• 마이크로전자및패키징학회지
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• 제17권3호
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• pp.11-15
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• 2010

본 연구에서는 Sn-Pb 솔더를 이용한 열압착법을 이용하여 경성 인쇄 회로 기판 (rigid printed circuit board, RPCB)과 연성 인쇄 회로 기판 (flexible printed circuit board, FPCB)간 접합 시의 접합 조건을 최적화하는 연구를 진행하였다. 접합의 주요 변수로는 접합 압력, 온도 및 시간이 있으며 이러한 변수의 변화로 인해 접합부의 접합 형태와 박리 강도에서 많은 차이가 발생하는 것을 확인할 수 있었다. 또한 일정 접합 온도와 시간 조건 ($225^{\circ}C$, 7초)에서 22 N/cm의 최고 박리 강도를 보이며 이후로는 더 이상 박리 강도에서 큰 차이를 보이지 않게 되는데, 이를 박리 시험 시의 F-x (forcedisplacement) curve를 토대로 파괴 에너지를 산출하여 그 차이를 규명하였다. 최적의 접합 조건은 $225^{\circ}C$, 7초로 나타났다.

• Restorative Dentistry and Endodontics
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• 제22권1호
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• pp.447-463
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• 1997

The purpose of this study was to evaluate the effectiveness of copal varnish and five bonding agents(Scotchbond Multi-Purpose Plus Dental Adhesive System, Panavia 21, All Bond 2, Superbond D-Liner II plus, Fuji Duet) in reducing microleakage under amalgam restorations. Class V cavity were prepared on both buccal and lingual surface of sixty extracted human molars with cementum margin and were filled with different kinds of liners and amalgam. All teeth were stored at $37^{\circ}C$ in physiologic saline solution. After 1 week they were thermally stressed for 500 cycles between 5 and $55^{\circ}C$ in baths containing 0.5 % basic fuchsin dye. The dye penetrations were observed with a stereomicroscope. Scanning electron micrographs were taken of representative tooth sections from each group to assess the nature of the tooth/liner/amalgam interface. The statistical test were applied to the results using a one way analysis variance (ANOVA) and Duncan's multiple range test. The results were as follows ; 1. In all groups, the enamel margin showed significantly lower leakage value than the cementum margin (p<0.05). 2. At the dentin and enamel margins, the leakage value of Copalite-lined group showed significantly higher than that of no liner group (p<0.05), but showed significantly lower than that of bonding agent lined-groups (p<0.05). 3. There was no significant difference between the bonding agent lined-groups (p>0.05). 4. On the backscattered scanning electron microscopy observation, discontinuous gaps were observed between amalgam and dentin in the bonding agent-lined amalgam restorations and the bonding agents appeared to fill the gap space and were mixed with amalgam particles. At the amalgam/tooth interface, unsealed dentin and continuous gaps were found in both unlined and Copalite-lined restorations.

• 대한치과기공학회지
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• 제35권4호
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• pp.359-364
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• 2013

Purpose: This study was to observe characteristic of metal oxidation and bonding strength according to composition of Ni-Cr alloy for porcelain fused to metal crown. The three kinds of Ni-Cr alloy with different composition ratio of parent metal were observed general properties and chemical properties of each alloy surface and measured the shear bonding strength between ceramic and each alloys. The aim of study was to suggest the material for design of parent metal's composition ratio to development of alloy for porcelain fused to metal crown. Methods: The three kinds of alloy as test specimen was Ni(59wt%)-Cr(24wt%), Ni(67wt.%)-Cr(16wt.%) alloy and Ni(71wt%)-Cr(12wt%)alloy. The oxide on surface was observed by EDX. And the shear test was performed by MTS. Results: The surface property and oxide characteristic analysis of oxide layer, weight percentage of Element O within $Ni_{59}Cr_{24}$ alloy measured 23.03wt%, $Ni_{67}Cr_{16}$ alloy measured 21.13wt% and $Ni_{71}Cr_{12}$ alloy was measured 48.55wt%. And the maximum shear bonding strength was measured 58.02Mpa between $Ni_{59}Cr_{24}$ alloy and vintage halo(H2 group). Conclusion: The surface property and oxide characteristic three kind of Ni-Cr alloy was similar. and shear bonding strength showed the highest bonding strength in H2 specimens.

• 한국터널지하공간학회 논문집
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• 제12권3호
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• pp.247-255
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• 2010

숏크리트의 부착강도는 천정부의 낙반방지와 발파진동에 의한 숏크리트 탈락방지에 중요한 역할을 하는 요소이다. 따라서, 숏크리트의 부착상태평가는 품질관리의 주요 요소가 될 수 있다. 본 연구는 터널 내 발파에 의하여 숏크리트에 미치는 최대 입자속도를 예측하고, 발파 진동에 의한 숏크리트의 부착상태를 평가하기 위하여 수행되었다. 이를 위하여 현재 시공중인 터널현장에서 피난연락갱의 발파시 본선부 및 서비스 터널의 발파진동을 측정하였으며 충격반향시험을 수행하여 숏크리트-암반의 부착상태를 평가하였다. 충격반향시험 신호분석을 위하여 시간-주파수 영역 해석 기법을 도입하였으며 평가결과, 국내에서 일반적으로 시행되는 발파조건에서는 숏크리트와 암반의 부착력 손실(들뜸 현상)은 거의 발견되지 않았으며, 숏크리트 부착력 손상 가능성은 낮은 것으로 판단되었다.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2009년도 추계학술대회 논문집
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• pp.261-262
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• 2009

• 대한전기학회논문지:전기물성ㆍ응용부문C
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• 제50권1호
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• pp.37-40
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• 2001

New package process for PDP was proposed based on the glass-to-glass vacuum-electrostatic bonding process and tubeless packaging concept derived from the previous study. Hermeticity and operating performance of PDP test panel through the seal-off process application and the possibility for practical use might be high if the process simplicity and productivity-related effort was sequentially carried out.

• 대한치과보철학회지
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• 제43권4호
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• pp.415-425
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• 2005

Statement of problem : Fracture of composite resin core will be occulted by progress of crack. Bonding interface of different materials has large possibility of starting point of crack line. Therefore, the bond strength of glass fiber post to composite resin core is important for prevention of fracture. Purpose: This in vitro study tried to find out how to get the higher strength of glass fiber post to composite resin core through surveying the maximum load that fractures the post and cote complex. Materials and methods: 40 specimens made with glass fiber Posts(Style $post^{(R)}$, Metalor, Swiss) and composite resin core ($Z-100^{(R)}$, 3M, USA) were prepared and loaded to failure with push-out type shear-bond strength test in a universal test machine. The maximum fracture load and fracture mode were investigated in the specimens that were restored with four different surface treatments. With the data. ANOVA test was used to validate the significance between the test groups, and Bonferroni method was used to check if there is any significant statistical difference between each test group. Evely analysis was approved with 95% reliance. Results: On measuring the maximum fracture load of specimens, both the treatments of sandblasted and acid-etched one statistically showed the strength increase rather than the control group (p<0.005). The scanning electric microscope revealed that sand blasting made more micro-retention form not only on the resin matrix but on the glass fiber, and acid-etching contributed to increase in surface retention form, eliminated the inorganic particles in resin matrix. Specimen fracture modes investigation represented that sand blasted groups showed lower bonding failure than no-sand blasted groups. Conclusion: Referring to the values of maximum fracture load of specimens, the bonding strength was increased by sand blasting and acid-etching.

• 대한기계학회논문집A
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• 제28권4호
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• pp.435-442
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• 2004

This paper presents a hermetic MEMS on-chip package bonded by a closed-loop AuSn solder-line. We design three different package specimens, including a substrate heated specimen without interconnection-line (SHX), a substrate heated specimen with interconnection-line (SHI) and a locally heated specimen with interconnection-line (LHI). Pressurized helium leak test has been carried out for hermetic seal evaluation in addition to the critical pressure test for bonding strength measurement. Substrate heating method (SHX, SHI) requires the bonding time of 40min. at 400min, while local heating method (LHI) requires 4 min. at the heating power of 6.76W. In the hermetic seal test. SHX, SHI and LHI show the leak rates of 5.4$\pm$6.7${\times}$$^{-10}$ mbar-l/s, 13.5$\pm$9.8${\times}$$^{-10}$ mbar-l/s and 18.5$\pm$9.9${\times}$$^{-10}$ mbar-l/s, respectively, for an identical package chamber volume of 6.89$\pm$0.2${\times}$$^{-10}$. In the critical pressure test, no fracture is found in the bonded specimens up to the applied pressure of 1$\pm$0.1MPa, resulting in the minimum bonding strength of 3.53$\pm$0.07MPa. We find that the present on-chip packaging using a closed AuSn solder-line shows strong potential for hermetic MEMS packaging with interconnection-line due to the hermetic seal performance and the shorter bonding time for mass production.

• 한국자동차공학회논문집
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• 제21권4호
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• pp.113-119
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• 2013

The transient liquid phase (TLP) bonding was used to fabricate autogenous joints in a magnesium alloy AZ31 with the aid of a pure Ni interlayer. A $13{\mu}m$ thick pure Ni foil was used in order to form a Mg-Ni eutectic liquid at the joint interface. The interface of reaction and composition profiles were investigated as a function of bonding time using a pressure of 0.16 MPa and a bonding temperature of $515^{\circ}C$. The quality of the joints produced was examined by metallurgical characterization and the joint microstructure developed across the diffusion bonds was related to changes in mechanical properties as a function of the bonding time.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2005년도 춘계학술대회 논문집
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• pp.430-433
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• 2005

Laser bonding between similar and dissimilar thermoplastics has been investigated by making use of laser transmission weld technique. Spot welding of two layers of plastic materials has been demonstrated by using of a high-quality diode-laser with 808nm wavelength. Weld areas increases according to power density, exposure time. The results of peel out test show that peel strengths increase with the area of molten plastics. Layers, which have the same chemical properties, have good bonding qualities. A bonding method which dye film is coated on the interface is used for laser bonding between plastics with high transmission for laser wavelength. Laser transmission bonding is worthy of attention because it is not in contact, requires a few tooling devices, allows a flexible energy delivery and produces nearly invisible welds