• 한국결정성장학회지
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• 제17권6호
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• pp.277-282
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• 2007

화력발전소에서 발생하는 석탄 바닥재(bottom ash)와 점토를 혼합하여 성형 후, 소성하여 인공경량골재를 제조하고, 소성온도와 조성 변화에 따른 물성을 분석하였다. 바닥재는 입경이 4.75mm 이상인 입자가 13wt% 정도로 거친 분말로 압출성형을 위하여 미분쇄 공정이 필요하였다. 또한 바닥재는 미연탄소(C)를 다량 함유하고 있어 소결 시 C의 산화반응과 이에 따른 가스발생으로 소결체의 경량화를 유도하였다. 점토에 바닥재 첨가량이 증가할수록 소성 지수가 감소하였고 이에 따라 성형체의 성형성이 저하되었으나 바닥재 첨가량이 40wt% 까지의 성형체는 소성 지수 및 소성 한계값이 각각 약 10과 22로서 압출성형이 가능하였다. 바닥재가 $30{\sim}50wt%$ 첨가되고 $1150{\sim}1200^{\circ}C$ 범위에서 소결된 골재는 부피비중 $1.3{\sim}1.5$, 흡수율 $14{\sim}16%$를 나타냈고 따라서 고층빌딩이나 교량 등의 골재대체재로써의 가능성이 확인되었다.

• 한국생산제조학회지
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• 제21권4호
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• pp.563-569
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• 2012

In the semiconductor and display device production processes, the handling of sensitive objects needs new carrying technology. Floating carrying motion is a practical alternative solution for non-contact handling of parts and substrates. This paper presents a study of through paths inside the air pressure pick-up head to generate the floating motion. The air motion by conceptual designed paths inside the head gradually develops positive pressure and vacuum between narrow objects. Positive pressure occurs through the head tip before discharging outside of the head. Negative pressure is developed by evacuating the inside head bottom as result of the radial flow connecting the vertical through-holes. The numerical analysis was done to figure out the stable levitation caused by the two acting forces between surfaces. In comparing with the standard case that the levitation gap gets 0.7-0.9 mm, it confirms the suggested head characteristics to show floating capacity in accordance with the head size, number of through-hole, and locations of through-hole in succession of conceptual design for a prototype.

• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 2003년도 춘계학술대회 논문집
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• pp.149-154
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• 2003

The cutting tests of high tensile steel plate(AH36) were carried out using CNC plasma arc cutting machine. Both top and bottom width of kerf and the surface roughness(Ra, Rmax) of cut surface are measured under various cutting conditions such as cutting speed, steel plate thickness, etc. In the CNC plasma arc cutting, the surface roughness decreases as cutting speed increases. The hardness is high up to 4mm depth from the cutting surface. In the cutting speed 1300~2100mm/min, the ratio of proper kerf width(Wt/Wb) is around 2.6. Through the series the series of experiments, the satisfactory cutting conditions of high tensile steel plate were found.

• 한국분말재료학회지
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• 제14권1호
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• pp.26-31
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• 2007

Manufacturing bulk nanostructured materials with least grain growth from initial powders is challenging because of the bottle neck of bottom-up methods using the conventional powder metallurgy of compaction and sintering. In this study, bottom-up type powder metallurgy processing and top-down type SPD (Severe Plastic Deformation) approaches were combined in order to achieve both real density and grain refinement of metallic powders. ECAP (Equal Channel Angular Pressing), one of the most promising processes in SPD, was used for the powder consolidation method. For understanding the ECAP process, investigating the powder density as well as internal stress, strain distribution is crucial. We investigated the consolidation and plastic deformation of the metallic powders during ECAP using the finite element simulations. Almost independent behavior of powder densification in the entry channel and shear deformation in the main deformation zone was found by the finite element method. Effects of processing parameters on densification and density distributions were investigated.

• 한국기계가공학회지
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• 제19권2호
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• pp.89-96
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• 2020

In this study, we developed a finite element model for the built-in bottom-freezer type refrigerator and then used the structural analysis method to analyze and evaluate the deflection of the doors. We tested the validity of the developed analytical model by measuring the deflection of the hinge when loads were applied to the upper and lower hinges of the refrigerating compartment and compared these with the analysis results. The comparison of the vertical displacement of the measured result and the analysis result showed an error ratio of up to 12.8%, which indicates that the analytical model is consistent. Using the analytical model composed of the cabinet, hinges and doors, we performed analyses for two cases: both doors closed, and the refrigerating door open. Since the maximum vertical displacement of the refrigerating compartment door (R-door) with the food load is smaller than the gap between the lower surface of the R-door and the upper surface of the freezer compartment door (F-door), it is judged that the R-door and the F-door do not contact when the doors are opened or closed. In addition, the analysis result showed that the difference between the vertical displacement at the hinge on the opposite side and the hinge side of the R-door is favorably smaller than the management criterion of the refrigerator manufacturer.

• 보존과학연구
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• 통권26호
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• pp.57-75
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• 2005

The burial custom in the Youngsan river area was to build a jar-coffin and lay the body in state, however the methods in building and moulding the massive jar, as well as in which kiln it was made has not been examined precisely. Thus, this research not only investigates previous results related to the manufacturing methods of massive jar-coffins, but also examines samples that were excavated and collected. The clay used to produce jar-coffin consists a large portion of unglazed qualities, which was split-moulded from the bottom up to the mouth area. The interior was finished by applying water, whereas the exterior was decorated by regularly pasting or stamping in parallel with a lattice design. It can be presumed that the finished jar-coffin was not moved, but the ceiling and walls were built around it as a kiln, for the jar-coffin to be oxidized or to reduce the flame condition in a temperature approximately $700~1,200^{\circ}C$The results from the research, however, show limitations to exploit the exact manufacturing method, therefore there is a need for in-depth examinations: mineralogical investigation on a large amount of jar-coffin samples through a polarized light microscope; substance analysis using various equipments; speculation on the temperature in the place of production and the flame inside.

• 한국재료학회지
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• 제22권7호
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• pp.335-341
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• 2012

Recently, the demand for the miniaturization of printed circuit boards has been increasing, as electronic devices have been sharply downsized. Conventional multi-layered PCBs are limited in terms their use with higher packaging densities. Therefore, a build-up process has been adopted as a new multi-layered PCB manufacturing process. In this process, via-holes are used to connect each conductive layer. After the connection of the interlayers created by electro copper plating, the via-holes are filled with a conductive paste. In this study, a desmear treatment, electroless plating and electroplating were carried out to investigate the optimum processing conditions for Cu via filling on a PCB. The desmear treatment involved swelling, etching, reduction, and an acid dip. A seed layer was formed on the via surface by electroless Cu plating. For Cu via filling, the electroplating of Cu from an acid sulfate bath containing typical additives such as PEG(polyethylene glycol), chloride ions, bis-(3-sodiumsulfopropyl disulfide) (SPS), and Janus Green B(JGB) was carried out. The desmear treatment clearly removes laser drilling residue and improves the surface roughness, which is necessary to ensure good adhesion of the Cu. A homogeneous and thick Cu seed layer was deposited on the samples after the desmear treatment. The 2,2'-Dipyridyl additive significantly improves the seed layer quality. SPS, PEG, and JGB additives are necessary to ensure defect-free bottom-up super filling.

• 콘크리트학회논문집
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• 제21권6호
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• pp.713-718
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• 2009

21세기에 접어들면서 IT, BT, NT, ET 등 첨단 산업은 하루가 다르게 발전하고 있으며, 이러한 추세에 맞추어 시멘트 산업에서도 많은 변화가 진행되고 있다. 또한 시멘트 산업은 에너지 다소비형이며 석회석을 원료로 하고 있어 지구온난화의 주범인 $CO_2$를 배출하여, 환경문제로 인해 가까운 시기에 큰 어려움을 겪을 것으로 예상되고 있다. 이 연구에서는 시멘트 제조과정 중 소성과정에서의 $CO_2$ 발생을 방지하고, 나노 크기의 입자를 시멘트화 함으로써 구조적 치밀성을 유지하여, 고강도화내구성에 유리한 건설재료를 개발하기 위한 일환으로 기존 소성과정을 통한 시멘트 제조방식과 달리, 화학적 방법을 통해 Bottom-up 방식으로 나노 크기의 새로운 개념의 건설재료를 개발하는데 그 목적이 있다. 시멘트 화학성분비에 착안하여 실리카, 알루미나 그리고 Ca 이온을 주재료로, 인공적으로 나노시멘트 분말을 합성하여 입도분석, SEM, EDX를 통해 그 재료적 특성을 파악하고, 모르타르를 제조하여, 강도특성을 측정하였다. 그 결과 평균 168 nm 크기의 나노 입자를 제조 할 수 있었으며, 적정 배합비의 모르타르의 7일 압축강도가 53.9 MPa로 측정되는 등 충분히 건설용 재료로서의 사용이 가능할 것으로 판단되었으나, 건설 분야로 응용을 위한 기초연구로써 보다 많은 연구가 수행되어야 할 것으로 판단된다.

• 제어로봇시스템학회:학술대회논문집
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• 제어로봇시스템학회 2005년도 ICCAS
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• pp.643-648
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• 2005

Generally, ships have marks of various shapes on outside of the hull. Among them, so called "Draft Mark" indicates the distance from the bottom of the keel to the waterline. Draft marks are used to determine the displacement and other properties of the ship for stability and control purposes. These marks are made up of welding bead or sticking the steel plate on outside of the hull. To improve the confidence level of the ship owner, quality and accuracy of the draft mark is very important. So the automatic mark welding robot is used to enable a high quality and accurate manufacturing line. To improve the system portability, the system is divided into two distinct parts, namely mechanical part and control part. Mechanical part is robust, a lightweight, and easy to dismantle. The control part consists of an in-house developed controller, which is based on embedded Linux. Also, the control part consists of power line communication module to ensure the applicability of the controller in manufacturing line. In this paper, the methodologies of control and configuration of the robot are discussed.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2005년도 International Meeting on Information Displayvol.II
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• pp.955-962
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• 2005

Power efficiency, lifetime and stable manufacturing processes are the crucial parameters for the success of organic light emitting diodes (OLEDs) in display and lighting applications. Highest power efficiencies of PIN-OLEDs for all principal colours and for bottom and top emission OLED structures have been demonstrated. The PIN structure, which means the incorporation of intentionally doped charge carrier transport layer in a suitable OLED layer setup, lowers the operating voltage to achieve highest power efficiencies. Up to now the n-doping of the electron transport layer has been done by alkali metal co-deposition. This has main draw-backs in terms of manufacturability, since the handling of large amounts of pure Cs is a basic issue in production lines. Here we present in detail results on PIN-OLEDs comprising a newly developed molecular n-dopant. All the previous OLED performance data based on PIN-OLEDs with alkali metal doping could be reproduced and will be further improved in the future. Hence, for the first time, a full manufacturing compatible PIN-OLED is available.