• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.16 no.9
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• pp.765-770
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• 2003

We have developed a low-temperature, and low-pressure radical induced oxidation (RIO) technology, so that high-quality ultrathin silicon dioxide layers have been effectively produced with a high reproducibility, and successfully employed to realize high performace SiGe heterostructure complementary MOSFETs (HCMOS) lot the first time. The obtained oxide layer showed comparable leakage and breakdown properties to conventional furnace gate oxides, and no hysteresis was observed during high-frequency capacitance-voltage characterization. Strained SiGe HCMOS transistors with a 2.5 nm-thick gate oxide layer grown by this method exhibited excellent device properties. These suggest that the present technique is particularly suitable for HCMOS devices requiring a fast and high-precision gate oxidation process with a low thermal budget.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.317-318
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• 2012

현재의 반도체 산업에서 Hafnium oxide와 Hafnium silicates같은 high-k 물질은 CMOS gate와 DRAM capacitor dielectrics로 사용하기 위한 대표적인 물질에 속한다. MOSFET (metal oxide semiconductor field effect transistor)구조에서 gate length는 16 nm 이하로 계속 미세화가 연구 중이고, 또한 gate는 기존구조에서 Multi-gate구조로 다변화가 일어나고 있다. 이를 통해 게이트 절연막은 그 구조와 활용범위가 다양해지게 될 것이다. 동시에 leakage current와 dielectric break-down을 감소시키는 연구가 중요해지고 있다. 그러나 나노 영역에서의 기계적 특성에 대한 연구는 전무한 상태이다. 따라서 복잡한 회로 공정, 다양한 Multi-gate 구조, 신뢰도의 향상을 위해서는 유전박막 물질자체와 계면에서의 물리적, 기계적인 특징의 측정이 상당히 중요해지고 있다. 이에 본 연구는 Nano-indenter의 통해 경도(Hardness)와 탄성계수(Elastic modulus) 등의 측정을 통하여 시료 표면의 나노영역에서의 기계적 특성을 연구하고자 하였다. $HfO_2$게이트 절연막은 rf magnetron sputter를 이용해 Si (silicon) (100)기판위에 박막형태로 증착하였고, 이후 furnace에서 질소분위기로 온도(400, 450, $500^{\circ}C$)를 달리하여 20분 열처리를 하였다. 또한 Weibull distribution을 이용해 박막의 characteristic value를 계산하였으며, 실험결과 열처리 온도가 $400^{\circ}C$에서 $500^{\circ}C$로 증가함에 따라 경도와 탄성계수는 7.4 GPa에서 10.65 GPa으로 120.25 GPa에서 137.95 GPa으로 각각 증가하였다. 이는 재료적 측면으로 재료의 구조적 우수성이 증가된 것으로 판단된다.

• Journal of the Korean Institute of Telematics and Electronics C
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• v.35C no.4
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• pp.21-29
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• 1998

As silicon geometry shrinks into deep submicron and the operating speed icreases, higher accuracy is required in the analysis of the propagation delays of the gates and interconnects in an ASIC. In this paper, the driving characteristics of a CMOS gate is represented by a gatedriver model, consisting of a linear resistor $R_{dr}$ and an independent ramp voltage source $V_{dr}$ . We drivered $R_{dr}$ and $V_{dr}$ as the functions of the timing data representing gate driving capability and an effective capacitance $C_{eff}$ reflecting resistance shielding effect by interconnet circuits. Through iterative applications of these equations and AWE algorithm, $R_{dr}$ , $V_{dr}$ and $C_{eff}$ are comuted simulataneously. then, the gate delay is decided by $C_{eff}$ and the interconnect circuit delay is determined by $R_{dr}$ and $V_{dr}$ . this process has been implemented as an ASIC timing analysis program written in C language and four real circuits were analyzed. In all cases, we found less than 5% of errors for both of gate andinterconnect circuit delays with a speedup factor ranging from a few tens to a few hundreds, compared to SPICE.SPICE.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.40 no.10
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• pp.24-31
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• 2003

Short channel effects (SCE) of bulk MOSFET with super-steep retrograded channels (SSR), fully-depleted SOI, and double-gate MOSFET have been analyzed using a evanescent-mode analysis. Analytical equations of the characteristics scaling-length (λ) for three structures have been derived and the accuracy of the calculated λ was verified by comparing to the device simulation result. It is found that the minimum channel length should be larger than 5λ and the depletion thickness of the SSR should be around 30 nm in order to be applicable to 70 nm CMOS technology. High-$textsc{k}$ dielectric shows a limitation in scaling due to the drain-field penetration through the dielectric unless the equivalent SiO2 thickness is very thin.

• The Journal of the Korea Contents Association
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• v.6 no.11
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• pp.225-234
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• 2006

In this paper, we design a combined security processor, ECC, MD-5, and AES, as a SIP for cryptography of securing contents. Each SIP is modeled and designed in VHDL and implemented as a reusable macro through logic synthesis, simulation and FPGA verification. To communicate with an ARM9 core, we design a BFM(Bus Functional Model) according to AMBA AHB specification. The combined security SIP for a platform-based SoC is implemented by integrating ECC, AES and MD-5 using the design kit including the ARM9 RISC core, one million-gate FPGA. Finally, it is fabricated into a MPW chip using Magna chip $0.25{\mu}m(4.7mm{\times}4.7mm$) CMOS technology.

• Journal of the Institute of Electronics Engineers of Korea CI
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• v.38 no.6
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• pp.82-92
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• 2001

This paper describes implementation of an embedded 32-Bit RISC core for portable communication/information equipment, such as cellular phones, PDA(Personal Digital Assistants), notebook, etc. The RISC core implements the ARM$\circled$V 4 instruction set, operates with typical 5-stage pipeline. It supports Thumb code to improve the code density, and uses the dynamic power management method of pipeline registers. It was modeled and simulated in RTL level using VHDL, and verified with ARMulator of ADS (Arm Developer Suite) and had average CPI of 1.44. The core is synthesized automatically using the cell library based on $0.6{\mu}m$ CMOS 1-poly 3-metal CMOS technology. It consists of about 41,000 gates and the clock frequency is expected to be above 45 MHz.

• Journal of the Semiconductor & Display Technology
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• v.21 no.1
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• pp.50-55
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• 2022

Due to the wavelength shift problem of micro LED caused by the change of current density, the active matrix driving pixel circuit that is used in OLED cannot be applied to micro LED displays. Therefore, we need a gray scale method based on modulation of duration time of light emission. In this study, we propose the PWM-controlled micro LED pixel circuit based on CMOS thin film transistors (TFTs). By adopting CMOS inverter structure, we can reduce the number of storage capacitors from the circuit and make the operating speed of the circuit faster. Most of all, our circuit is designed to make operating speed of PWM circuit faster by adopting feedback effect through double gate TFT structure. As a result, it takes about 4.7ns to turn on the LED and about 5.6ns to turn it off. This operating time is short enough to avoid the color distortion and help the precise control of the gray scale.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.42 no.12
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• pp.1-8
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• 2005

The gate length-dependence of cutoff frequency is modeled by using scaling parameter equations of equivalent circuit parameters extracted from measured S-parameters of Nano-scale MOSFETs. It is observed that the modeled cutoff frequency initially increases with decreasing gate length and then the rate of increase becomes degraded at further scale-down. This is because the extrinsic charging time slightly decreases, although the intrinsic transit time greatly decreases with gate length reduction. The new gate length-dependent model will be very helpful to optimize RF performances of Nano-scale MOSFETs.

• Journal of the Institute of Electronics and Information Engineers
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• v.52 no.2
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• pp.112-118
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• 2015

Conventional synchronous circuits cannot keep the circuit performance, and cannot even guarantee correct operations under the influence of PVT variations and aging effects in the nanometer regime. Therefore, in this paper, a DI (delay insensitive) design based NCL (Null Convention Logic) design methodology with a very simple design structure has been used to design digital systems, which is one of well-known asynchronous design methods robust to various variations and does not require any timing analysis. Because circuit-level structures of conventional NCL gates have weakness of low speed, high area overhead or high wire complexity, this paper proposes a new lNCL gates designed at the transistor level for high-speed, low area overhead, and low wire complexity. The proposed NCL gate libraries have been compared to the conventional NCL gates in terms of circuit delay, area and power consumption using a asynchronous multiplier implemented in dongbu 0.11um CMOS technology.

• Journal of IKEEE
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• v.8 no.1 s.14
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• pp.54-62
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• 2004

In this paper, we discuss on the design of a current mode CMOS multiplier circuit over $GF(3^m)$. Using the standard basis, we show the variation of vector representation of multiplicand by multiplying primitive element α, which completes the multiplicative process. For the $GF(3^m)$ multiplicative circuit design, we design GF(3) adder and multiplier circuit using current mode CMOS technology and get the simulation results. Using the basic gates - GF(3) adder and multiplier, we build the $GF(3^m)$ multiplier circuit and show the examples for the case m=3. We also propose the assembly of the operation blocks for a complete $GF(3^m)$ multiplier. Therefore, the proposed circuit is easily extensible to other p and m values over $GF(p^m)$ and has advantages for VLSI implementation. We verify the validity of the proposed circuit by functional simulations and the results are provided.