• Steel and Composite Structures
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• 제31권3호
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• pp.233-242
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• 2019

Early detection of damage bonding state such as insufficient bonding strength and interface partial contact defect for the explosive clad pipe is crucial in order to avoid sudden failure and even catastrophic accidents. A generalized and efficient model of the explosive clad pipe can reveal the relationship between bonding state and vibration characteristics, and provide foundations and priory knowledge for bonding state detection by signal processing technique. In this paper, the slender explosive clad pipe is regarded as two parallel elastic beams continuously joined by an elastic layer, and the elastic layer is capable to describe the non-uniform bonding state. By taking the characteristic beam modal functions as the admissible functions, the Rayleigh-Ritz method is employed to derive the dynamic model which enables one to consider inhomogeneous system and any boundary conditions. Then, the proposed model is validated by both numerical results and experiment. Parametric studies are carried out to investigate the effects of bonding strength and the length of partial contact defect on the natural frequency and forced response of the explosive clad pipe. A potential method for identifying the bonding quality of the explosive clad pipe is also discussed in this paper.

• 한국전기전자재료학회논문지
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• 제16권5호
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• pp.365-371
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• 2003

We prepared silicon on insulator(SOI) wafer pairs of Si/1800${\AA}$ -SiO$_2$ ∥ 1800${\AA}$ -SiO$_2$/Si using water direct bonding method. Wafer pairs bonded at room-temperature were annealed by a normal furnace system or a fast linear annealing(FLA) equipment, and the micro-structure of bonding interfaces for each annealing method was investigated. Upper wafer of bonded pairs was polished to be 50 $\mu\textrm{m}$ by chemical mechanical polishing(CMP) process to confirm the real application. Defects and bonding area of bonded water pairs were observed by optical images. Electrical and mechanical properties were characterized by measuring leakage current for sweeping to 120 V, and by observing the change of wafer curvature with annealing process, respectively. FLA process was superior to normal furnace process in aspects of bonding area, I-V property, and stress generation.

• 한국가구학회지
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• 제11권1호
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• pp.53-59
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• 2000

This study was to measure formaldehyde emission and bonding strength of plywoods manufactured with urea-melamine formaldehyde adhesives, which were made from three different mixing ratios of urea and melamine, and with four different formaldehyde/urea-melamine molar ratios of 1.0,1.1,1.2 and 1.4. The results were as follows 1. Amount of formaldehyde emission was the lowest at the first method of molar ratio(F/(M+U)) 1.0. Amounts of formaldehyde emission of experimental manufactured adhesives were lower than that of commercial adhesive. 2. Bonding strength of dry specimen was the highest at the first method of molar ratio(F/(M+U)) 1.4. Dry bonding strength of molar ratio(F/(M+U)) 1.4 was similar to commercial adhesive. 3. Bonding strength of wet specimen was the highest at the second method of molar ratio(F/(M+U)) 1.4. Bonding strength of wet specimen used by the third method of molar ratio(F/(M+U)) 1.4 was almost equal to commercial adhesive.

• 비파괴검사학회지
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• 제26권5호
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• pp.343-352
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• 2006

본 논문에서는 금속 연소관, 단열 고무 그리고 내열 복합재로 구성된 연소관 조립체의 접착 체결 상태를 확인하기 위해 변형률, 음향방출 신호 그리고 초음파 시험자료를 이용한 비파괴 시험 방법이 제시되었다. 또한 내압 상태에서 연소관 조립체의 각 계면 접착 상태를 정량적으로 평가하기 위해 유한요소 해석이 수행되었다. 공압 시험 중 계측한 변형률 값과 음향방출 신호 상관관계 연구를 통해 연소관 조립체의 접착 건전성 평가가 가능했다. 그리고 연소관 조립체의 여러 접착 계면 중 첫 번째 계면인 연소관과 고무간의 접착은 초음파 방법으로 분류하였다. 이러한 연구를 통해 연소관 조립체의 모든 접착 계면은 1) 초기 완전 미접착, 2) 공압 시험 중 완전 접착 분리, 3) 공압 시험 중 부분 접착 분리, 4) 완전 접착 등 4가지 형태로 분류 및 검출되었다.

• 한국정밀공학회지
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• 제27권12호
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• pp.92-98
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• 2010

The design of press bonding tool in LCD module equipment is a very complex and difficult task because many design able variables are involved while their effects are not known. It takes longtime experiments and much expenses to verify the effects of these design variables. However the optimization of bonding tool using OLB(outer lead bonding) and PCB Bonding is a very important problem in LCD manufacturing process, so much design efforts have been made for improving the bonding tool performance. In this paper, a reasonable and fast process which gives optimized solution under the design requirements has been presented. Both analytical and statistical methods are employed in this process. A reliable analytic model using experiment-oriented FE analysis can be obtained, in which the regression equations that predict the tool efficiency from various DOE method are found. Improvement of tool efficiency could be estimated by the regression equations using meaningful factors converged by RSM(Response Surface Method). With this process a reasonable optimized solution that meets a variety of design requirements can be easily obtained.

• 한국산업융합학회 논문집
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• 제9권3호
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• pp.183-190
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• 2006

Generally, application of steel pile as deep foundation member needs specials requirement for the connection method between steel pipe and concrete footing. To investigate real compressive behavior of connection member between steel pipe pile and concrete footing, three specimens were tested with carefully designed experimental system. Main test variable is the connection method between steel pipe pile and concrete footing. The bolted bonding method and hook bonding method was considered as the connection method in this study. From the test results gained from experiment, it was conformed that two types of connection method have the almost same compressive resistance capacity. Therefore, we can conclude that these two connection methods can be used as the strengthening method to verify the compressive composite action of concrete and steel pipe pile.

• Journal of Welding and Joining
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• 제13권2호
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• pp.132-138
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• 1995

Rene80 superalloy was liquid phase diffusion bonded by using boron(B) as an insert material, where B has high diffusivity and higher melting point as an insert material. Bonding procedure and bonding mechanism of Rene80/B/Rene80 joint were investigated. As results, liquid metal was produced by solid state reaction between base metal and insert material on bonding zone. The liquid metal was produced preferentially at the grain boundary. Except for production of liquid metal, other bonding procedure was nearly same as TLP(Transient Liquid Phase) bonding. Bonding time, however, was reduced compared to prior result of TLP bonding. By bonding S.4ks at l453K, Ren80/B/Rene80 joint was isothermally solidified and homogenized where thickness of insert material was 7.5.mu.m.

• Journal of Welding and Joining
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• 제12권4호
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• pp.110-116
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• 1994

This paper has been researched bondability of electronics devices, such as lead frame and the thick film of Ag/Pd on an alumina substrate by different heat sources. To obtain the bonds with high quality, it is very important to consist of different materials. Therefore, this paper clarifies not only heat mechanism of micro parallel gap resistance bonding method and pulse heat tip bonding method but also investigates selection of heat sources with micro-electronic materials for bonding. Finally, it is realized fluxless bonding process with filler metal such as plating layers.

• Journal of Welding and Joining
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• 제23권6호
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• pp.77-86
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• 2005

Low temperature bonding of the silicon and glass using the Spin-on Glass (SOG) has been conducted experimentally to figure out the effects of the SOG solution composition and process variables on bond strength using the Design of Experiment method. In order to achieve the high quality bond interface without rack, sufficient reaction time of the optimal SOG solution composition is needed along with proper pressure and annealing temperature. The shear strength under the optimal SOG solution composition and process condition was higher than that of conventional anodic bonding and similar to that of wafer direct bonding.

• Advances in materials Research
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• 제8권1호
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• pp.1-10
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• 2019

Roll bonding (RB) process of bi-metal laminates as a new noble method of bonding has been widely used in the production of bimetal laminates. In the present study, asymmetric roll bonding process as a new noble method has been presented to produce Al/Cu bimetallic laminates with the thickness reduction ratios 10%, 20% and 30% together with mismatch rolling diameter ($\frac{R_2}{R_1}$) ratio 1:1, 1:1.1 and 1:1.2. ABAQUS as a finite element simulation software was used to model the deformation of samples. The main attention in this study focuses on the bonding properties of Al/Cu samples. The effect of the $\frac{R_2}{R_1}$ ratios was investigated to improve the bond strength. During the simulation, for samples produced with $\frac{R_2}{R_1}=1:1.2$, the vertical plastic strain of samples was reach the maximum value with a high quality bond. Moreover, the peeling surface of samples after the peeling test was investigated by the scanning electron microscopy (SEM).