• Journal of Welding and Joining
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• v.21 no.4
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• pp.69-74
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• 2003

The mechanical properties of STD11 Joints by using TLP (Transient Liquid Phase Diffusion) bonding method employing MBF-30 and MBF-80 insert metals were investigated with concerning to the microstructural change. TLP bonding of STD 11 was carried out at 1323∼1423K for 0.6ks∼3.6ks in vacuum. The microstructure and the element distribution of the interlayer between tool steels and insert metals showed specific feature with bonding conditions. It was found that the width of the interlayer increased at initial bonding stage. However, the width of interlayer showed nearly constant value during the isothermal solidification. After isothermal solidification was completed, the joint showed homogeneous element distribution and similar microstructure with base metal because of the grain boundary migration to the bonded interlayer. The bonding strength measured by a tensile test has been varied with the bonding conditions. The maximum joint strength, 760MPa, was obtained with the condition of 1423K for 1.2ks using MBF30 insert metal in this experiment.

• Proceedings of the Korea Concrete Institute Conference
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• 1995.10a
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• pp.293-298
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• 1995

This study experimentally evaluate the bonding performance of repair and strengthening materials. It is very important problem to justify bonding properties between repair and strengthening materials and old concrete. Many previous research and investigation showed that bonding strength of reinforcing materials determines the strengthening effect and the durability of repair work. Therefore, menifestation of bonding properties and the improvement of bonding performance of repair and strengthening materials are very important. In order to improve the perforamnce of repair work, it needs to investigate the behavior of bonding materials, such as stress distribution along the bonding area and the long term performance of the material. The target repair methods are steel plate addition technique and repair mortar method, and the test parameters studied in this paper include epoxy thickness, bonding surface texture, and bonding area.

• Proceedings of the Korean Geotechical Society Conference
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• 2001.03a
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• pp.323-330
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• 2001

The existing bonding methods of steel pipe piles into pile caps have many problems during construction or design. To overcome these, the composite bonding method of the bolting type and the welding type are proposed in this stud\ulcorner. The full scale test and the numerical analysis using finite element method were performed to verify the function of them. As results, the method of the filled with concrete in steel pipe piles head was good effective to increse strength. And the composite bonding methods are effective to protect the damage caused by earthquake than the bolted bonding method. Also, the composite bonding methods are cheaper than the existing bonding methods and a good construction as well.

• Journal of Welding and Joining
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• v.19 no.4
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• pp.423-428
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• 2001

The bonding phenomena of Ni base single crystal superalloy. CMSX-4 during transient liquid phase(TLP) bonding was investigated using MBF-80 insert metal. Bonding of CMSX-4 was carried out at 1,373∼1,548K for 0∼19.6ks in vacuum. The (001) orientation of each test specimen was aligned perpendicular to the bonding interface. The dissolution width of base metal was increased when the bonding temperature and holding time were increased. The eutectic width diminished linearly with the square root of holding time during isothermal solidification process. Borides were formed in the bonded layer during TLP bonding operation. The solid phase grew epitaxially into the liquid phase from substrates and single crystallization could be readily achieved during the isothermal solidification.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.26 no.6
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• pp.1187-1193
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• 2002

Anodic bonding process has been quantitatively evaluated based on the Taguchi analysis of the interfacial fracture toughness, measured at the interface of anodically bonded silicon-glass bimorphs. A new test specimen with a pre-inserted blade has been devised for interfacial fracture toughness measurement. A set of 81 different anodic bonding conditions has been generated based on the three different conditions for four different process parameters of bonding load, bonding temperature, anodic voltage and voltage supply time. Taguchi method has been used to reduce the number of experiments required for the bonding strength evaluation, thus obtaining nine independent cases out of the 81 possible combinations. The interfacial fracture toughness has been measured for the nine cases in the range of 0.03∼6.12 J/㎡. Among the four process parameters, the bonding temperature causes the most dominant influence to the bonding strength with the influence factor of 67.7%. The influence factors of other process parameters, such as anodic voltage and voltage supply time, bonding load, are evaluated as 18%, 12% and 2.3%, respectively. The maximum bonding strength of 7.23 J/㎡ has been achieved at the bonding temperature of 460$\^{C}$ with the bonding load of 45gf/㎠, the applied voltage of 600v and the voltage supply time of 25minites.

• Journal of the Korean institute of surface engineering
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• v.49 no.6
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• pp.560-566
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• 2016

In this study, porcelain bonding strength and mechanical properties of sintered Ni-Cr-Ti alloy for dental prosthodontics have been researched experimentally. Mechanical and morphological characteristics of the alloys were examined by Vickers hardness test, tensile and bonding strength test, surface roughness test, field-emission scanning electron microscopy, energy dispersive X-ray spectroscopy, and X-ray diffraction. In the sintered Ni-13Cr-xTi alloys, morphology of sintered alloy showed porous matrix diffused with alloying elements of Cr and Ti, and showed dendritic structure after melting process. From the XRD results, the second phases of NiCr, $Ni_3Cr$, and $Ni_3Ti$ were formed in the case of sintered and melted Ni-13Cr-xTi alloys. The tensile strength and hardness of Ni-13Cr-xTi alloys increased, as Ti content increased. Surface roughness increased, as Ti content increased. The bonding strength between metal and porcelain of Ni-13Cr-5Ti alloy was higher than those of Ni-13Cr and Ni-13Cr-10Ti alloys

• The korean journal of orthodontics
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• v.39 no.6
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• pp.393-401
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• 2009

Objective: The purpose of this study was to compare the shear bond strength (SBS) of brackets and microleakage of a tooth-adhesive-bracket complex bonded with a direct and an indirect bonding technique after thermocycling. Methods: Fifty non-carious human premolars were divided into two equal groups. In the direct bonding group a light-cured adhesive and a primer (Transbond XT) was used. In the indirect-bonding group, a light-cured adhesive (Transbond XT) and chemical-cured primer (Sondhi Rapid Set) were used. After polymerization, the teeth were kept in distilled water for 24 hours and thereafter subjected to thermal cycling (500 cycles). For the microleakage evaluation, 10 teeth from each group were further sealed with nail varnish, stained with 0.5% basic fuchsin for 24 hours, and examined under a stereomicroscope. Fifteen teeth from each group were used for SBS testing with the universal testing machine and adhesive remnant index (ARI) evaluation. Data were analyzed using the Mann-Whitney U test, Chi-square test, and Fisher's exact test. Results: There were no statistical differences on SBS and microleakage between the two bonding techniques. The indirect bonding group had a significantly lower ARI score. Bracket failures were obtained between enamel-resin interfaces. Conclusions: The type of bonding technique did not significantly affect the amount of microleakage and SBS.

• The Journal of Advanced Prosthodontics
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• v.9 no.5
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• pp.350-357
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• 2017

PURPOSE. The object of the present study was to evaluate the shear bonding strength of composite to PEKK by applying several methods of surface treatment associated with various bonding materials. MATERIALS AND METHODS. One hundred and fifty PEKK specimens were assigned randomly to fifteen groups (n = 10) with the combination of three different surface treatments (95% sulfuric acid etching, airborne abrasion with $50{\mu}m$ alumina, and airborne abrasion with $110{\mu}m$ silica-coating alumina) and five different bonding materials (Luxatemp Glaze & Bond, Visio.link, All-Bond Universal, Single Bond Universal, and Monobond Plus with Heliobond). After surface treatment, surface roughness and contact angles were examined. Topography modifications after surface treatment were assessed with scanning electron microscopy. Resin composite was mounted on each specimen and then subjected to shear bond strength (SBS) test. SBS data were analyzed statistically using two-way ANOVA, and post-hoc Tukey's test (P<.05). RESULTS. Regardless of bonding materials, mechanical surface treatment groups yielded significantly higher shear bonding strength values than chemical surface treatment groups. Unlike other adhesives, MDP and silane containing self-etching universal adhesive (Single Bond Universal) showed an effective shear bonding strength regardless of surface treatment method. CONCLUSION. Mechanical surface treatment behaves better in terms of PEKK bonding. In addition, self-etching universal adhesive (Single Bond Universal) can be an alternative bonding material to PEKK irrespective of surface treatment method.

• Journal of IKEEE
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• v.20 no.2
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• pp.205-208
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• 2016

In this paper, different types of touch screen silver pastes for bonding in conductive pattern formed over the ito film by bonding each sample of 5 was dried. The dry conditions, the oxidation of the ito film is a condition that does not occur. Reliability testing constant temp and humidity, cold-hot impact test is in progress. Each test will check the status of five sheets conductive pattern bonding. Conductive pattern bonding, after each 240,480,615 hours to check the status of silver pattern bonding. Reliability testing these through different silver pastes can see that the change in the adhesion and conductivity deterioration of the quality can be prevented, and reliability testing low temperature curing from the surface of silver pastes that can come as soon as the discoloration was unknown.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.11a
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• pp.4-4
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• 2009

Surface analysis on defective wire-bonding pads are performed in flash memory assembly. Week wire bonding may cause a significant effect on the final product reliability, and the surface condition of the aluminum bond pads is critical in terms of product reliability. To find out possible week bonding on semiconductor interconnects, ball sheer test (BST) has been performed. On some defective or week bonded pads, we have investigated the surface contents, assuming that the week bonding is induced from the surface conditions. AES and XPS are employed for the quantitative surface analysis on defective dies.