• Proceedings of the Korean Geotechical Society Conference
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• 2002.03a
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• pp.389-396
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• 2002

Engineers should be careful in the design of bonding piles into pile caps because they are weak points in the pile foundation. Therefore in this study, the mechanism of bonding piles into pile caps was explained, and the design method of the composite bonding method was proposed. And the proposed design method was verified in comparison with the result of the full scale test. Also, the characteristic for the bearing capacity and the mechanism of compressive load of bonding method were analyzed.

• Journal of the Korean GEO-environmental Society
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• v.8 no.3
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• pp.41-49
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• 2007

The typical bonding methods which connect steel pipe pile and spread footing is bolted bonding method using +type cover plate for reinforcing a head of steel pipe pile. In this paper, stability of spread footing in pile foundation have been evaluated by loading test of +type cover plate for reinforcing a head of pile and hook type bonding method. The presents results from a series of pilot model test on vertically loaded piles foundation of bolted bonding method and hook type bonding method, pile foundation is identified to safety due to pile foundation exceed 8.5~21% which more than yield stress of steel pipe pile. As the results of horizontal loading tests, peak load of piles foundation of hook type bonding method has estimated in 41.1tonf and it was exceed about 33% which more than pile foundation of bolted bonding method.

• Journal of Welding and Joining
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• v.18 no.6
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• pp.62-67
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• 2000

Metallurgical characteristics of bonded region and high temperature mechanical properties of heat resistant alloy, Fe-35Ni-26Cr during liquid phase diffusion bonding were investigated employing AM17 insert metal. The insert metal for bonding, AM17 was newly developed Ni-base metal using interpolation method. Bonding of specimens were carried out at 1,403~1,463K for 600s in vacuum. The microconstituents in the bonded interlayer disappeared in the bonding temperature over 1,423K. The microstructures, alloying elements and hardness distribution in the base metal. The tensile strength and elongation of the joints at elevated temperatures were the same level as one of the base metal in the bonding temperature over 1,423K. The creep rupture strength and rupture lives of joints were almost identical to those of base metal.

• Proceedings of the KWS Conference
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• 2005.06a
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• pp.34-36
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• 2005

Copper wire bonding is an alternative interconnection technology that serves as a viable and cost saving alternative to gold wire bonding. In this paper, ultrasonic wedge bonding with $25{\mu}m$ copper wire on Au/Ni/Cu metallization of a PCB substrate was performed at ambient temperature. The central composite design of experiment (DOE) approach was applied to optimize the copper wire wedge bonding process parameters. After that, pull test of the wedge bond was performed to study the bond strength and to find the optimum bonding parameters. SEM was used to observe the cross section of the wedge bond. The pull test results show good performance of the wedge bond. Additionally, DOE results gave the optimized parameter for both the first bond and the second bond. Cross section analysis shows a continuous interconnection between the copper wire and Au/Ni/Cu metallization. The diffusion of Cu into the Au layer was also observed.

• Journal of Welding and Joining
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• v.31 no.3
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• pp.4-10
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• 2013

In electronic industry, the trend of future electronics will be flexible, bendable, wearable electronics. Until now, there is few study on bonding technology and reliability of bonding joint between chip with micro solder bump and flexible substrate. In this study, we investigated joint properties of Si chip with eutectic Sn-58Bi solder bump on Cu pillar bump bonded on flexible substrate finished with ENIG by flip chip process. After flip chip bonding, we observed microstructure of bump joint by SEM and then evaluated properties of bump joint by die shear test, thermal shock test, and bending test. After thermal shock test, we observed that crack initiated between $Cu_6Sn_5IMC$ and Sn-Bi solder and then propagated within Sn-Bi solder and/or interface between IMC and solder. On the other hands, We observed that fracture propated at interface between Ni3Sn4 IMC and solder and/or in solder matrix after bending test.

• Journal of Welding and Joining
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• v.10 no.3
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• pp.63-72
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• 1992

The joining methods of ceramics to metals which can be expected to obtain high temperature strength are mainly classified into the solid-state diffusion bonding method and the active brazing method. Between these two, the solid-state diffusion bonding method is given attentions as substituting method for active brazing method due to being capable of obtaining higher bonding strength at high temperature and accurate bonding. In this paper, the solid-state diffusion bonding of $Al_{2}$O$_{3}$ ceramics to Ni-Cr-Mo alloy steel (SNCM21) using insert metal was carried out. The insert metal employed in this study was experimentally home-made, Ag-Cu-Ti alloy. Influence of several bonding parameters of $Al_{2}$O$_{3}$SNCM21 joint was quantitatively evaluated by bonding strength test, and microstructural analyses at the interlayer were performed by SEM/EDX. From above experiments, the optimum bonding condition of the solid-state diffusion bonding of $Al_{2}$O$_{3}$/SNCM21 using Ag-Cu-Ti insert metal was determined. Futhermore, high temperature strength and thermal-shock properties of $Al_{2}$O$_{3}$/SNCM21 joint were also examined. The results obtained are as follows. 1. The maximum bonding strength was obtained at the temperature of 95% melting point of insert metal. 2. The high temperature strength of $Al_{2}$O$_{3}$/SNCM21 joint appeared to bemaximum value at test temperature 500.deg.C and the bonding strength with increasingtemperature showed parabolic curve. 3. The strength of thermal-shocked specimens was far deteriorated than those of as-bonded specimens. Especially, water-quenched specimen after heated up to 600.deg. C was directly fractured in quenching.

• Journal of the Korea institute for structural maintenance and inspection
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• v.25 no.5
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• pp.149-156
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• 2021

FRP has been proposed to replace the steel as a reinforcement in the concrete structures for addressing the corrosion issue. However, FRP-Rebar does not behave in the same manner as steel because the properties of FRP are different. For example, FRP-Rebar has a high tensile strength, low stiffness, and linear elastic behavior which results in a difference bonding mechanism to transfer the load between the reinforcement and the surrounding concrete. Therefore, bonding behavior between FRP-Rebar and concrete has to be investigated using the bonding test. So, Pull-out test has been used to estimate bond behavior because it is simple. However, the results of pull-out test have a difference with flexural-boding behavior of FRP-Rebar concrete member. So, it is needed to evaluate the real fleuxral-bonding behavior. In this study, the evaluation method to flexural-bonding behavior of FRP-Rebar concrete member was reviewed and compared. It was found that the most accurate evaluation method for the fleuxral-bonding behavior of FRP-Rebar concrete member was splice beam test, however, the size and length of specimen have to increase than other test method and the design and analysis of splice beam is complex. Meanwhile, characteristics of concrete could be reflected by using arched beam test, unlike hinged beam test which is based on the ignored change of moment arm length in equilibrium equation. However, the possibility of shear failure exists before the flexural-bonding failure occur.

• Computers and Concrete
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• v.13 no.3
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• pp.411-421
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• 2014

A central pullout test was conducted to investigate the bonding properties between high strength rebar and reactive powder concrete (RPC), which covered ultimate pullout load, ultimate bonding stress, free end initial slip, free end slip at peak load, and load-slip curve characteristics. The effects of varying rebar buried length, thickness of protective layer and diameter of rebars on the bonding properties were studied, and how to determine the minimum thickness of protective layer and critical anchorage length was suggested according the test results. The results prove that: 1) Ultimate pull out load and free end initial slip load increases with increase in buried length, while ultimate bonding stress and slip corresponding to the peak load reduces. When buried length is increased from 3d to 4d(d is the diameter of rebar), after peak load, the load-slip curve descending segment declines faster, but later the load rises again exceeding the first peak load. When buried length reaches 5d, rebar pull fracture occurs. 2) As thickness of protective layer increases, the ultimate pull out load, ultimate bond stress, free end initial slip load and the slip corresponding to the peak load increase, and the descending section of the curve becomes gentle. The recommended minimum thickness of protective layer for plate type members should be the greater value between d and 10 mm, and for beams or columns the greater value between d and 15 mm. 3) Increasing the diameter of HRB500 rebars leads to a gentle slope in the descending segment of the pullout curve. 4) The bonding properties between high strength steel HRB500 and RPC is very good. The suggested buried length for test determining bonding strength between high strength rebars and RPC is 4d and a formula to calculate the critical anchorage length is established. The relationships between ultimate bonding stress and thickness of protective layer or the buried length was obtained.

• The Journal of Korean Academy of Prosthodontics
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• v.30 no.3
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• pp.411-436
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• 1992

The purpose of this study was to assess the adhesion of resilient denture liners (such as, heat-cured silicone molloplast B,cold- cured silicone Mollosil) to polymethyl metacrylate (K-33) and metal (Megalloy) in the laboratory by peel test. The resilient denture lines were processed according to manufactures instruction, onto prepared specimens(original resin base plate, rough resin base plate, stippled metal plate, mesh metal plate ) 75mm long and 25m wide. And then, the peel test was performed by instron. The results were as follows : 1. The bonding strength of Mollosil was stronger than that of Molloplast B except the specimen of stippled metal plate. 2. The tensile strength of Mollosil was weaker than that of Molloplast Bas tearing of Mollosil was occured in the peel test. 3. Mesh metal plate had the highest bonding strength in the case of Molloplast B and Mollosil. But stippled metal plate have high bonding strength in the case of Molloplast B and have the lowest bonding strength in the case of Mollosil. 4. The bonding strength of rough resin base plate was stronger than that of original resin base plate in the case of Molloplast B and Mollosil. 5. The bonding strength of metal plates was stronger than that of resin base plates in the case of Molloplast B and Mollosil except the case of bonding strength between the stippled metal plate and Mollosil. 6. It seems that the Increase of surface and retention form of metal plate and resin base plate produces higher physical bonding strength.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.22 no.3
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• pp.199-204
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• 2009

The effect of temperature on ACF thermocompression bonding for FPD assembly was investigated, It was found that Au bumps on driver IC's were not bonded to the glass substrate when the bonding temperature was below $140^{\circ}C$ so bonds were made at temperatures of $163^{\circ}C$, $178^{\circ}C$ and $199^{\circ}C$ for further testing. The bonding time and pressure were constant to 3 sec and 3.038 MPa. To test bond reliability, FPD assemblies were subjected to thermal shock storage tests ($-30^{\circ}C$, $1\;Hr\;{\leftrightarrow}80^{\circ}C$, 1 Hr, 10 Cycles) and func! tionality was verified by driver testing. It was found all of FPDs were functional after the thermal cycling. Additionally, Au bumps were bonded using ACF's with higher conductive particle densities at bonding temperatures above $163^{\circ}C$. From the experimental results, when the bonding temperature was increased from $163^{\circ}C$ to $199^{\circ}C$, the curing time could be reduced and more conductive particles were retained at the bonding interface between the Au bump and glass substrate.