• 한국세라믹학회지
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• 제40권2호
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• pp.167-171
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• 2003

기계적 방법으로 합성된 CeO$_2$분말을 연마입자로 하여 STI용 CMP 슬러리를 제조하였다. 연마입자는 정전기적 방법과 입체적 방법으로 수계에서 안정화시킬 수 있었으며, 장기 안정성을 위해서는 입체적 방법에 의한 안정화가 유효하였다. 50$0^{\circ}C$와 $700^{\circ}C$에서 합성된 CeO$_2$를 이용하여 CMP 슬러리를 제조하고, SiO$_2$와 Si$_3$N$_4$가 블랭킷 형태로 증착된 웨이퍼를 연마한 결과 연마능률과 선택비는 연마입자의 합성조건과 분산 안정성, 슬러리의 pH 등에 의해 영향을 받았다.

• 한국전기전자재료학회논문지
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• 제27권2호
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• pp.85-90
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• 2014

Ag paste has been used in the front electrode of the Si-solar cell. It is composed by Ag powder, glass frit, binder, solvent and dispersant. The role of the binder and the solvent is to make a flow and a printing property. However, it was not enough to report the printing properties with the variation of binder in the controled viscosity. In this study, we selected 3 kinds of typical binder which were used as binder for the paste in the industry, such as Ethyl cellulose, Hydroxypropyl cellulose and Acrylic. Ag pastes using these were prepared, controled viscosity and printed on the SiNx coated Si wafer. In the 'A paste' used Acrylic binder, printed hight was highest and 'H paste' used Hydroxypropyl cellulose binder was lowest. Because 'H paste' was high viscosity due to the molecular weight, the solvent was added in the paste to control the viscosity. Therefore, the content of solid was lower in 'H paste'. The relative pattern width which is related to the spreading of paste was the best in the case of 'H paste' and 'EH paste' at $30^{\circ}C$. It is thought that the optimization of the relative pattern width is possible for a paste by the controling shear thinning phenomenon. In the case of 'A paste', though printing hight was best, the pattern width was dependant on the temperature.

• 자원리싸이클링
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• 제18권4호
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• pp.62-69
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• 2009

반도체 웨이퍼 제조 공정 중 발생하는 질산, 불산, 초산으로 구성된 혼합폐산을 재활용하기 위한 연구를 수행하였다. 초기에 $NaNO_3$와 Si powder를 사용하여 불산을 $Na_2SiF_6$로 침전시켜 불소화합물을 제조하였고, 이 때 혼산 중 불산의 농도는 초기 127g/L에서 0.5g/L로 낮아져 불산 회수율은 99.5%였다. $Na_2SiF_6$ 제조 후 남은 혼산의 질산과 초산의 농도는 각각 502g/L, 117g/L였고, 이 혼산에 NaOH를 투입하여 pH=4로 맞춘 후 -440 mmHg, $95^{\circ}C에서 증발농축을 하여 초산 분리 회수하였다. 회수된 초산의 농도는 약 15%였고, 회수율은 85.3% 이상이었다. 또한, 농축여액을 $20^{\circ}C$까지 냉각하여 $NaNO_3$ 결정을 석출시킴으로 질산나트륨을 제조하였고, 그 회수율은 약 93%이상이었다. 제조된 $Na_2SiF_6$와 $NaNO_3$를 $90^{\circ}C$에서 건조시킨 후, XRD 분석한 결과, 순수 $Na_2SiF_6$와 $NaNO_3$만 합성된 것을 확인하였고, 그 순도는 각각 약 97%, 98%로 시판용과 유사하였다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2011년도 제40회 동계학술대회 초록집
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• pp.328-328
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• 2011

Wetting phenomena have been heavily studied for industrial and academic researches especially tuning the wettability between hydrophilicity and hydrophobicity. Wicking through the surface texture is shown on superhydrophilic surface while rolling (or dewetting) on the patterns of superhydrophobic surface. These wetting phenomena are known to be affected by surface wettability determined with physical surface patterns as well as chemical composition of surface layer. In this research, we introduce a method to control the wettability of a thin C-SiOx film from hydrophobic to hydrophilic using a mixture gas of HMDSO/$O_2$ by plasma polymerization with rf-CVD (radio frequency-Chemical Vapor Deposition). Wettability was finely controlled by changing the ratio of HMDSO/$O_2$. Hydrophilicity increased as the ratio decreased, while hydrophobicity was enhanced by the ratio. Moreover, fine control from superhydrophilicity to superhydrophobicity was achieved by C-SiOx coating on the Si wafer with prepatterns of submicron-sized pillar array formed by $CF_4$ plasma etching.

• 한국표면공학회지
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• 제47권2호
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• pp.75-80
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• 2014

Nanocrystalline diamond(NCD) films on steel(SKH51) has been investigated using SiC interlayer film. SiC was deposited on SKH51 or Si wafer by RF magnetron sputter. NCD was deposited on SiC at $600^{\circ}C$ for 0.5~4 h employing microwave plasma CVD. Film morphology was observed by FESEM and FIB. Film adherence was examined by Rockwell C adhesion test. The growth rate of NCD on SiC/Si substrate was much higher than that on SiC/SKH51. During particle coalescence, NCD growth rate was slow since overall rate was determined by the diffusion of carbon on SiC surface. After completion of particle coalescence, NCD growth became faster with the reaction of carbon on NCD film controlling the whole process. In the case of SiC/SKH51 substrate, a complete NCD film was not formed even after 4 h of deposition. The adhesion test of NCD/SiC/SKH51 samples revealed a delamination of film whereas that of SiC/SKH51 showed a good adhesion. Many voids of less than 0.1 ${\mu}m$ were detected on NCD/SiC interface. These voids were believed as the reason for the poor adhesion between NCD and SiC films. The origin of voids was due to the insufficient coalescence of diamond particles on SiC surface in the early stage of deposition.

• 한국결정성장학회지
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• 제28권4호
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• pp.170-174
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• 2018

AlN 결정은 직경 1인치 크기의 기판이 개발되었고 계속 품질의 향상을 위해 연구되고 있다. 한편 2인치급 기판은 UV LED 칩 제조와 원가 감소를 위해 개발이 필요한 실정이다. 본 연구에서는 PVT 법으로 2인치의 AlN 결정을 SiC 기판상에 성장된 AlN 박막을 종자로 사용하여 성장의 가능성을 보고자 하였다. $10{\mu}m$ 두께의 AlN 박막 결정을 종자결정으로 사용하여 두께 7 mm의 AlN 결정을 성장하였다. 성장된 결정은 금속현미경과 실체현미경, DCXRD를 사용하여 분석하였다.

• ETRI Journal
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• 제19권1호
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• pp.26-35
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• 1997

The substrate effects on solid-phase crystallization of amorphous silicon (a-Si) films deposited by low-pressure chemical vapor deposition (LPCVD) using $Si_2H_6$ gas have been extensively investigated. The a-Si films were prepared on various substrates, such as thermally oxidized Si wafer ($SiO_2$/Si), quartz and LPCVD-oxide, and annealed at 600$^{\circ}C$ in an $N_2$ ambient for crystallization. The crystallization behavior was found to be strongly dependent on the substrate even though all the silicon films were deposited in amorphous phase. It was first observed that crystallization in a-Si films deposited on the $SiO_2$/Si starts from the interface between the a-Si and the substrate, so called interface-interface-induced crystallization, while random nucleation process dominates on the other substrates. The different kinetics and mechanism of solid-phase crystallization is attributed to the structural disorderness of a-Si films, which is strongly affected by the surface roughness of the substrates.

• KSTLE International Journal
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• 제5권1호
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• pp.1-6
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• 2004

Nano-scale studies on adhesion and friction were conducted in Si-wafer (100) using Atomic Force Microscopy (AFM). Glass (Borosilicate) balls of radii 0.32$\mu\textrm{m}$, 1.25$\mu\textrm{m}$, and 2.5$\mu\textrm{m}$, mounted on cantilever (Contact Mode type NPS) were used as tips. Adhesion and friction between Si-wafer and glass tips were measured at ambient temperature (24${\pm}$1$^{\circ}C$) and humidity (45${\pm}$5%). Friction was measured as a function of applied normal load in the range of 0-160 nN. Results showed that, both adhesion and friction increased with the tip radii. Also, friction increased linearly as a function of applied normal load. The effect of tip size on adhesion and friction was explained as the influence of the capillary force exerted by meniscus and that of the contact area on these parameters respectively. The coefficient of friction was estimated in two different ways, as the slope from the plot of friction force against the applied normal load and as the ratio between the friction force and the applied normal load. Both these estimates showed that the coefficient of friction increased with the tip size. Further, the influence of the adhesion force on the coefficient of friction was also discussed.

• 한국전기전자재료학회논문지
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• 제24권10호
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• pp.779-783
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• 2011

The morphology of etch pits in commercial 4H-SiC epi-wafer were investigated by molten-KOH etching. The etching process was optimized in $525{\sim}570^{\circ}C$ at 2~10 min and the novel type of etch pits was revealed. This type of etch pits have been considered as TED (threading edge dislocation) II, its origin and nature, however, are not reported yet. In this work, the morphology and evolution of etch pits during epitaxial growth were analyzed and the different behavior between TED and TEDII was discussed.

• 한국진공학회지
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• 제11권3호
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• pp.151-158
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• 2002

Decaborane ($B_{10}H_{14}$) 이온 주입법으로 n-type Si (100) 기판에 ultra-shallow $p^{+}-n$ 접합을 형성시켰다. 이온 주입에너지는 5kV와 10kV, 이온 선량은 $1\times10^{12}\textrm{cm}^2$와 $1\times10^{13}\textrm{cm}^2$로 decaborane을 이온 주입시켰다. 이온 주입된 시료들은 $N_2$ 분위기에서 $800^\{\circ}C$, $900^{\circ}C$, $1000^{\circ}C$에서 10초 동안 RTA(Rapid Thermal Annealing) 처리를 하였다. 또한 가속에너지에 따른 결함을 확인하기 위해서 15 kV의 이온 주입 에너지에서 $1\times10^{14}\textrm{cm}^2$만큼 이온 주입하였다. 2 MeV $^4He^{2+}$ channeling spectra에서 15 kV로 주입된 시료가 bare n-type Si와 5 kV, 10 kV의 에너지로 주입된 시료보다 주입시 생긴 결함에 의해 backscattering yield가 더 높게 나타났으며 spectra로부터 얻은 이온 주입으로 인한 비정질층의 두께는 표면으로부터 가속전압이 5kV, 10kV, 15kV일 때 각각 1.9nm, 2.5nm, 4.3nm였다. 10 kV에서 이온 주입된 시료를 $800^{\circ}C$ 열처리 한 결과 결함의 회복으로 인해 bare Si와 비슷한 backscattering yield를 보였으며 이때의 계산된 비정질 층의 두께는 0.98 nm이었다. 홀 측정과 면저항 측정은 dopant의 활성화가 주입된 에너지, 이온 선량, 열처리 온도에 따라 증가함을 보여주었다. I-V 측정 결과 누설 전류 밀도는 열처리 온도가 $800^{\circ}C$에서 $1000^{\circ}C$까지 증가함에 따라 감소하였고 주입에너지가 5kV에서 10kV까지 증가함에 따라 증가하였다.