• Journal of IKEEE
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• v.7 no.1 s.12
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• pp.72-79
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• 2003

Classical designs of optical transimpedance preamplifier for p-i-n photodiode receiver circuits generally employ common source transimpedance input stages. In this paper, we explore the design of a class of current-mode optical transimpedance preamplifier based upon common gate input stages. A feature of current-mode optical transimpedance preamplifier is high gain and high bandwidth. The bandwidth of the transimpedance preamplifier can also be increased by the capacitive peaking technique. In this paper we included the development and application of a circuit analysis technique based on the minimum noise. We develop a general formulation of the technique, illustrate its use on a number of circuit examples, and apply it to the design and optimization of the low-noise transimpedance amplifier. Using the noise minimization method and the capacitive peaking technique we designed a transimpedance preamplifier with low noise, high-speed current-mode transimpedance preamplifier with a 1.57GHz bandwidth, and a 2.34K transimpedance gain, a 470nA input noise current. The proposed preamplifier consumes 16.84mW from a 3.3V power supply.

• Proceedings of the IEEK Conference
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• 2000.06b
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• pp.270-273
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• 2000

We have fabricated and analyzed photodiodes for optical link with Si pin structures. As the results of experiment, the web patterned photodiode(type C) with $p^{+}$-guard ring showed low junction capacitance of 6~7 pF at $V_{R}$=-5V and high separation ability for optical signal(dark current : $\leq$ 5 nA, optical signal current : $\geq$ 340 nA) due to the small effective $p^{+}$-n junction area and the expanded electric field region. The fabricated Si pin photodiode can be applicable for detecting an optical signal with the wavelength of about 660~670 nm. It can also be integrated with the twin well CMOS structure to develope an one chip based optical receiver IC. IC.C.

• Journal of Sensor Science and Technology
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• v.27 no.1
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• pp.6-12
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• 2018

In this paper, a 32-variable pulse position modulation (32-VPPM) scheme is proposed to support a red-green-blue light-emitting-diode (RGB-LED)-based optical camera communication (OCC) system. Our proposed modulation scheme is designed to enhance the OCC data transmission rate, which is targeted for the wearable biomedical data monitoring system. The OCC technology has been utilized as an alternative solution to the radio frequency (RF) wireless system for long-term self-healthcare monitoring. Different biomedical signals, such as electrocardiograms, photoplethysmograms, and respiration signals are being monitored and transmitted wirelessly from the wearable biomedical device to the smartphone receiver. A common 30 frames per second (fps) smartphone camera with a CMOS image sensor is used to record a transmitted optical signal. Moreover, the overall proposed system architecture, modulation scheme, and data demodulation are discussed in this paper. The experimental result shows that the proposed system is able to achieve > 9 kbps using only a common smartphone camera receiver.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.39B no.7
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• pp.440-448
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• 2014

A $4{\times}10$ Gb/s Transimpedance Amplifier (TIA) array is implemented in $0.13{\mu}m$ CMOS process technology, which will be used in the receiver of TWDM-PON system. A technology for bandwidth enhancement of a given $4{\times}10$ Gb/s TIA presented under inductor peaking technology and a single 1.2V power supply based low voltage design technology. It achieves 3 dB bandwidth of 7 GHz in the presence of a 0.5 pF photodiode capacitance. The trans-resistance gain is $50dB{\Omega}$, while 48 mW/ 1channel from a 1.2 V supply. The input sensitivity of the TIA is -27 dBm. The chip size is $1.9mm{\times}2.2mm$.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.41 no.9
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• pp.11-17
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• 2004

This paper describes the implementation of monolithic optical transceiver circuitry being used as a part of the fiber optic modules. It has been fabricated in 0.6 ${\mu}{\textrm}{m}$ 2-poly 3-metal silicon CMOS analog technology and operates at 155.52 Mbps(STM-1) data rates. It drives laser diode to transmit intensity modulated optical signal according to 155.52 Mbps electrical data from system. Also, it receives 155.52 Mbps optical data that transmitted from other systems and converts it to electrical data using photo diode and amplifier. To avoid noise and interference between transmitter and receiver on one chip, layout techniques such as special placement, power supply separation, guard ring, and protection wall were used in the design. The die area is 4 ${\times}$ 4 $\textrm{mm}^2$, and it has 32.3 ps rms and 335.9 ps peak to peak jitter on loopback testing. the measured power dissipation of whole chip is 1.15 W(230 mW) with a single 5 V supply.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.26 no.12C
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• pp.249-254
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• 2001

A receiver ASIC for fiber optic modules of STM-1 optical communication has been fabricated with 0.65 $\mu\textrm{m}$ CMOS technology. The ASIC has a limit amplifier circuit for the 155.52 Mbps data reshaping, and a clock extraction circuit for the 155.52 MHz clock recovery. The ASIC has an acquisition aid and LOS monitoring circuit for properly operation with near 155.52 MHz clock frequency in case of the data loss due to transmission line open or data transfer fail. Measured results show that the circuit reshapes data from 5 mV to 1 V wide range of input voltage condition, add it recovers system clock with stable on any condition.

• Journal of the Institute of Convergence Signal Processing
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• v.3 no.1
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• pp.27-32
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• 2002

In this study, we fabricated the advanced telemetry system that transmitting media use radio frequency(RF) for the middle range measurement of the physiological signals and receiving media use optical for electromagnetic interference problem. The telemetry system within a size of 65$\times$125$\times$45mm consists of three parts: RF transmitter, optical receiver and physiological signal processing CMOS one chip. Advantages of proposed telemetry system is wireless middle range(50m) FM transmission, reduce electromagnetic interference to a minimum which enables a comfortable bed-side telemetry system. The monitoring system was designed in the structure of dual-processor for the real time processing. The use of the one channel in our study made it possible the real time wavelet transformation of electrocardiogram data of 360Hz, 16 bits for every 1.42 seconds.

• Proceedings of the Korea Information Processing Society Conference
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• 2005.05a
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• pp.1641-1644
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• 2005

현재의 인터넷과 같은 전자 통신망과 멀티미디어 시스템의 발달은 고속의 대용량 데이터 전송을 필요로 한다. 초고속 통신 시스템에서의 고속 데이터 전송은 주로 광섬유를 사용하는 광통신으로 이루어지고 있다. FTTH(Fiber To The Home)와 같은 광통신 시스템은 멀티미디어 커뮤니케이션을 위해 필요한 큰 데이터 전송률을 제공할 수 있기 때문에 더욱 더 중요성이 높아지고 있으며 이러한 광통신 시스템에서는 통신환경의 영향을 적게 받고 외부 조절이나 부품이 필요하지 않는 수신기 IC 의 개발이 요구되고 있다. 일반적으로 광통신 수신기에는 고속 동작에 적합한 특성을 가진 GaAs-MESFET 가 사용되고 있으나, 본 논문에서는 0.35um CMOS 2-poly 4-metal 공정을 이용하여 5Gbps 광수신기를 설계하였다. 설계된 수신기는 Preamplifier, Main amplifier, ABC 회로로 구성되어 있다. Transimpedance amplifier 형태의 Preamplifier 는 광검출기에 의해 생성된 전류 신호를 전압 신호로 변환한다. ABC 회로는 Peak_Hold 회로와 Bottom_Hold 회로로 구성되어 있다. 기존의 Peak_Hold 회로에서는 다이오드와 hold capacitor 를 이용하여 peak 값을 검출하도록 되어 있는데, 다이오드를 이용하는 경우 작은 입력 신호전압의 Peak 값을 검출하는 데 한계가 있다. 이러한 단점을 보완하고자 전류 거울형태의 Peak_Hold 회로를 설계하였다. 전류거울(current mirror)형태의 출력 신호의 duty error 를 줄이고 비트 에러율(Bit Error Rate)을 개선하는데 효과적이었다. 설계된 광수신기는 30dB 의 입력 dynamic range 와 입력 capacitance 3pF 에서 80MHz 의 대역폭을 가진다. 전력 소비량은 3.3V 전원 전압이 인가된 경우 약 150mW 정도이다.

• Journal of the Institute of Electronics and Information Engineers
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• v.50 no.12
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• pp.40-48
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• 2013

This paper presents multi-channel transimpedance amplifier(TIA) arrays in short-range LADAR systems for unmanned vehicles, by using a 0.18um CMOS technology. Two $4{\times}4$ channel TIA arrays including a voltage-mode INV-TIA and a current-mode CG-TIA are introduced. First, the INV-TIA consists of a inverter stage with a feedback resistor and a CML output buffer with virtual ground so as to achieve low noise, low power, easy current control for gain and impedance. Second, the CG-TIA utilizes a bias from on-chip bandgap reference and exploits a source-follower for high-frequency peaking, yielding 1.26 times smaller chip area per channel than INV-TIA. Post-layout simulations demonstrate that the INV-TIA achieves 57.5-dB${\Omega}$ transimpedance gain, 340-MHz bandwidth, 3.7-pA/sqrt(Hz) average noise current spectral density, and 2.84mW power dissipation, whereas the CG-TIA obtains 54.5-dB${\Omega}$ transimpedance gain, 360-MHz bandwidth, 9.17-pA/sqrt(Hz) average noise current spectral density, and 4.24mW power dissipation. Yet, the pulse simulations reveal that the CG-TIA array shows better output pulses in the range of 200-500-Mb/s operations.