• Title/Summary/Keyword: Bonding Layer

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Comparison of Quantitative Interfacial Adhesion Energy Measurement Method between Copper RDL and WPR Dielectric Interface for FOWLP Applications (FOWLP 적용을 위한 Cu 재배선과 WPR 절연층 계면의 정량적 계면접착에너지 측정방법 비교 평가)

  • Kim, Gahui;Lee, Jina;Park, Se-hoon;Kang, Sumin;Kim, Taek-Soo;Park, Young-Bae
    • Journal of the Microelectronics and Packaging Society
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    • v.25 no.2
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    • pp.41-48
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    • 2018
  • The quantitative interfacial adhesion energy measurement method of copper redistribution layer and WPR dielectric interface were investigated using $90^{\circ}$ peel test, 4-point bending test, double cantilever beam (DCB) measurement for FOWLP Applications. Measured interfacial adhesion energy values of all three methods were higher than $5J/m^2$, which is considered as a minimum criterion for reliable Cu/low-k integration with CMP processes without delamination. Measured energy values increase with increasing phase angle, that is, in order of DCB, 4-point bending test, and $90^{\circ}$ peel test due to increasing roughness-related shielding and plastic energy dissipation effects, which match well interfacial fracture mechanics theory. Considering adhesion specimen preparation process, phase angle, measurement accuracy and bonding energy levels, both DCB and 4-point bending test methods are recommended for quantitative adhesion energy measurement of RDL interface depending on the real application situations.

Study of carbon nanotube cathode fabricated by screen printing on field emission properties (스크린 인쇄법으로 제작한 탄소나노튜브 캐소드의 전계방출 특성에 관한 연구)

  • 조영래
    • Proceedings of the Materials Research Society of Korea Conference
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    • 2003.11a
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    • pp.27-27
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    • 2003
  • 최근 탄소나노튜브를 전계방출 표시소자(FED, field omission display)용 에미터 재료로 사용한 캐소드 개발에 대한 연구가 활발히 진행되고 있다. 캐소드전극으로는 투명전도성 반도체 박막인 ITO를 사용하고, 에미터용 재료로는 탄소나노튜브를 사용해서 스크린 인쇄법으로 2극(diode type)형 전계방출 소자용 캐소드를 제작하였다. 본딩재(bonding materials)의 종류와 공정변수를 달리해서 에미터용 탄소나노튜브와 ITO 캐소드 전극 사이의 전기적 접촉방법을 변화시켰을때 탄소나노튜브 캐소드의 전계방출 특성을 체계적으로 연구하였다. 첫째로, 본딩재의 전기전도성 (electrical conductivity)을 변수로 해서 탄소나노튜브 에미터의 전계강화(fold enhancement) 효과를 연구한 결과 본딩재의 구성 성분중 부도체(insulator)의 분율이 높을수록 전계강화 효과가 크게 나타남을 확인하였다. 두 번째로, ITO박막 캐소드전극과 탄소나노튜브 잉크 사이에 중간층(inter layer)을 형성시켜서 중간층이 전계방출 특성에 미치는 영향을 연구하여, 중간층의 존재가 탄소나노튜브의 전계방출 전류의 균일성과 전류밀도의 증가에 기여하는 것을 확인하였다. 본 연구의 결과 전계방출 전류가 안정적이면서 동시에 전계방출 효율이 크게 개선된 탄소나노튜브 캐소드를 제작하는 공정기술이 개발되었다. 개발된 기술은 기존의 방법에 비해서 탄소나노튜브 캐소드의 진공패키징시 아웃개싱(outgassing)의 양도 현격하게 작았으며, 에미터와 캐소드 전극 사이의 본딩력(adhesion)도 우수해서 항후 탄소나노튜브 전계방출 표시소자의 개발에 크게 기여할 것으로 판단된다.luminum 첨가량이 증가함에 따라 세라믹 수율도 증가하였음을 확인하였다. 합성된 aluminum-contained polycarbosilane은 20$0^{\circ}C$에서 1시간 동안 불융화과정을 거쳐 환원 및 진공 분위기에서 고온 열처리하였으며 이로부터 얻어진 시료에 대해 XRD분석을 수행하였다. SEM과 TEM을 이용하여 미세구조를 관찰하였다./100 duty로 구동하였으며, duty비 증가에 따라 pulse의 on-time을 고정하고 frequency를 변화시켰다. dc까지 duty비가 증가됨에 따라 방출전류의 양이 선형적으로 증가하였다. 전압을 일정하게 고정시키고 각 duty비에서 시간에 따라 방출전류를 측정한 결과 duty비가 높을수록 방출전류가 시간에 따라 급격히 감소하였다. 각 duty비에서 방출전류의 양이 1/2로 감소하는 시점을 에미터의 수명으로 볼 때 duty비 대 에미터 수명관계를 구해 높은 duty비에서 전계방출을 시킴으로써 실제의 구동조건인 낮은 duty비에서의 수명을 단시간에 예측할 수 있었다. 단속적으로 일어난 것으로 생각된다.리 폐 관류는 정맥주입 방법에 비해 고농도의 cisplatin 투여로 인한 다른 장기에서의 농도 증가 없이 폐 조직에 약 50배 정도의 고농도 cisplatin을 투여할 수 있었으며, 또한 분리 폐 관류 시 cisplatin에 의한 직접적 폐 독성은 발견되지 않았다이 낮았으나 통계학적 의의는 없었다[10.0%(4/40) : 8.2%(20/244), p>0.05]. 결론: 비디오흉강경술에서 재발을 낮추기 위해 수술시 폐야 전체를 관찰하여 존재하는 폐기포를 놓치지 않는 것이 중요하며, 폐기포를 확인하지 못한

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Intermetallic Compound Growth Characteristics of Cu/Ni/Au/Sn-Ag/Cu Micro-bump for 3-D IC Packages (3차원 적층 패키지를 위한 Cu/Ni/Au/Sn-Ag/Cu 미세 범프 구조의 열처리에 따른 금속간 화합물 성장 거동 분석)

  • Kim, Jun-Beom;Kim, Sung-Hyuk;Park, Young-Bae
    • Journal of the Microelectronics and Packaging Society
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    • v.20 no.2
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    • pp.59-64
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    • 2013
  • In-situ annealing tests of Cu/Ni/Au/Sn-Ag/Cu micro-bump for 3D IC package were performed in an scanning electron microscope chamber at $135-170^{\circ}C$ in order to investigate the growth kinetics of intermetallic compound (IMC). The IMC growth behaviors of both $Cu_3Sn$ and $(Cu,Ni,Au)_6Sn_5$ follow linear relationship with the square root of the annealing time, which could be understood by the dominant diffusion mechanism. Two IMC phases with slightly different compositions, that is, $(Cu,Au^a)_6Sn_5$ and $(Cu,Au^b)_6Sn_5$ formed at Cu/solder interface after bonding and grew with increased annealing time. By the way, $Cu_3Sn$ and $(Cu,Au^b)_6Sn_5$ phases formed at the interfaces between $(Cu,Ni,Au)_6Sn_5$ and Ni/Sn, respectively, and both grew with increased annealing time. The activation energies for $Cu_3Sn$ and $(Cu,Ni,Au)_6Sn_5$ IMC growths during annealing were 0.69 and 0.84 eV, respectively, where Ni layer seems to serve as diffusion barrier for extensive Cu-Sn IMC formation which is expected to contribute to the improvement of electrical reliability of micro-bump.

The Shear Bond Strength of Resin to Electroforming Gold according to the Surface Treatment (표면처리방법에 따른 Electroforming Gold와 레진과의 전단결합강도)

  • You, Byung-Il;Chang, Mun-Suk;Yoon, Tae-Ho;Park, Ju-Mi;Park, Charn-Woon
    • Journal of Dental Rehabilitation and Applied Science
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    • v.22 no.2
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    • pp.125-136
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    • 2006
  • Statement of problem. The success of the bonding between electroforming gold and resin is dependent on the surface-conditioning technique but its effective technique has net been studied widely. Purpose. The purpose of the study was to evaluate the bond strength between the electroforming gold and resin with varying the surface-conditioning technique. Materials and methods. Sixty rectangular shaped metal specimens were made and one side of each specimen were gold hard plated. The sand-blasted specimens were divided into four experimental groups with fifteen specimens in each group and were treated as follows. Group 1: Silicoating (Rocatec, 3M ESPE)+ Sinfony (3M ESPE), Group 2: SR Link+ SR Adoro (Ivoclar Vivadent), Group 3: Tin plating (Microtin, Danville Engineering)+ SR Link+ SR Adoro, Group 4: Tin plating (Micro tin, Danville Engineering)+ Silicoating (Rocatec)+ Sinfony. Shear bond strength at metal-resin interface were measured using universal testing machine. Energy Dispersive x-ray analysis was done and scanning electron microscope images were taken and observed. Results and Conclusion. The following conclusions were drawn. 1. The mean shear bond strength values in order were 11.69MPa (Group 2), 22.35MPa (Group 3), 22.40MPa (Group 1) and 27.71MPa (Group 4). There was no significant difference in Group 1, Group 3 and Group 4(P>0.05). 2. In the EDX line analysis, the Au was detected on the surface of all specimen. $SnO_2$ showed on the surface of Group 2 and $SiO_2$ was detected on the surface of Group 1. 3. Increasing of roughness by sandblasting(Group 2), formation of micro-irregularities and tin crystals by electrolytic tin plating(Group 3) and formation of surface irregularities and $SiO_2$ layer(Group 1,4) were observed in SEM photo. 4. Tin plating(Group 3) and Rocatec treatment(Group 1) showed clinically effective shear bond strength(>20MPa), but when the two surface conditioning method were used together higher bond strength were achieved.

Comparison of Push-out Bond Strengths According to Relining Procedure and Cement Type on Fiber Post (Fiber post의 Relining 방법과 시멘트 유형에 따른 Push-out Bond Strength의 비교)

  • Kang, Hyun-Young;Cho, So-Yeun;Yu, Mi-Kyung;Lee, Kwang-Won;Kim, Kyoung-A
    • Journal of Dental Rehabilitation and Applied Science
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    • v.27 no.3
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    • pp.253-265
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    • 2011
  • When restoring endodontically treated teeth is the mismatch between fiber post size and post space diameter, the resin cement layer is excessively thick in post space and voids are likely to form in it, thus predisposing to de-bonding. The method to overcome this problem is to reline the fiber post with composite resin. This individual anatomic post improves the adaptation of post to root walls and decreases the resin cement thickness. The purpose of this in vivo study was to evaluate the push-out bond strength of fiber post according to relining procedure and luting agents type used for simplicity of clinical procedure. Forty-two extracted teeth were divides into six groups.(n=7) A1: relined fiber post cemented with Luxacore/all-bons 2, A2: non-relined fiber post cemented with Luxacore/all-bond2, B1: relinind fiber post cemented with Calibra/XP-bond, B2: non-relined fiber post cemented with Calibra/XP-bond, C1: relined fiber post cemented with RelyX Unicem, C2: non-relined fiber post cemented with RelyX Unicem Push-out bond strength was affected by interaction between relining procedure and luting agent type. Relined fiber post presented higher push-out bond strength value than non-relined fiber post and statically significant differences(p<0.05) Cementation with RelyX Unicem showed significantly higher bond strength than other luting agents(p<0.05).

Interface Traps Analysis as Bonding of The Silicon/Nitrogen/Hydrogen in MONOS Capacitors (실리콘/수소/질소의 결합에 따른 MONOS 커패시터의 계면 특성 연구)

  • Kim, Hee-Dong;An, Ho-Myoung;Seo, Yu-Jeong;Zhang, Yong-Jie;Nam, Ki-Hyun;Chung, Hong-Bay;Kim, Tae-Geun
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.46 no.12
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    • pp.18-23
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    • 2009
  • The effect of hydrogen-nitrogen annealing on the interface trap properties of Metal-Oxide-Nitride-Oxide-Silicon (MONOS) capacitors is investigated by analyzing the capacitors' gate leakage current and the interface trap density between the Si and $SiO_2$ layer. MONOS samples annealed at $850^{\circ}C$ for 30 s by rapid thermal annealing (RTA) are treated by additional annealing in a furnace, using annealing eases $N_2$ and 2% hydrogen and 98% nitrogen gas mixture $(N_2-H_2)$ at $450^{\circ}C$ for 30 mins. Among the three samples as-deposited, annealed in $N_2$ and $N_2-H_2$, MONOS sample annealed in an $N_2-H_2$ environment is found to have the lowest increase of interface-trap density from the capacitance-voltage experiments. The leakage current of sample annealed in $N_2-H_2$ is also lower than that of sample annealed in $N_2$.

Effect of gas composition on the characteristics of a-C:F thin films for use as low dielectric constant ILD (가스 조성이 저유전상수 a-C:F 층간절연막의 특성에 미치는 영향)

  • 박정원;양성훈;이석형;손세일;오경희;박종완
    • Journal of the Korean Vacuum Society
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    • v.7 no.4
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    • pp.368-373
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    • 1998
  • As device dimensions approach submicrometer size in ULSI, the demand for interlayer dielectric materials with very low dielectric constant is increased to solve problems of RC delay caused by increase in parasitic resistance and capacitance in multilevel interconnectins. Fluorinated amorphous carbon in one of the promising materials in ULSI for the interlayer dielectric films with low dielectric constant. However, poor thermal stability and adhesion with Si substrates have inhibited its use. Recently, amorphous hydrogenated carbon (a-C:H) film as a buffer layer between the Si substrate and a-C:F has been introduced because it improves the adhesion with Si substrate. In this study, therfore, a-C:F/a-C:H films were deposited on p-type Si(100) by ECRCVD from $C_2F_6, CH_4$and $H_2$gas source and investigated the effect of forward power and composition on the thickness, chemical bonding state, dielectric constant, surface morphology and roughness of a-C:F films as an interlayer dielectric for ULSI. SEM, FT-IR, XPS, C-V meter and AFM were used for determination of each properties. The dielectric constant in the a-C:F/a-C:H films were found to decrease with increasing fluorine content. However, the dielectric constant increased after furnace annealing in $N_2$atomosphere at $400^{\circ}C$ for 1hour due to decreasing of flurorine content. However, the dielectric constant increased after furnace annealing in $N_2$atmosphere at $400^{\circ}C$ for 1hour due to decreasing of fluorine concentration.

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MACRO-SHEAR BOND STRENGTH AND MICRO-SHEAR BOND STRENGTH OF CEROMER BONDED TO METAL ALLOY AND FIBER REINFORCED COMPOSITE

  • Park Hyung-Yoon;Cho Lee-Ra;Cho Kyung-Mo;Park Chan-Jin
    • The Journal of Korean Academy of Prosthodontics
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    • v.42 no.6
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    • pp.654-663
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    • 2004
  • Statement of problem. According to the fracture pattern in several reports, fractures most frequently occur in the interface between the ceromer and the substructure. Purpose. The aim of this in vitro study was to compare the macro shear bond strength and microshear bond strength of a ceromer bonded to a fiber reinforced composite (FRC) as well as metal alloys. Material and methods. Ten of the following substructures, type II gold alloy, Co-Cr alloy, Ni-Cr alloy, and FRC (Vectris) substructures with a 12 mm in diameter, were imbedded in acrylic resin and ground with 400, and 1, 000-grit sandpaper. The metal primer and wetting agent were applied to the sandblasted bonding area of the metal specimens and the FRC specimens, respectively. The ceromer was placed onto a 6 mm diameter and 3 mm height mold in the macro-shear test and 1 mm diameter and 2 mm height mold in the micro-shear test, and then polymerized. The macro- and micro-shear bond strength were measured using a universal testing machine and a micro-shear tester, respectively. The macro- and micro-shear strength were analyzed with ANOVA and a post-hoc Scheffe adjustment ($\alpha$ = .05). The fracture surfaces of the crowns were then examined by scanning electron microscopy to determine the mode of failure. Chi-square test was used to identify the differences in the failure mode. Results. The macro-shear strength and the micro-shear strength differed significantly with the types of substructure (P<.001). Although the ceromer/FRC group showed the highest macroand micro-shear strength, the micro-shear strength was not significantly different from that of the base metal alloy groups. The base metal alloy substructure groups showed the lowest mean macro-shear strength. However, the gold alloy substructure group exhibited the least micro-shear strength. The micro-shear strength was higher than the macro-shear strength excluding the gold alloy substructure group. Adhesive failure was most frequent type of fracture in the ceromer specimens bonded to the gold alloys. Cohesive failure at the ceromer layer was more common in the base metals and FRC substructures. Conclusion. The Vectris substructure had higher shear strength than the other substructures. Although the shear strength of the ceromer bonded to the base metals was lower than that of the gold alloy, the micro-shear strength of the base metals were superior to that of the gold alloy.

Avoidance of Internal Resonances in Hemispherical Resonator Assemblies from Fused Quartz Connected by Indium Solder

  • Sarapuloff, Sergii A.;Rhee, Huinam;Park, Sang-Jin
    • Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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    • 2013.04a
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    • pp.835-841
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    • 2013
  • Modern solid-state gyroscopes (HRG) with hemispherical resonators from high-purity quartz glass and special surface superfinishing and ultrathin gold coating become the best instruments for precise-grade inertial reference units (IRU) targeting long-term space missions. Designing of these sensors could be a notable contribution into development of Korea as a space nation. In participial, 40mm diameter thin-shell resonator from high-purity fused quartz, fabricated as a single-piece with its supporting stem has been designed, machined, etched, tuned, tested, and delivered by STM Co. (ATS of Ukraine) several years ago; an extremely-high Q-factor (upto 10~20 millions) has been shown. Understanding of the best way how to match such a unique sensor with inner glass assembly of the gyro means how to use the high potential in a maximal extent; and this has become the urgent task. Inner quartz glass assembly has a very thin indium (In) layer soldered the resonator and its silica base (case), but effects of internal resonances between operational modal pair of the shell-cup and its side (parasitic) modes can notable degrade the potential of the sensor as a whole, instead of so low level of resonator's intrinsic losses. Unfortunately, there are special combinations of dimensions of the parts (so-called, "resonant sizes"), when intensive losses of energy occurs. The authors proposed to use the length of stem's fixture as an additional design parameter to avoid such cases. So-called, a cyclic scheme of finite element method (FEM) and ANSYS software were employed to estimate different combinations of gyro assembly parameters. This variant has no mismatches of numerical origin due to FEM's discrete mesh. The optimum length and dangerous "resonant lengths" have been found. The special attention has been paid to analyses of 3D effects in a cup-stem transient zone, including determination of a difference between the positions of geometrical Pole of the resonant hemisphere and of its "dynamical Pole", i.e., its real zone of oscillation node. Boundary effects between the shell (cup) and 3D short "beams" (inner and outer stems) have been ranged. The results of the numerical experiments have been compared with the classic model of a quasi-hemispherical shell band with inextensional midsurface, and the solution using Rayleigh's functions of the $1^{st}$ and $2^{nd}$ kinds. To guarantee the truth of the recommended sizes to a designer of the real device, the analytical and FEM results have been compared with experimental data for a party of real resonators. The consistency of the results obtained by different means has been shown with errors less than 5%. The results notably differ from the data published earlier by different researchers.

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Investigation of Degradation Mechanism of High Alumina Refractory in a Coal Gasifier (석탄 가스화기에서의 고알루미나 내화물의 손상 기구 규명)

  • Kim, Yuna;Lee, Jae Goo;Oh, Myongsook S.
    • Applied Chemistry for Engineering
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    • v.20 no.6
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    • pp.638-645
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    • 2009
  • High alumina refractory used in a coal gasifier was analyzed and the degradation mechanism by molten slag was investigated. The depth of refractory severely damaged by slag varied between 12~40 mm, including the adhered slag layer. The sample also showed the cracks formed in parallel to the slag/refractory interface. The degree of degradation varied with the micro-structures in the refractory. Fused alumina grains showed the uneven boundary and pore formation just along the edges, while the tablet alumina showed the slag penetrated between sintered alumina around which the formation of Al-Fe phase was observed. Calcium aluminate cements were not observed at the high temperature zone near the slag/refractory interface, probably due to dissolution into molten slag. Around large grains of alumina, rod shape alumina, which appeared to be recrystallized during cooling, were observed, and large pores were also formed around those grains. Therefore, in high alumina refractories, hot molten slag dissolves the bonding phase and rod-shape alumina phase is recrystallized upon cooling. During this process, cracks are developed due to structural change, and the degradation occurs by physical causes such as structural spalling.