• Title/Summary/Keyword: Boron Nitride

Search Result 251, Processing Time 0.027 seconds

Effect of Microstructure of hBN Thin Films on the Nucleation of cBN Phase Deposited by RF UBM Sputtering System (RF UBM Sputtering에 의해 증착된 hBN 박막의 미세구조가 cBN 상의 핵형성에 미치는 영향)

  • Lee Eun-Ok;Park Jong-Keuk;Lim Dae-Soon;Baik Young-Joon
    • Journal of the Korean Vacuum Society
    • /
    • v.13 no.4
    • /
    • pp.150-156
    • /
    • 2004
  • Boron nitride thin films were deposited on Si(100) substrate by RF (Radio-frequency) UBM (Unbalanced Magnetron) sputtering system. The effect of working pressure and substrate bias voltage on microstructure and compressive stress of boron nitride thin films has been investigated. In high working pressure, the alignment of hBN laminates increased with substrate bias voltage, in low working pressure, however, it was high in low substrate bias voltage. Compressive stress evolution and surface morphology of deposited BN films are closely related with the alignment of hBN laminates. The cBN phase without high compressive stress could be nucleated on hBN thin film by controlling the alignment of hBN laminates.

PVDF/h-BN hybrid membranes and their application in desalination through AGMD

  • Moradi, Rasoul;Shariaty-Niassar, Mojtaba;Pourkhalili, Nazila;Mehrizadeh, Masoud;Niknafs, Hassan
    • Membrane and Water Treatment
    • /
    • v.9 no.4
    • /
    • pp.221-231
    • /
    • 2018
  • A new procedure to produce poly(vinylidene fluoride)/boron nitride hybrid membrane is presented for application in membrane distillation (MD) process. The influence of hexagonal boron nitride (h-BN) incorporation on the performance of the polymeric membranes is studied through the present investigation. For this aim, h-BN nanopowders were successfully synthesized using the simple chemical vapor deposition (CVD) route and subsequent solvent treatments. The resulting h-BN nanosheets were blended with poly(vinylidene fluoride) (PVDF) solution. Then, the prepared composite solution was subjected to phase inversion process to obtain PVDF/h-BN hybrid membranes. Various examinations such as scanning electron microscopy (SEM), wettability, permeation flux, mechanical strength and liquid entry pressure (LEP) measurements are performed to evaluate the prepared membrane. Moreover, Air gap membrane distillation (AGMD) experiments were carried out to investigate the salt rejection performance and the durability of membranes. The results show that our hybrid PVDF/h-BN membrane presents higher water permeation flux (${\sim}18kg/m^2h$) compared to pristine PVDF membrane. In addition, the experimental data confirms that the prepared nanocomposite membrane is hydrophobic (water contact angle: ${\sim}103^{\circ}$), has a porous skin layer (>85%), as well competitive fouling resistance and operational durability. Furthermore, the total salt rejection efficiency was obtained for PVDF/h-BN membrane. The results prove that the novel PVDF/h-BN membrane can be easily synthesized and applied in MD process for salt rejection purposes.

Effect of Oxygen Addition on Residual Stress Formation of Cubic Boron Nitride Thin Films (입방정 질화붕소 박막의 잔류응력 형성에 미치는 산소 첨가 효과)

  • Jang, Hee-Yeon;Park, Jong-Keuk;Lee, Wook-Seong;Baik, Young-Joon;Lim, Dae-Soon;Jeong, Jeung-Hyun
    • Journal of the Korean institute of surface engineering
    • /
    • v.40 no.2
    • /
    • pp.91-97
    • /
    • 2007
  • In this study we investigated the oxygen effect on the nucleation and its residual stress during unbalanced magnetron sputtering. Up to 0.5% in oxygen flow rate, cubic phase (c-BN) was dominated with extremely small fraction of Hexagonal phase (h-BN) of increasing trend with oxygen concentration, whereas hexagonal phase is dominated beyond 0.75% flow rate. Interestingly, the residual stress in cubic-phase-dominated films was substantially reduced with small amount of oxygen (${\sim}0.5%$) down to a low value comparable to the h-BN case. This may be because oxygen atoms break B-N $sp^3$ bonds and make B-O bonds more favorably, increasing $sp^2$ bonds preference, as revealed by FTIR and NEXAFS. It was confirmed by experimental facts that the threshold bias voltage for nucleation and growth of cubic phase were increased from -55 V to -70 V and from -50 V to -60 V respectively. The reduction of residual stress in O-added c-BN films is seemingly resulting from the microstructure of the films. The oxygen tends to increase slightly the amount of h-BN phase in the grain boundary of c-BN and the soft h-BN phase of 3D network including surrounding nano grains of cubic phase may relax the residual stress of cubic phase.

Evaluation of h-BN Nanoflakes/Polyimide Composites for a Triboelectric Nanogenerator (육방정질화붕소 나노플레이크/폴리이미드 복합체를 이용한 마찰전기 나노발전기 평가)

  • Park, Sunyoung;Byun, Doyoung;Cho, Dae-Hyun
    • Tribology and Lubricants
    • /
    • v.37 no.4
    • /
    • pp.125-128
    • /
    • 2021
  • A means of enhancing the performance of triboelectric nanogenerators (TENGs) is increasing the differences in work functions between contacting materials. Hexagonal boron nitride (h-BN) exhibits excellent mechanical properties and high chemical stability as well as a high work function. As a result, engineers in the field of energy harvesting have envisioned using h-BN in the electrification layer in TENGs. For the industrial application of h-BN in TENGs, large-scale production is necessary, and h-BN is generally exfoliated and dispersed in various solvents. In this study, we evaluate the performance of a TENG with h-BN nanoflakes in the polyimide (PI) layer. To synthesize a PI composite containing h-BN nanoflakes, h-BN powders are exfoliated and dispersed in poly(amic acid) (PAA), which is the precursor of PI. Then, h-BN dispersion is spin-coated onto the PI film and cured for 2 h under 300℃. This composite material can then be used for the electrification layer in TENGs. Below the electrification layer, an aluminum foil is placed and used as an electrode. When the contact and separation processes with polyethylene terephthalate are repeated, the fabricated TENG shows a maximum power density of 190.8 W/m2. This study shows that h-BN is a promising material for enhancing the performance of the electrification layer in TENGs.

열 화학기상증착법을 이용한 BCN 나노시트의 합성과 전기적 특성 분석

  • Jeon, Seung-Han;Cha, Myeong-Jun;Song, U-Seok;Kim, Seong-Hwan;Jeon, Cheol-Ho;Park, Jong-Yun
    • Proceedings of the Korean Vacuum Society Conference
    • /
    • 2012.08a
    • /
    • pp.399-399
    • /
    • 2012
  • 최근 그래핀 연구와 더불어 2차원 구조의 나노소재에 대한 관심이 급증하면서 육각형의 질화붕소(hexagonal boron nitride; h-BN) 나노시트(nanosheet)[1]나 붕소 탄화질화물(boron caronitride;BCN) 나노시트[2, 3]와 같은 2차원 구조체에 대한 연구가 활발히 진행되고 있다. 그 중 BCN은 반금속(semimetal)인 흑연(graphite)과 절연체인 h-BN이 결합된 나노시트로 원소의 구성 비율에 따라 전기적 특성을 제어할 수 있다는 장점이 있다. 따라서 다양한 나노소자로의 응용을 위한 연구가 활발히 진행되고 있다. 본 연구에서는 열 화학기상증착법(thermal chemical vapor deposition)을 이용하여 폴리스틸렌(polystyrene)과 보레인 암모니아(borane ammonia)를 사용하여 BCN 나노시트를 합성하였다. 합성된 BCN 나노시트의 구조적 특징과 화학적 조성 및 결합 상태를 주사전자현미경(scanning electron microscopy), 투과전자현미경(transmission electron microscopy), X-선 광전자 분광법(X-ray photoelectron spectroscopy), 라만 분광법(Raman spectroscopy)을 통해 조사하였고, 이온성 용액법 (ionic liquid)[4]을 이용하여 전계효과 특성을 측정하였다.

  • PDF

Nano-gap Trench Etching using Forward Biased PN Junction for High Performance MEMS Devices (고성능 MEMS 소자를 위한 순방향 전극이 걸린 PN 접합을 이용한 나노 간격 홈의 식각)

  • Jeong, Jin-Woo;Kim, Hyeon-Cheol;Chun, Kuk-Jin
    • Proceedings of the IEEK Conference
    • /
    • 2005.11a
    • /
    • pp.833-836
    • /
    • 2005
  • Nano-gap trench is fabricated by the novel electrochemical etching technique using forward biased PN junction formed at the backside of the wafer. PN junction is formed using boron nitride wafer and the concentration of the boron doping is the high value of $1{\times}10^{19}$ $cm^{-3}$. The electro-chemical etching is performed in the 5% HF solution under the forward bias voltage of $1{\sim}2V$. The relationship between the etch rate of the trench and the voltage of the forward bias is investigated and the dependence of the gap for the voltage also examined. The etch rate increase from 0.027 ${\mu}m/min$ to 0.031 ${\mu}m/min$ as the value of the applied voltage increase from 1V to 2V, but the the gap is kept constant value of 40 nm.

  • PDF

BCN 박막의 합성과 전기적 특성 분석

  • Jeon, Seung-Han;Song, U-Seok;Jeong, Dae-Seong;Cha, Myeong-Jun;Kim, Seong-Hwan;Park, Jong-Yun
    • Proceedings of the Korean Vacuum Society Conference
    • /
    • 2013.02a
    • /
    • pp.617-617
    • /
    • 2013
  • 최근 그래핀 연구와 더불어 2차원 구조의 나노소재에 대한 관심이 급증하면서 육각형의 질화붕소(hexagonal boron nitride; h-BN) 박막(nanosheet) [1]이나 붕소 탄화질화물(boron caronitride; BCN) 박막 [2,3]과 같은 2차원 구조체에 대한 연구가 활발히 진행되고 있다. 그 중 BCN은 반금속(semimetal)인 흑연(graphite)과 절연체인 h-BN이 결합된 박막으로 원소의 구성 비율에 따라 전기적 특성을 제어할 수 있다는 장점이 있다. 따라서 다양한 나노소자로의 응용을 위한 연구가 활발히 진행되고 있다. 본 연구에서는 폴리스틸렌(polystyrene, PS)과 보레인 암모니아(borane ammonia)를 고체 소스로 이용하여 열화학기상증착법으로 BCN 박막을 SiO2 기판 위에 직접 합성하였다. SEM과 AFM 관측을 통해 합성된 BCN 박막의 두께가 약 10 nm이며, RMS roughness가 0.5~2.6 nm로 매우 낮은 것을 확인하였다. 합성과정에서 PS의 양을 조절하여 BCN 박막의 탄소의 밀도를 성공적으로 제어하였으며, 이에 따라 전기적인 특성이 제어되는 양상을 확인하였다. 또한 합성온도 변화에 따른 BCN 박막의 전기적인 특성이 제어되는 양상을 확인하였다. 추가적으로 같은 방법을 이용하여 BCN 박막을 Cu 위에서 합성하여 SiO2 기판위에 전사하였다. 합성된 BCN 박막의 구조적 특징과 화학적 조성 및 결합 상태를 투과전자현미경(transmission electron microscopy), X-선 광전자 분광법(X-ray photoelectron spectroscopy), 라만 분광법(Raman spectroscopy)을 통해 조사하였고, 이온성 용액법(ionic liquid) [4]을 이용하여 전계효과 특성을 측정하였다.

  • PDF

Diffusion characterization of Doped Oxide and Nitride Film (도핑한 산화막 및 질화막의 확산특성)

  • 이종덕;김원찬
    • Journal of the Korean Institute of Telematics and Electronics
    • /
    • v.22 no.2
    • /
    • pp.97-105
    • /
    • 1985
  • Phosphorus and boron diffusion from doped PECVD oxide films into silicon have been studied. CVD PSG was also prepared to parallelly compare the diffusion characteristics of CVD PSG with that in PECVD PSG, The phosphorus diffusion experiments were performed in N2 and O2 ambient at the temperatures of 100$0^{\circ}C$, 105$0^{\circ}C$ and 110$0^{\circ}C$ The parameters of boron diffusion have been investigated from the doped film prepared by changing B2 H6 flow rate and deposition temperature. The diffusivities and diffusion profiles of the dopant into silicon were calculated by applying Barry's model using the measured parameters such as diffusion depth and surface concentration.

  • PDF

Hot Pressing and Spark Plasma Sintering of AlN-SiC-TiB2 Systems using Boron and Carbon Additives (보론과 카본 조제를 사용한 AlN-SiC-TiB2계의 고온가압 및 Spark Plasma Sintering)

  • Lee, Sea-Hoon;Kim, Hai-Doo
    • Journal of the Korean Ceramic Society
    • /
    • v.46 no.5
    • /
    • pp.467-471
    • /
    • 2009
  • Effects of boron and carbon on the densification and thermal decomposition of an AlN-SiC-$TiB_2$ system were investigated. $SiO_2$ was mostly removed by the addition of carbon, while $Al_2O_3$ formed $Al_4O_4C$ and promoted the densification of the systems above $1850^{\circ}C$. Rather porous specimens were obtained without the additives after hot pressing at $2100^{\circ}C$, while densification was mostly completed at $2000^{\circ}C$ by using the additives. The sintering temperature decreased further to $1950^{\circ}C$ by applying spark plasma sintering. The additives promoted the shrinkage of AlN by forming a liquid phase which was originated from the carbo- and boro-thermal reduction of $Al_2O_3$ and AlN.

Thermally Induced Metastability in Boron-Doped Amorphous Silicon Thin Film Transistor (보론 도우핑된 비정질 실리콘 박막 트랜지스터의 열에 의한 준안정성 연구)

  • Lee, Yi-Sang;Chu, Hye-Yong;Jang, Jin
    • Journal of the Korean Institute of Telematics and Electronics
    • /
    • v.26 no.3
    • /
    • pp.130-136
    • /
    • 1989
  • Electrical transport and thermally induced metastability in hydrogenated amorphous silicon (a-Si:H) thin film transistors (TFTs) using boron-doped amorphous silicon as an active layer have been studied. The device characteristics n-channel and p-channel operations. The thermal quenching experiments on amorphous silicon-silicon nitride ambipolar TFT give clear evidence for the co-existence of two distinct metastable changes. The densities of metastable active dopants and dangling bonds increase with the quenching temperature. On the other hand, the interface state density appears to decrease with increasing quenching temperature.

  • PDF