• Journal of Welding and Joining
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• v.19 no.6
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• pp.608-613
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• 2001

In this study, the rotary bending fatigue test was carried out with two kinds of base metal, martensite stainless steel STR3 and austenite stainless steel STR35 and the dissimilar friction welded material with them. To compare the fatigue fifes according to the notch positions, the small circular defect was worked on the bonded line, 1.0mm and 0.5mm distance form the bonded line. The fatigue limits of the STR3 and STR35 base metal were 429.0MPa and 409.4MPa respectably. In comparison with fatigue life at the same notch positions, the STR35 specimens showed about 190% for base metal, 82% for 1.0mm distance notched specimens higher than that of the STR3. But the fatigue life of the 0.5mm distance notched STR35 specimen showed about 35% lower than that of the STR3 specimen. And the bonded line notched specimen was much lower fatigue life than the other specimens because of separation of the bonded line.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.58 no.10
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• pp.1881-1887
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• 2009

This paper discusses the effects of ECC (Earth Continuity Conductor) for reducing the level of induced sheath overvoltages at the single point bonded section of combined transmission lines which are mixed underground power cable with overhead line in one T/L. In previous papers, the characteristics of ECC on only underground power cable systems were sufficiently analyzed. However, the result of only underground power cable systems are totally different from that of combined transmission lines because ECC is commonly grounded with overhead grounding wire at mesh of cable head. Therefore, in this paper, the installation effects of ECC have been variously analyzed considering the three kinds of fault positions, cable formation of duct and trefoil, spacing between phase conductor and ECC, and the change of overhead transmission line section length on 154kV combined transmission line. Finally, simulation results show that ECC can effectively reduce the induced sheath voltage.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.32A no.3
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• pp.134-142
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• 1995

We discovered that each distinct shape of the roof-shaped peaks of (111) facets, which are generated on (110) cross-section of the directly bonded (100) silicon wafer pairs after KOH etching, can be mapped to one of three conditions of the interfacial oxide existing at the bonding interface as follows. That is, thick solid line can be mapped to stabilization, thin solid line to disintegration, and thin broken line to spheroidization. also we confirmed that most of the interfacial oxides of a well-aligned wafer pairs were disintegrated and spheroidized through high-temperature annealing process above 900$^{\circ}$C while the oxide was stabilized persistently when two wafers are bonded rotationally around their common axis perpendicular to the wafer planes.

• Proceedings of the KWS Conference
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• 2000.10a
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• pp.124-126
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• 2000

The fatigue crack propagation characteristics were investigated for two kind of heat-resisting steel(STR3 and STR35) commonly using in valve material of vehicles. From the experiment, the fatigue life of the specimens notched at bonded line was shown about 19.7％ and 72.2％ lower and the specimens notched at 1.0mmdistance from bonded line was shown about 25.2％ and 99.1％ higher than that of the base metal respectably.

• Composites Research
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• v.16 no.4
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• pp.51-58
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• 2003

Since the reliability of adhesively bonded joints is much dependent on the curing status of thermosetting adhesive, the on-line cure monitoring during the cure of adhesively joints could improve the quality of adhesively bonded joints. In this work, the dielectric method which measures the dissipation factor of the adhesive during the cure of joints and converts it into the degree of cure of the adhesive was devised. The relation between the dissipation factor and the degree of cure of adhesive was investigated, which could eliminate the temperature effect on the dissipation factor that is a strong function of the degree of cure and temperature of adhesive. From the investigation, it was found that the dissipation factor showed a trend similar to the cure rate of the adhesive.

• Journal of the Korean Wood Science and Technology
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• v.43 no.1
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• pp.60-67
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• 2015

In order to evaluate the bond performance of domestic larch glulam and the glass fiber reinforced plastic (GFRP) rod, the specimen with the GFRP rod bonded-in domestic larch glulam for pull-out test was produced. The test was carried out using various specimens with different gluing depth, width of glue-line and type of adhesive. The cantilever type rahmen structure specimen with bonded-in GFRP rods was produced based on the result of pull-out test, and its moment resistance performance was compared and examined with the moment resistance performance of slotted-in steel plate specimen. As a result of the pull-out test, the most excellent bond performance was found when the insertion depth of GFRP rods was 5 times larger than the diameter of GFRP rods. When the glue-line thickness was 1 mm, the bond performance improved by 17%~29% in comparison to the bond performance in the case of the glue-line thickness of 2 mm. Also, the bonded strength of the specimen used with poly-urethane adhesive was 2.9~4.0 times greater than the bonded strength of specimen used with resorcinol adhesive. The cantilever type rahmen structure specimen with bonded-in GFRP rods showed the moment resistance performance 0.82 times lower in comparison to the slotted-in steel plate specimen used with the drift pin, but the initial stiffness was similar as 0.93 times.

• Journal of the Korean institute of surface engineering
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• v.53 no.5
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• pp.227-231
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• 2020

This article investigated the effects of stainless steel plate-patterns bonded to aluminum frypan on the thermal distortion and surface temperature of the frypan during gas or induction heating. Two different stainless steel plate-patterns were employed: type A contains only circular holes and type B has not only circular holes but also vacant spaces of 0.5 mm thick and 40 mm long straight line crossing 60 mm long curved line. The bottom of the frypan was distorted during heating when type A stainless steel plate-bonded frypan while no significant thermal distortion was observed for type B stainless steel plate-bonded frypan during heating. Temperature of the frypan surface showed the same trend during gas heating, irrespective of stainless steel plate-patterns. During induction heating, however, the frypan with type B stainless steel plate-pattern showed lower surface temperature than the frypan with type A stainless steel plate-pattern. It is concluded that Type B stainless steel plate-pattern with circular holes and vacant spaces of lines is very effective for minimizing a thermal distortion and lowering the surface temperature of an aluminum frypan during induction heating.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2008.05a
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• pp.316-319
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• 2008

The L-bending of inner-structure bonded sandwich sheet metal is examined by using a bending die attached to the material testing machine. The specimen is composed of top and bottom layers and a middle layer of pyramid-core structure and each layer is bonded by brazing. The variables chosen for experiments were clearance between punch and die, location of bend line on the specimen surface and clamping type of specimen during L-bending. Effects of these variables on deformation of specimen around die-corner radius were investigated. It was shown that the irregular shapes of recess are formed in the inner layer of bended parts and they greatly depend on working conditions.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.28 no.4
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• pp.435-442
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• 2004

This paper presents a hermetic MEMS on-chip package bonded by a closed-loop AuSn solder-line. We design three different package specimens, including a substrate heated specimen without interconnection-line (SHX), a substrate heated specimen with interconnection-line (SHI) and a locally heated specimen with interconnection-line (LHI). Pressurized helium leak test has been carried out for hermetic seal evaluation in addition to the critical pressure test for bonding strength measurement. Substrate heating method (SHX, SHI) requires the bonding time of 40min. at 400min, while local heating method (LHI) requires 4 min. at the heating power of 6.76W. In the hermetic seal test. SHX, SHI and LHI show the leak rates of 5.4$\pm$6.7${\times}$$^{-10}$ mbar-l/s, 13.5$\pm$9.8${\times}$$^{-10}$ mbar-l/s and 18.5$\pm$9.9${\times}$$^{-10}$ mbar-l/s, respectively, for an identical package chamber volume of 6.89$\pm$0.2${\times}$$^{-10}$. In the critical pressure test, no fracture is found in the bonded specimens up to the applied pressure of 1$\pm$0.1MPa, resulting in the minimum bonding strength of 3.53$\pm$0.07MPa. We find that the present on-chip packaging using a closed AuSn solder-line shows strong potential for hermetic MEMS packaging with interconnection-line due to the hermetic seal performance and the shorter bonding time for mass production.

• Journal of Technologic Dentistry
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• v.27 no.1
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• pp.73-78
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• 2005

The surface-reacted layer of titanium castings greatly affects their mechanical properties. This study analyzed the interfacial zone of Ti-20%Zr-5%Cr alloy castings obtained from phosphate bonded investment and examined the relationship between the surface-reacted layer and hardness. The Vickers hardness of cast disks were tested at 20$\mu m$ intervals from the surface to 120$\mu m$ in depth. The cross-section was observed metallurgically, and line profile of the reacted layer was conducted under the EDX. The surface-reacted layer of Ti-20%Zr-5%Cr alloy is showed a similar tendency to Ti-6%Al-4%V alloy in thickness, and also Si diffusion in multiple reacted layer of Ti-20%Zr-5%Cr alloy is less than cp Ti and similar to Ti-6%Al-4%V alloy. The Vickers hardness in the surface layer was greater than in the inner part, and the Vickers hardness of Ti-20%Zr-5%Cr alloy ranged 650 to 390 and cp Ti ranged 810 to 160, Ti-6%Al-4%V alloy ranged 710 to 530 respectively.