Comparison of Quantitative Interfacial Adhesion Energy Measurement Method between Copper RDL and WPR Dielectric Interface for FOWLP Applications (FOWLP 적용을 위한 Cu 재배선과 WPR 절연층 계면의 정량적 계면접착에너지 측정방법 비교 평가)
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- Journal of the Microelectronics and Packaging Society
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- v.25 no.2
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- pp.41-48
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- 2018