• Title/Summary/Keyword: CVD method

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6H-SiC epitaxial growth and crystal structure analysis (6H-SiC 에피층 성장과 결정구조 해석)

  • Kook-Sang Park;Ky-Am Lee
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • v.7 no.2
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    • pp.197-206
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    • 1997
  • A SiC epilayer on the 6H-SiC crystal substrate was grown by chemical vapor deposition (CVD). The crystal structure of the SiC epilayer was investigated by using the X-ray diffraction patterns and the Roman scattering spectroscopy. The SiC epilayer on the 6H-SiC substrate was grown to be homoepilayer by CVD. In order to distinguish a certain SiC polytype mixed in the SiC crystal grown by the modified Lely method, we have calculated the X-ray diffraction intensities and Brags angles of the typical SiC crystal powders. By comparing the measured X-ray diffraction pattern with the calculated ones, it was identified that the SiC crystal grown by the modified Lely method was the 6H-SiC crystal mixed some 15R-SiC.

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Reactive ion etching characterization of SiC film deposited by thermal CVD method for MEMS application (MEMS 적용을 위한 thermal CVD 방법에 의해 증착한 SiC막의 etching 특성 평가)

  • Choi, Gi-Yong;Choi, Duck-Kyun;Park, Ji-Yeon;Kim, Tae-Song
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2003.07b
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    • pp.868-871
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    • 2003
  • In recent years, silicon carbide has emerged as an important material for MEMS application. In order to fabricate an SiC film based MEMS structure by using chemical etching method, high operating temperature is required due to high chemical stability. Therefore, dry etching using plasma is the best solution. SiC film was deposited by thermal CVD at the temperature of $1000^{\circ}C$ and pressure of 10 torr. SiC was dry etched with a reactive ion etching (RIE) system, using $SF_6/O_2$ and $CF_4/O_2$ gas mixture. Etch rate have been investigated as a function of oxygen concentration in the gas mixture, RF power, and working pressure. Etch rate was measured by surface profiler and FE-SEM. $SF_6/O_2$ gas mixture has been shown high etch rate than $CF_4/O_2$ gas mixture. Maximum etch rate appeared at 450W of RF power. $O_2$ dilute mixtures resulted in an increasing of etch rate up to 40%, and the superior anisotropic cross section was observed.

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Synthesis of Few-layer Graphene Film on a Ni Substrate by Using Filtered Vacuum Arc Source Method

  • Kim, Chang-Su;Seo, Ji-Hun;Gang, Jae-Uk;Kim, Do-Geun;Kim, Jong-Guk;Lee, Hyeong-U
    • Proceedings of the Korean Vacuum Society Conference
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    • 2011.08a
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    • pp.157-157
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    • 2011
  • Graphene has generated significant interest in the recent years as a functional material for electronics, sensing, and energy applications due to its unique electrical, optical, and mechanical properties. Much of the considerable interest in graphene stems from results obtained for samples mechanically exfoliated from graphite. Practical applications, however, require reliable and well-controlled methods for fabrication of large area graphene films. Recently high quality graphene layers were fabricated using chemical vapor deposition (CVD) on nickel and copper with methane as the source of the carbon atoms. Here, we report a simple and efficient method to synthesize graphene layers using solid carbon source. Few-layer graphene films are grown using filtered vacuum arc source (FVAS) technique by evaporation of carbon atom on Ni catalytic metal and subsequent annealing of the samples at 800$^{\circ}$C. In our system, carbon atoms diffuse into the Ni metal layer at elevated temperatures followed by their segregation as graphene on the free surface during the cooling down step as the solubility of carbon in the metal decrease. For a given annealing condition and cooling rate, the number of graphene layers is easily controlled by changing the thickness of the initially evaporated amorphous carbon film. Based on the Raman analysis, the quality of graphene is comparable to other synthesis methods found in the literature, such as CVD and chemical methods.

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The Passivation of GaAs Surface by Laser CVD

  • Sung, Yung-Kwon;Song, Jeong-Myeon;Moon, Byung-Moo;Rhie, Dong-Hee
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.16 no.12S
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    • pp.1242-1247
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    • 2003
  • In order to passivate the GaAs surface, silicon-nitride films were fabricated by using laser CVD method. SiH$_4$ and NH$_3$ were used to obtain SiN films in the range of 100∼300$^{\circ}C$ on p-type (100) GaAs substrate. To determine interface characteristics of the metal-insulator-GaAs structure, electrical measurements were performed such as C-V curves and deep level transient spectroscopy (DLTS). The results show that the hysteresis was reduced and interface trap density was lowered to 1,012 ∼ 1,013 at 100 ∼ 200$^{\circ}C$. According to the study of surface leakage current, the passivated CaAs has less leakage current compared to non-passivated substrate.

Large-area Uniform Deposition of Amorphous Hydrogenated Carbon Films using a Plasma CVD Method (플라즈마 CVD 법을 이용한 대면적 균일한 비정질 탄소 막 증착)

  • Yun, Sang-Min;Yang, Sung-Chae
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.22 no.5
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    • pp.411-414
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    • 2009
  • It has been investigated for the film uniformity and deposition rate of a-C:H films on glass substrate and polymeric materials in the presence of the modulated crossed magnetic field. We used Plasma CVD, i.e, using a crossed electromagnetic field, for uniform depositing thin film. The optimum discharge condition has been discussed for the gas pressure, the magnetic flux density and the distance between substrate and electrodes, As a result, it is found that the optimum discharge conditions are $CH_4$ concentration $CH_4$=10 %, modulated magnetic flux density B=48 Gauss, pressure P=100 mTorr, discharge power supply voltage V=l kV under these experimental conditions. By using these experimental condition, it is possible to prepare the most uniform film extends over about 160 mm of the film width. In this study, we deposited a-C:H thin film on glass substrate, and have a plan that using this condition, study depositing a-C:H thin film on polymeric substrate in next studies.

The deposition characteristics of the diamond films deposited on Si, Inconel 600 and steel by microwave plasma CVD method (마이크로파 플라즈마 CVD 방법으로 Si, Inconel 600 및 Steel 모재위에 증착된 다이아몬드 박막의 증착특성)

  • 김현호;김흥회;이원종
    • Journal of the Korean institute of surface engineering
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    • v.28 no.3
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    • pp.133-141
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    • 1995
  • The deposition characteristics of diamond films were investigated for three different substrates : Si, Inconel 600 and steel. Diamond films were prepared by microwave plasma CVD method using $CH_4$, $H_2$ and $O_2$ as reaction gases. The deposited films were analyzed with SEM, Raman spectroscopy and ellipsometer. For Si substrate, diamond films were successfully obtained for most of the deposition conditions used in this study. As the $CH_4$ flow rate decreased and the $O_2$ flow rate increased, the quality of the film was improved due to the reduced non-diamond phase in the film. For Inconel 600 substrate, the surface pretreatment with diamond powders was required to deposit a continuous diamond film. The films deposited at temperatures of $600^{\circ}C$ and $700^{\circ}C$ had mainly diamond phase, but they were peeled off locally due to the difference in the thermal expansion coefficient between the substrate and the deposited films. The films deposited at $500^{\circ}C$ and $850^{\circ}C$ had only the graphitic carbon phase. For steel substrate, all of the films deposited had only the graphitie carbon phase. We speculated that the formation of diamond nuclei on the steel substrate was inhibited due to the diffusion of carbon atoms into the steel substrate which has a large amount of carbon solubility.

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Optimization of inlet concentration condition for uniform film growth in a cylindrical CVD chamber (원통형 화학증착로에서 균일한 박막형성을 위한 입구 농도분포의 최적화)

  • Jo, Won-Guk;Choe, Do-Hyeong;Kim, Mun-Eon
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.22 no.2
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    • pp.173-183
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    • 1998
  • An optimization procedure to find the inlet concentration profile that yields the most uniform deposition rate in a cylindrical CVD chamber has been developed. Assuming that the chemical reaction time is negligibly small, a SIMPLE based finite-volume method is adopted to solve the fully elliptic equations for momentum, temperature, and concentration. The inlet concentration profile is expressed by a linear combination of Chebyshev polynomials and the coefficients of which are determined by the local random search technique. It is shown that the present method is very effective in improving the uniformity of the deposition rate, especially when Re is high and/or the wafer is placed close to the inlet. The optimal profiles have been obtained for various Re, Gr, and geometry combinations.

Material and Structure Optimization of Substrate Support for Improving CVD Equipment Up Time (CVD 장비 Up Time 향상을 위한 기판 지지대의 재질 및 구조 최적화)

  • Woo, Ram;Kim, Won Kyung
    • Korean Journal of Materials Research
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    • v.29 no.11
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    • pp.670-676
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    • 2019
  • We study substrate support structures and materials to improve uptime and shorten preventive maintenance cycles for chemical vapor deposition equipment. In order to improve the rolling of the substrate support, the bushing device adopts a ball transfer method in which a large ball and a small ball are mixed. When the main transfer ball of the bushing part of the substrate support contacts the substrate support, the small ball also rotates simultaneously with the rotation of the main ball, minimizing the resistance that can be generated during the vertical movement of the substrate support. As a result of the improvement, the glass substrate breakage rate is reduced by more than 90 ~ 95 %, and the equipment preventive maintenance and board support replacement cycles are extended four times or more, from once a month to more than four months, and the equipment uptime is at least 15 % improved. This study proposes an optimization method for substrate support structure and material improvement of chemical vapor deposition equipment.

The Fabrication of the Cu(In,Ga)Se2 Absorber Layer Using Binary Precursor Films Deposited by Chemical Vapor Deposition (화학기상증착된 이원계 화합물 프리커서를 이용한 Cu(In,Ga)Se2 흡수층의 제조)

  • Lee, Gyeong A;Kim, A Hyun;Cho, Sung Wook;Lee, Kang-Yong;Jeon, Chan-Wook
    • Current Photovoltaic Research
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    • v.9 no.4
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    • pp.137-144
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    • 2021
  • In this study, the microstructure of the CVD-fabricated Cu(In,Ga)Se2 (CIGSe) absorber layer by simulating the stacking sequence used in a co-evaporation method, and changes solar cell performance were investigated. The absorber layer prepared by stacking CuSe and (In,Ga)Se between InSe is separated into Ga-free CuInSe2 and Ga-rich CIGSe, and transformed to CIGSe by selenization heat treatment with slight improvement in the the solar cell efficiency. However, in CVD, since the supply of liquid Cu-Se is not as active as in the co-evaporation method, the nanoocrystalline layer containing a large amount of Ga remained independently in the absorption layer, which acted as a cause of the loss of JSC and FF. Therefore, by using a precursor structure in which CuGa is sputter-deposited on a single layer of InSe deposited by CVD, performance parameters of VOC, JSC, and FF could be greatly improved.

Surface Modification of Latex with Parylene by Chemical Vapor Deposition (화학기상증착법의 Parylene 코팅에 의한 천연 라텍스 표면개질)

  • Song, Jeom-Sik;Choi, Seo-Yoon;Jung, Seong-Hee;Cha, Gook-Chan;Lee, Suk-Min;Mun, Mu-Seong
    • Elastomers and Composites
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    • v.39 no.4
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    • pp.301-308
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    • 2004
  • Three types of parylene (PA-N, PA-C, PA-D) were used for coating the surface on natural latex rubbers in order to improve surface characteristics including mechanical properties and biocompatibility. The parylene coating was the CVD (chemical vapor deposition) method, and the surface properties of the modified latex were measured. Annealing effects on the mechanical properties of the coated latex were also investigated. The adhesion between latex and parylene was good for all the types of parylene used. As annealing temperature was increased, latex modified with PA-N became more hydrophobic, while the latex treated with PA-C and PA-D became more hydrophilic. As the annealing temperature was raised, the tensile strength was increased, and the elongation was decreased. The biocompatibility was noticeably improved on the latex surface modified with the parylenes through CVD method.