• Journal of the Korean Society of Safety
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• v.27 no.5
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• pp.1-8
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• 2012

The purpose of this study were to evaluate the dynamic characteristics of the portable slipmeters with respect to actual slipping and to compare their output with those of force platform. The selected slipmeters were commonly used devices for slipperiness measurement in situ floors. Their output quantity represented force (BOT-3000), loss of energy(British pendulum striker) and angle of inclination(English XL). The validity of these devices was studied with respect to actual slipping using a force platform. The precision of these devices was also evaluated with force platform. Based on dynamics of human subject behavior when slipping during normal walking, the all devices tested in this study showed poor performances: low built up ratio, low normal pressure, and long contact time prior to slip. Nevertheless, their results reasonably correlated with those calculated from the ground reaction forces generated by the operation of the selected slipmeters on the force platform although the absolute values of COF from these three devices could be quite different. Also the results showed good repeatability under the some test conditions.

• Journal of the Korean Society of Safety
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• v.27 no.5
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• pp.185-189
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• 2012

While there is no standards on slip risk for contaminants on surface, glycerol is described in standard contaminant for measuring coefficient of friction(COF) and slip resistance such as ISO 13287. But that is just used to measure the slip resistance of surface materials and shoes not to evaluate the contaminant materials. Therefore the objective of this study was to find out the relationship between standard contaminant and the contaminants used usually at the workplaces. For this, some measurement criteria were acquired from the analysis based on biomechanics and kinetics of human gait during slips. The slip resistance according to viscosity of the contaminants was measured applying the criteria and slip probability was determined by the gait analysis. Some factors which should be considered when measuring the slip resistance were identified. The velocity, acceleration, contact time and contact pressure should be 1 m/sec, 10 $m/sec^2$, 350 kPa and less than 0.5sec respectively. The variation of viscosity according to temperature for working oils was different from that of standard contaminant. The static coefficient of friction (SCOF) of working oils was almost 0.5 times as large as the SCOF of standard contaminant. So it was assumed to be difficult to compare the contaminants at the workplaces with the glycerol as a standard contaminant for estimating the slip risk.

• Korean Journal of Microbiology
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• v.30 no.6
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• pp.450-455
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• 1992

Five strains of the fast-growing endosymbionts were isolated from the nodules of Lotus eorniculatus var. japonicus inhabited in Taejeon. From morphological and physiOlogical characteristics and nodulation test, the isolated strains were identified as Rhizobium loti. Compared to the control plant, both Lotus cornieulatus var. japonieus and Lotus corniculatus seedlings inoculated with the isolated strains. grew normally due to effective root nodule. The reisolated endosymbiont from the induced root nodule was confirmed identical to those of the first isolates by investigating antibiotic resistance and morphological characteristics. Three strains among the isolates. R. loti TUS I. TUS5 and TUS6 produced a ca1cof1uorbinding exopolysaccharide.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.11a
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• pp.120-124
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• 2004

본 연구는 Diluted Ceria 입자를 사용한 $SiO_2$(Oxide) CMP 현상에 대한 내용이다. Ceria Slurry의 경우 Silica Slurry와 비교하였을 때 Oxide Wafer 표면과 축합 화학반응을 일으키며 Chemistry Dominant한 CMP Mechanism을 따르고, Wafer Center Removal Rate(RR) Fast 의 특성을 가진다. Ceria Slurry의 문제점인 연마 불균일도를 해결하기 위해 Tribological System을 이용하였다. CMP Tribology는 Pad-Slurry 유막-Wafer의 System을 가지며 윤활막에 작용하는 마찰계수(COF)가 주요 인자이다. Tribology에 적용되는 Stribeck Curve를 통해 Slurry 윤활막의 두께(h) 정도를 예상할 수 있으며, 이 윤활막의 두께를 조절함으로써 Uniformity 향상이 가능하다. 이 Ceria Slurry CMP의 연마 불균일도를 향상시킬 수 있는 방법으로 pH 조절 및 점도 증가가 있다. Ceria 입자 CMP는 분산액의 pH 변화에 강한 작용을 받게 되며 PH5 근방에서 최적화된 Uniformity가 가능하다. 점도를 증가시키는 경우 유막 h가 증가하게 되어 Ceria Slurry의 유동이 균일 분포 상태에 가까워지며 Wafer Uniformity 향상이 가능하다.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2008.11a
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• pp.15-16
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• 2008

In case manufacturing COF, through hole should be made to be used for a pathway connecting the conductive layers of its both faces. In case Cu-plating inside of through hole with electroless plating way, contact between Cu and PI film gets bad to be fell apart from PI by the impact of applying to the electric devices. Therefore, after sputtering is applying on inner through hole, then a method to perform electroplating process. In this study, after changing sputtering condition to manufacture FCCL, we looked the changeability of the upper PI and inner hole Cu layers. Making use of RF Magnetron sputtering equipment, we coated Cu thin film and Cu-plated on it through electroplating. After cold-mounting the completed FCCL, we examined hole section through an optical microscope. From the result of test, with parameters deposition pressure and deposition time, both the thickness of the hole plated layer and PI plated upper layer increased at regular rate, increasing the thickness of Cu sputter layer. However, from the result of test in increasing RF-power, we could know the increment rate of hole plated layer is considerably greater than that of PI plated upper layer. Therefore, we finally acquired good result; if you want only to increase the plated layer of inner hole, it's much better to increase RF-power.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.07a
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• pp.227-230
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• 2004

As the organic acids were added in the slurry, zeta potential of alumina was changed to negative value and IEP value was shifted from alkaline to acidic pH. In citric acid based slurry, Cu surface continuously dissolved and etching depth linearly increased. On the contrary, passivation layer was grown on Cu surface in oxalic acid based slurry. As the platen rotation speed increased, Preston coefficient decreased in both slurries. With oxalic acid based slurry, at low velocity, removal rate is high value because of high friction force compared to citric acid based slurry. As platen velocity increased, removal of Cu in citric acid based slurry became higher value than oxalic acid based slurry. Typical lubrication behaviors were observed in both slurries. As Sommerfeld number increased, COF values gradually decreased and then re-increased. It indicated that lubrication was changed to direct contact or semi-direct contact mode to hydro-lubrication mode.

• Korean Chemical Engineering Research
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• v.51 no.2
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• pp.171-180
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• 2013

Metal organic frameworks (MOFs) are a class of crystalline organic-inorganic hybrid compounds formed by coordination of metal clusters or ions with organic linkers. MOFs have recently attracted intense research interest due to their permanent porous structures, large surface areas and pore volume, high-dispersed metal species, and potential applications in gas adsorption, separation, and catalysis. $CO_2$ adsorption in MOFs has been investigated in two areas of $CO_2$ storage at high pressures and $CO_2$ adsorption at atmospheric pressure conditions. In this short review, $CO_2$ adsorption/separation results using MOFs conducted in our laboratory was explained in terms of four contributing effects; (1) coordinatively unsaturated open metal sites, (2) functionalization, (3) interpenetration/catenation, and (4) ion-exchange. Zeolitic imidazolate frameworks (ZIFs) and covalent organic frameworks (COFs) were also considered as a candidate material.

• Korean Journal of Environment and Ecology
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• v.19 no.3
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• pp.269-278
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• 2005

The dynamics and distribution characteristics of Coryjopsis coreana popujation at Cheongsogol, Sunchon, Cholanam-do, Korea, were investigated. The Coryiopsis coreana pop ulation was distributed along the forest edge and it showed characteristics which were distributed on only directional slopes of the north, northeast or northwest. The Coryjopsis coreana constituted subtree or shrub layer in the forest, and its floristic composition was basically similar to those of adjacent areas where the species does not exist. The number of stump was 6.25 per $25\;m^2$, and each stump had 3 sproutings in average. The density of the Corylopsis coreana population in the study area was lower than that in other area, which suggests the population is declining in the study area.

• Korean Journal of Materials Research
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• v.22 no.9
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• pp.454-458
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• 2012

Various adhesive materials are used in flip chip packaging for electrical interconnection and structural reinforcement. In cases of COF(chip on film) packages, low temperature bonding adhesive is currently needed for the utilization of low thermal resistance substrate films, such as PEN(polyethylene naphthalate) and PET(polyethylene terephthalate). In this study, the effects of anhydride and dihydrazide hardeners on the low-temperature snap cure behavior of epoxy based non-conductive pastes(NCPs) were investigated to reduce flip chip bonding temperature. Dynamic DSC(differential scanning calorimetry) and isothermal DEA(dielectric analysis) results showed that the curing rate of MHHPA(hexahydro-4-methylphthalic anhydride) at $160^{\circ}C$ was faster than that of ADH(adipic dihydrazide) when considering the onset and peak curing temperatures. In a die shear test performed after flip chip bonding, however, ADH-containing formulations indicated faster trends in reaching saturated bond strength values due to the post curing effect. More enhanced HAST(highly accelerated stress test) reliability could be achieved in an assembly having a higher initial bond strength and, thus, MHHPA is considered to be a more effective hardener than ADH for low temperature snap cure NCPs.

• Journal of Korea Multimedia Society
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• v.12 no.1
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• pp.147-155
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• 2009

Occlusion force measuring and analysis is a diagnostic method of tooth dynamics through the related force analysis. In this paper, we design and implement a series of occlusion force measuring software and evaluate its utility as a base system for a new occlusion force measure and analysis system development. For the reason, we developed a group of tools to measure the normal and abnormal occlusion force. Firstly, we have visualized the occlusion force distribution with quantitative figures. The center of force (COF) variation was visualized the path of marker according to teeth dynamics and the distribution of occlusion forces in 14 tooth regions. Secondly, we have implemented a left and right tooth force balance measurement ratio tool to estimate a specific tooth region force. Furthermore, the measured occlusion force variation recorded in the software each 0.5 second. As the result of the physical examination by the accessed hardware of sensor sheet method, we confirmed the distribution and balance of forces effectively.