• 제목/요약/키워드: By process

검색결과 82,684건 처리시간 0.078초

Case-Based Reasoning을 이용한 자동공정계획 시스템의 구축 (Development of A CAPP System Based on Case-Based Reasoning)

  • 이홍희;이덕만
    • 산업경영시스템학회지
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    • 제21권46호
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    • pp.181-196
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    • 1998
  • The aim of this research is the development of a CAPP system which can use the old experience of process planning to generate a process plan for a new part and learn from its own experience using the concept of stratified case-based reasoning(CBR). A process plan is determined through the hierarchical process planning procedure that is based on the hierarchical feature structure of a part. Each part and case have their own multiple abstractions that are determined by the feature structure of the part. Retrieving the case in stratified case-based process planning is accomplished by retrieving the abstraction that is most similar to the input part abstraction in each abstraction level of the case-base. A new process plan is made by the adaptation that translates the old case's process plan into the process plan of a new part. Operations, machines and tools, setups and operation sequence in each setup are determined in the adaptation of abstraction using some algorithms and the reasoning based on knowledge-base. By saving a new part and its process plan as a case, the system can use this new case in the future to generate a process plan of a similar part. That is, the system can learn its own experience of process planning. A new case is stored by adding the new abstractions that are required to save as the new abstraction to the existing abstractions in the case-base.

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A New Process Capability Measure for Non-normal Process

  • Jun, Mi-Jung;Cho, Gyo-Young
    • Journal of the Korean Data and Information Science Society
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    • 제18권4호
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    • pp.869-878
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    • 2007
  • In this paper a new process capability index $C_{psks}$ is introduced for non-normal process. $C_{psks}$ that is proposed by transformation of the $C_{psks}$ incorporates an additional skewness correction factor in the denominator of $C_{psks}$. The use of each technique is illustrated by reference to a distribution system which includes the Pearson and Johnson functions. Accordingly, $C_{psks}$ is proposed as the process capability measure for non-normal process.

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A New Process Incapability Measure for Non-normal Process

  • Jun, Mi-Jung;Cho, Gyo-Young
    • Journal of the Korean Data and Information Science Society
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    • 제18권4호
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    • pp.937-943
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    • 2007
  • In this paper a new process incapability index $C^*_{psks}$ is introduced for non-normal process. $C^*_{psks}$ is proposed by transformation of the $C^*_{psks}$. The use of each technique is illustrated by reference to a distribution system which includes the Pearson and Johnson functions. Accordingly, $C^*_{psks}$ is proposed as the process capability measures for non-normal process.

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견의 정련 방법에 관한 연구(1) - 패키지 정련 - (A Study on the Silk Degumming(1) - Degumming of Silk on Package -)

  • 김문식;김용학
    • 한국염색가공학회지
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    • 제18권3호
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    • pp.16-22
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    • 2006
  • Process contract has received considerable attention in silk degumming processes because of its critical role in quality assurance. In degumming, process exhibits shrinkage of high twisted yarn and lot-varying behavior, thus increasing the difficulties of reduction by conventional means. This necessitates the application of a package that adapts to changing degumming process, and a new approach involving package degumming is proposed. The gains of this process are prevent of shrinkage by package winding, which is simplified by reduced soft-winding or re-twisting process. The approach is expected to achieve high quality results in conventional process due to its feature of demage by tension and rubbing. Therefore package degumming has many merits such as reduce of pilling and shrinkage, production expenses saving by process contract are expected of the simplified degumming process.

Severe trismus due to bilateral coronoid process hyperplasia in growth hormone therapy patient: a case report

  • Lee, Sung-Tak;Chung, In-Kyo
    • Journal of the Korean Association of Oral and Maxillofacial Surgeons
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    • 제38권4호
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    • pp.249-254
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    • 2012
  • Bilateral coronoid process hyperplasia is a rare condition characterized by an enlarged mandibular coronoid process. The painless progressive reduction of a mouth opening is caused by coronoid process impingement on the posterior aspect of the zygomatic bone. Hyperplasia of the bilateral coronoid process leads to the restriction of a mandibular opening consequent to the impingement of the enlarged coronoid process on the temporal surface of the zygomatic bone or with the medial surface of the zygomatic arch. The process has been diagnosed as developmental hyperplasia. Otherwise, the development of the coronoid process may be associated with growth hormone. This paper describes a case of trismus caused by coronoid hyperplasia in an idiopathic short-stature patient who received growth hormone therapy by somatropin injections.

Copper thickness and thermal reliability of microvias produced by laser-assisted seeding (LAS) process in printed circuit board (PCB) manufacture

  • Leung, E. S.W.;Yung, W. K.C.
    • International Journal of Quality Innovation
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    • 제2권2호
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    • pp.69-92
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    • 2001
  • The laser-assisted seeding (LAS) process has potential to replace conventional electroless copper plating in Printed Circuit Board (PCB) manufacturing since it combines the steps of laser drilling and plating into one single process. In the LAS process, the single extra LAS step can metallize a microvia. Thus, the process steps can be greatly reduced and the productivity enhanced, but also the high aspect ratio microvias can be metallized. The objectives of this paper are to study the LAS copper thickness within PCB microvias and the thermal reliability of the microvias produced by this process. It was found that results were satisfactory in both the reliability test and also the LAS copper thickness which both comply with IPC standard, the copper thickness produced by the LAS process is sufficient for subsequent electro-plating process. The reliability of the microvias produced by LAS process is acceptable which are free from any voids, corner cracks, and distortion in the plated copper.

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냉간압출을 이용한 롱넥 플랜지 성형에 대한 공정설계 (Process Sequence Design of Longneck Flange by Cold Extrusion Process)

  • 임중연;황병복;김철식
    • 소성∙가공
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    • 제8권2호
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    • pp.160-168
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    • 1999
  • This paper is concerned with the process sequence design of longneck flange forming by using cold extrusion with thick hollow pipe. The conventional hot forming process to produce a longneck flange is investigated by thermo-viscoplastic finite element method to observe the metal flow in detail and evaluate design requirements. Based on the results of simulation of the current hot forming process, design strategy for improving the process sequence are developed using the thick hollow pipe. The main goal is to obtain an appropriate improved process sequence which can produce the required product most economically without tensile cracking, workpiece buckling, and overloading of tools. Newly process condition such as semi-die angle, reductio ratio of cross-sectional area of axisymmetrical extrusion process. The final designed process can provide very useful guidelines to other flange forming industries.

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건축화 도구로서의 다이어그램에 관한 연구 (A Study on the Use of Diagram for the Process of Architecturalization)

  • 김정애;김동진
    • 한국실내디자인학회논문집
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    • 제16권2호
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    • pp.71-78
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    • 2007
  • This study began from the idea that new materials and awareness in the modern society demand new methods in architecture and focused on diagrams as the tool many modern architects use in their process of architectural design. Therefore, the purpose is re-finding the potential of diagrams as profilerating architectural design media by examining mentions of architects about diagrams, investigating diagrams used in design process and treating comments referring to diagrams, by redefining the meaning of the contemporary architecture and of diagrams in architecture, and by grasping the various methods of use and its process. The design process using diagrams produces synthetic or reasonable process dissimilar to previous processes. Where diagrams are mainly used as tools to relate the segregated parts compressively. On the other hand reasonable process concerns reasonable design advancement to satisfy various requirements or conditions in reality, where diagrams are used as tools offering its phase in the whole structure of various information and relating steps of design each other. Dealing synthetically in the various steps of design process with the various properties originally obtained, proposing a new type of architecture by increasing thoughts and leaving the design process open-fluid, offering process and results having the same value as design process, and satisfying requirements in reality most reasonably, diagrams working in the above-mentioned design process have the potential to narrow the schism among theory, practice and criticism in contemporary architecture.

적외선 배경신호 처리를 통한 OES 기반 PECVD공정 모니터링 정확도 개선 (OES based PECVD Process Monitoring Accuracy Improvement by IR Background Signal Subtraction from Emission Signal)

  • 이진영;서석준;김대웅;허민;이재옥;강우석
    • 반도체디스플레이기술학회지
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    • 제18권1호
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    • pp.5-9
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    • 2019
  • Optical emission spectroscopy is used to identify chemical species and monitor the changes of process results during the plasma process. However, plasma process monitoring or fault detection by using emission signal variation monitoring is vulnerable to background signal fluctuations. IR heaters are used in semiconductor manufacturing chambers where high temperature uniformity and fast response are required. During the process, the IR lamp output fluctuates to maintain a stable process temperature. This IR signal fluctuation reacts as a background signal fluctuation to the spectrometer. In this research, we evaluate the effect of infrared background signal fluctuation on plasma process monitoring and improve the plasma process monitoring accuracy by using simple infrared background signal subtraction method. The effect of infrared background signal fluctuation on plasma process monitoring was evaluated on $SiO_2$ PECVD process. Comparing the $SiO_2$ film thickness and the measured emission line intensity from the by-product molecules, the effect of infrared background signal on plasma process monitoring and the necessity of background signal subtraction method were confirmed.

스마트 팩토리의 제조 프로세스 마이닝에 관한 실증 연구 (An Empirical Study on Manufacturing Process Mining of Smart Factory)

  • 김태성
    • 대한안전경영과학회지
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    • 제24권4호
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    • pp.149-156
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    • 2022
  • Manufacturing process mining performs various data analyzes of performance on event logs that record production. That is, it analyzes the event log data accumulated in the information system and extracts useful information necessary for business execution. Process data analysis by process mining analyzes actual data extracted from manufacturing execution systems (MES) to enable accurate manufacturing process analysis. In order to continuously manage and improve manufacturing and manufacturing processes, there is a need to structure, monitor and analyze the processes, but there is a lack of suitable technology to use. The purpose of this research is to propose a manufacturing process analysis method using process mining and to establish a manufacturing process mining system by analyzing empirical data. In this research, the manufacturing process was analyzed by process mining technology using transaction data extracted from MES. A relationship model of the manufacturing process and equipment was derived, and various performance analyzes were performed on the derived process model from the viewpoint of work, equipment, and time. The results of this analysis are highly effective in shortening process lead times (bottleneck analysis, time analysis), improving productivity (throughput analysis), and reducing costs (equipment analysis).