• Title/Summary/Keyword: Bridge-edge

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Contents of Heavy Metals in Soils of the Kum-Ho River Basin (금호강류성 하상토양중 중금속함량)

  • 문효노;장봉기;김두희
    • Journal of environmental and Sanitary engineering
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    • v.5 no.1
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    • pp.1.1-14
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    • 1990
  • This study was conducted to investigate the contents of heavy metals in soils of the Kumho river basin, by analyzing soils according to the distance from edge of the river and to the soil layers. The contents of heavy metals in soils showed highly in its downstream. Namely there was shown a remarkably high contents of these heavy metals in the Kum-ho bridge areas where Kongdan stream joins Dalseo stream, such as 39.52ppm for zinc, 35.92ppm for copper, 97.90ppm for iron, 102.45ppm for manganese, 13.92ppm for lead, respectively, and 0.48ppm for cadmium. However, the heavy metals contents in soils around Kangchang bridge tended to gradually decrease in its contents, probably because its main soils consisting of sand. Based on their soil layers, the average contents of these heavy metals in the surface soils were higher than one of the subsurface soil. Its contents according to the distance from the river edge indicated some difference every individual area. Nevertheless, its contents showed lower contents in the area far away from the edge. And its contents tended to again increase in the outside bank. In addition, a remarkable positive correlation is shorten between individual heavy metals, except correlation between iron and lead. Also cadmium just shows reverses correlation in the statistics. With respect to comparison between soil layers, there was a remarkable positive correlation between surface layers and subsurface layers. Considering the above results, it seems that the pollution of river bed's soil is in proportion to it of stream.

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Broadband W-band Tandem coupler using MIMIC technology (MIMIC 기술을 이용한 광대역 W-band Tandem 커플러)

  • Lee, Mun-Kyo;An, Dan;Lee, Bok-Hyung;Lim, Byeong-Ok;Lee, Sang-Jin;Moon, Sung-Woon;Jun, Byoung-Chul;Kim, Yong-Hoh;Yoon, Jin-Seob;Kim, Sam-Dong;Rhee, Jin-Koo
    • Journal of the Institute of Electronics Engineers of Korea TC
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    • v.44 no.7 s.361
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    • pp.105-111
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    • 2007
  • In this paper, we designed and fabricated a 3-dB tandem coupler using air-bridge technology for millimeter-wane monolithic integrated circuits, operating at W-band($75{\sim}110\;GHz$) frequency. Tightly edge-coupled CPW line has low directivity due to different even-mode and odd-mode phase velocity. To overcome this disadvantage, a 3-dB tandem coupler which comprises the two-sectional weakly parallel-coupled lines with equal phase velocity was designed at W-band. The proposed coupler was fabricated using air-bridge technology to monolithically materialize the uniplanar coupler structure instead of conventional multilayer or wire bonded structure. From the measurements, the coupling coefficient of $2.9{\sim}3.6\;dB$ and the good phase difference of $91.2{\pm}2.9^{\circ}$ were obtained in broad frequency range of $75{\sim}100\;GHz$.

Development of Wireless Measurement System for Bridge Using PDA and Fiber Optical Sensor (PDA와 광섬유 센서를 이용한 교량의 무선계측 시스템 개발)

  • Kwak, Kae-Hwan;Hwang, Hae-Sung;Jang, Hwa-Sup;Kim, Woo-Jong;Kim, Hoi-OK
    • Journal of the Korea institute for structural maintenance and inspection
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    • v.13 no.1 s.53
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    • pp.88-96
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    • 2009
  • This study proposes a wireless measurement system that is a new safety management system by using an FBG sensor and a PDA. The sensor part has many advantages of implementing a wireless measurement system, and the study emploies an FBG-LVDT sensor, FBG-STRAIN sensor, FBG-TEMP sensor, and FBG-ACC sensor, using FBG sensors. Also, the study show a configuration of a signal process system for operating a wireless transmission system of FBG sensors applied to the signal process system, and engrafted the cutting edge information technology industry in order to display from a remote distance using a PDA. In order to verify the applicability of the developed FBG sensors and wireless measurement monitoring system to the field, their accuracy, and usability, the study has conducted a static and dynamic test to a bridge in the field. The study made an assessment of service for the vibration of the bridge by applying dynamic data measured by an FBG-LVDT sensor and FBG-ACC sensor to Meister's curve and prepared methods for assessing the vibration of the bridge by proposing a standard of vibration limitation given the service of vibration of the bridge. As a follow up for this study, it would be necessary to set up an overall model for the standard of service assessment established in this study.

An Accurate Boundary Detection Algorithm for Faulty Inspection of Bump on Chips (반도체 칩의 범프 불량 검사를 위한 정확한 경계 검출 알고리즘)

  • Joo, Ki-See
    • Proceedings of KOSOMES biannual meeting
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    • 2005.11a
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    • pp.197-202
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    • 2005
  • Generally, a semiconductor chip measured with a few micro units is captured by line scan camera for higher inspection accuracy. However, the faulty inspection requires an exact boundary detection algorithm because it is very sensitive to scan speed and lighting conditions. In this paper we propose boundary detection using subpixel edge detection method in order to increase the accuracy of bump faulty detection on chips. The bump edge is detected by first derivative to four directions from bump center point and the exact edge positions are searched by the subpixel method. Also, the exact bump boundary to calculate the actual bump size is computed by LSM(Least Squares Method) to minimize errors since the bump size is varied such as bump protrusion, bump bridge, and bump discoloration. Experimental results exhibit that the proposed algorithm shows large improvement comparable to the other conventional boundary detection algorithms.

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Fragmentation Analysis of Daejeon City's Green Biotope Using Landscape Index and Visualization Method (경관의 지수화 및 시각화 기법을 활용한 대전광역시 녹지비오톱 파편화 분석)

  • Kim, Jin-Hyo;Ra, Jung-Hwa;Lee, Soon-Ju;Kwon, Oh-Sung;Cho, Hyun-Ju;Lee, Eun-Jae
    • Journal of the Korean Society of Environmental Restoration Technology
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    • v.19 no.3
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    • pp.29-44
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    • 2016
  • The purpose of this study is to quantitatively and visually analyze the degree of green biotope fragmentation caused by road construction and other development work using FRAGSTATS and GUIDOS tool. Moreover, linking of the endangered species research, we mapped "Biotope Fragmentation Map" of Daejeon-city. The findings of the study are summarized as follows: First, as the result of FRAGSTATS, landscape indices : number of patch(NP), mean patch size (MPS), edge length(TE), mean nearest neighbor distance(MNN), edge shape(LSI) showed meaningful change from fragmentation. Moreover, the result of GUIDOS analysis, middle core-small core-bridge-branch-edge-islet-perforation showed increase of area percentage without large core. Lastly, analysis result of 'Biotope Fragmentation Map' revealed that changing site of large core's size appeared eighteen-site and designated as the special protection area appeared forty-one site. As the result of the two data, overlapping areas that showed both change of core size and revealed special protection areas revealed four site. For example, five species of endangered species appeared on the NO. 4 site in 'Biotope Fragmentation Map'. The findings of this study as summarized above are considered to play an important role in basic data preventing green biotope fragmentation at the planned level from various development work.

Accurate Boundary detection Algorithm for The Faulty Inspection of Bump On Chip (반도체 칩의 범프 불량 검사를 위한 정확한 경계 검출 알고리즘)

  • Kim, Eun-Seok
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.11 no.4
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    • pp.793-799
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    • 2007
  • Generally, a semiconductor chip measured with a few micro units is captured by line scan camera for higher inspection accuracy. However, the faulty inspection requires an exact boundary detection algorithm, because it is very sensitive to scan speed and lighting conditions. In this paper we propose boundary detection with subpixel edge detection in order to increase the accuracy of bump faulty detection on chips. The bump edge is detected by first derivative to four directions from bump center point and the exact edge positions are searched by the subpixel method. Also, the exact bump boundary to calculate the actual bump size is computed by LSM(Least Squares Method) to minimize errors since the bump size is varied such as bump protrusion, bump bridge, and bump discoloration. Experimental results exhibit that the proposed algorithm shows large improvement comparable to the other conventional boundary detection algorithms.

A New High Frequency Linked Soft-Switching PWM DC-DC Converter with High and Low Side DC Rail Active Edge Resonant Snubbers for High Performance Arc Welder

  • Kang, Ju-Sung;Fathy, Khairy;Saha, Bishwajit;Hong, Doo-Sung;Suh, Ki-Young;Lee, Hyun-Woo;Nakaoka, Mutsuo
    • Proceedings of the Korean Institute of IIIuminating and Electrical Installation Engineers Conference
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    • 2006.05a
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    • pp.399-402
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    • 2006
  • This paper presents a new circuit topology of dc bus line switch-assisted half-bridge soft switching PWM inverter type dc-dc converter for arc welder. The proposed power converter is composed of typical voltage source half-bridge high frequency PWM inverter with a high frequency transformer link in addition to dc bus line side power semiconductor switching devices fer PWM control scheme and capacitive lossless snubbers. All the active power switches in the half-bridge arm and dc bus lines can achieve ZCS turn-on and ZVS turn-off commutation operation and consequently the total turn-off switching losses can be significantly reduced. As a result, a high switching frequency of using IGBTs can be actually selected more than about 20 kHz. The effectiveness of this new converter topology is proved for low voltage and large current dc-dc power supplies such as arc welder from a practical point of view.

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A novel controller for switching audio power amplifier with digital input (디지털 PWM 입력 D급 음향 증폭기를 위한 새로운 제어기법)

  • Park, Jong-Hu;Kim, C.G.;Cho, B.H.
    • Proceedings of the KIEE Conference
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    • 2002.07b
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    • pp.976-979
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    • 2002
  • A new controller for switching audio power amplifier with digital PWM input is proposed- Bi-directional Saw-tooth Error Correction (BSEC). This control method for high quality switching amplifier is based on a pulsed edge correction approach using PWM audio signal input as a reference of power switching digital to analog converter. The proposed controller has excellent features such as wide error correction range and no limitation on the modulation index. The controller is implemented in the half-bridge class D amplifier and the performance is verified through hardware experiments. It delivers 100W into 4${\Omega}$ load with less than 0.2% of total harmonic distortion (THD) all over operating range and an maximum efficiency of 82%.

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Prediction of Initiation Location and Direction of Fretting Fatigue Crack (프레팅 피로 균열의 발생 위치 및 방향 예측)

  • Huh, Yong-Hak;R. E. Edwards;M.W. Brown;E.R. de Ios Rios
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.27 no.7
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    • pp.1185-1192
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    • 2003
  • Governing parameters for determination of the location of crack initiation and direction of crack initiation were investigated by performing fretting fatigue tests and analysis on Al 2024-T351. Fatigue tests were carried out using biaxial fatigue machine. It was shown that the dominant fatigue crack tended to initiate at the outer edge of one of the four bridge pads, growing at an angle beneath a pad, before turning perpendicular to the orientation of the axial load. Distribution of stresses generated during fretting fatigue loading along the interface was calculated by elastic FE simulation. It can be known that the location of crack initiation can be predicted by using the maximum tangential stress range. Futhermore, the crack initiation direction can also be predicted by a maximum tangential stress range.

Overlay correction in sub-0.18${\mu}{\textrm}{m}$ metal layer photolithography process (0.18${\mu}{\textrm}{m}$이하 metal layer 사진공정에서의 overlay 보정)

  • 이미영;이홍주
    • Proceedings of the KAIS Fall Conference
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    • 2002.05a
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    • pp.106-108
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    • 2002
  • 반도체 physical layout design rule이 작아짐에 따라 Proximity effect와 overlay가 Pattern 구현에 크게 영향을 미치고 있다. Metal layer와 contact의 부족한 overlay margin으로 overlay 불량이 발생하고, 감소한 space margin으로 인해 bridge와 같은 문제가 나타난다. 따라서, resolution을 향상시키고, 최소한의 overlay margin을 확보함으로써 미세 pattern의 구현을 가능하게 한다. 이를 위해 OPC와 attPSM 같은 분해능향상기술이 사용된다. 그러나 attPSM의 사용은 원하지 않는 pattern이 생성되는 sidelobe와 같은 문제가 발생한다. 따라서 serial image simulation올 통해 추출한 rule을 rule-based correction에 적용하여 sidelobe현상을 방지한다. 그리고 overlay margin 부족으로 나타나는 문제는 metal layer와 contact overlap되는 영역의 line edge를 확장하고, rule checking을 통해 최소한의 space margin을 확보하여 해결한다 따라서 overlay error를 rule-based correction을 사용하여 효과적으로 방지한다.