of 4.5 kV.

• Journal of Sensor Science and Technology
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• v.21 no.2
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• pp.83-89
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• 2012

A simple array of metal-insulator-metal capacitive elements was proposed for a potential application in humidity sensing platforms. We fabricated meso-scale sensors with different sizes(large-size: $2.7{\times}2.7mm^2$ ; mid-size: $1.5{\times}1.5mm^2$ ; small-size: $0.7{\times}0.7mm^2$) and characterized the performance of each design. Polyimide films were utilized as a humidity-sensitive layer. Capacitance changes of the polyimide layer were measured with respect to water absorption. The device showed sensitivity in the full range of relative humidity (RH) with excellent linearity(correlation coefficient > 0.994). This array structure exhibits unique advantages including easy fabrication process, high batch productivity, and high structural compatibility with various substrate materials. It is anticipated that this device structure will be potentially useful in unique applications including mapping spatial humidity variations over a meso-scale area and implementing flexible humidity sensing element arrays.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.30A no.7
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• pp.82-88
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• 1993

This paper describes fabrication of relative type capacitive pressure sensor to be in great demand for many fields. The fabricated sensor consists of two parts` a sensing diaphragm and a pyrox glass cover. The sensor size is 4.5${\times}3.4mm$^{2})$ and 400$\mu$m thick. To improve the nonlinearity, this sensor is designed a rectangular silicon diaphragm with a center boss structure, and in order to improve the temperature characteristics of the sensor in a packaging process, the sensing element is mounted on the pyrex glass support. Some suggestions toward the design and fabrication of improved sensors have been presented. The zero pressure capacitance, Co of sensor is 26.57pF, and the change of capacitance, ${\Delta}$C is 1.55pF from 0Kgf/Cm$^{2}$ to 1Kgf/Cm$^{2}$ at room temperature. The nonlinearity of the sensor output with center boss diaphragm is 1.29%F.S., and thermal zero shift and thermal sensitivity shift is less than 1.43%F.S./$^{\circ}C$and 0.14% F.S./$^{\circ}C$, respectively.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.16 no.6
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• pp.140-145
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• 2007

To improve productivity of a metal cutting process, it is required to monitor machining stability in real time. Since cutting environment is harsh against sensing conditions due to vibration, chip, and cutting fluid, etc., it is necessary to develop a robust and reliable sensing system for the practical application. In this work, a chatter monitoring system was developed and its effectiveness was proved. Spindle displacement caused by cutting was selected as a main monitoring parameter. A cylindrical capacitive displacement sensor was adopted. Chatter frequencies were identified through modal analysis. To quantify chatter vibrations, chatter correlation coefficient was introduced. The identification of the monitoring system showed a good agreement with the result of experiment.

• Proceedings of the KIEE Conference
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• 2003.07c
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• pp.1529-1531
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• 2003

Thick film mechanical sensors can be categorized into four main areas piezoresistive, piezoelectric, piezocapastive and mechanic tube. In this areas, the thick film strain gage is the earliest example of a primary sensing element based on the substrates. The latest thick film sensor is used various pastes that have been specifically developed for pressure sensor application. The screen printing technique has been used to fabricate the pressure sensors on alumina substrate($Al_2O_3$). Thick film capacitive of strain sensing characteristics are reported and dielectric paste based on (Ti+Ba) materials. The electric property of dielectric paste has been studied and exhibit good properly with good gage factor comparable to piezoresistive strain gage. New piezocapacitive strain sensor was designed and tested. The output of capacitive value was good characteristics.

• The Journal of The Korea Institute of Intelligent Transport Systems
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• v.11 no.4
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• pp.63-69
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• 2012

This paper describes novel scheme of a gray scale capacitive fingerprint image for high-accuracy capacitive sensor chip. The typical gray scale image scheme used a DAC of big size layout or charge-pump circuit of non-volatile memory with high power consumption and complexity by a global clock signal. A modified capacitive detection circuit of charge sharing scheme is proposed, which uses DLC(down literal circuit) based on a neuron MOS(vMOS) and analog simple multiplexor. The detection circuit is designed and simulated in 3.3V, $0.35{\mu}m$ standard CMOS process. Because the proposed circuit does not need a comparator and peripheral circuits, a pixel layout size can be reduced and the image resolution can be improved.