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On-line Cure Monitoring of Adhesive Joints by Dielectrometry  

권재욱 (LG디지털 디스플레이 연구소)
진우석 (한국과학기술원 기계공학과)
이대길 (한국과학기술원 기계공학과)
Publication Information
Composites Research / v.16, no.4, 2003 , pp. 51-58 More about this Journal
Abstract
Since the reliability of adhesively bonded joints is much dependent on the curing status of thermosetting adhesive, the on-line cure monitoring during the cure of adhesively joints could improve the quality of adhesively bonded joints. In this work, the dielectric method which measures the dissipation factor of the adhesive during the cure of joints and converts it into the degree of cure of the adhesive was devised. The relation between the dissipation factor and the degree of cure of adhesive was investigated, which could eliminate the temperature effect on the dissipation factor that is a strong function of the degree of cure and temperature of adhesive. From the investigation, it was found that the dissipation factor showed a trend similar to the cure rate of the adhesive.
Keywords
Dielectrometry; Differential scanning calorimetry(DSC); On-line cure monitoring; Adhesively bonded joint; Self-sensor;
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  • Reference
1 In-Process Control of Epoxy Composite by Microdielectrometric Analysis. Part II: On-Line Real-Time Dielectric Measurements during a Compression Molding Process /
[ Stephan,F.;Duteurtre,X.;Fit,A. ] / Polymer Engineering and Science   DOI   ScienceOn
2 Correlation of Dielectric Cure Index to Degree of Cure for 3051-3056 Graphite Epoxy /
[ Day,D.R.;Shepard,D.D. ] / Proceeding of the 5th Annual ASM/ESD Advanced Composite Conference
3 A Role of Cure Monitoring Techniques for On-line Process Control /
[ McDonough,W.G.;Fanconi,B.M.;Mopsik,F.I.;Hunston,D.L. ] / Proceeding of the 6th Annual ASM/ESD Advanced Composite Conference
4 Modeling the Dielectric Behavior of Epoxy Resin Blends during Curing /
[ Moistros,G.M.;Bucknall,C.B. ] / Polymer Engineering and Science   DOI   ScienceOn
5 Measurement of the Degree of Cure of Glass Fiber Epoxy Composites Using Dielectrometry /
[ Bang,K.G.;Kwon,J.W.;Lee,D.G.;Lee,J.W. ] / Journal of Materials Processing Technology   DOI
6 Measurement of the Degree of Cure of Carbon Fiber Epoxy Composite Materials /
[ Kim,J.S.;Lee,D.G. ] / Journal of Composite Materials   DOI   ScienceOn
7 Dielectric Monitoring of Epoxy Cure-Detailed Analysis /
[ Wetton,R.E.;Foster,G.M.;Smith,V.R.;Richmond,J.C.;Neill,J.T. ] / 33rd International SAMPE Symposium
8 Dielectric Analysis of Polymer Materials /
[ Sichina,W.;Marcozzi,C.L.;Gill,P.S. ] / 35th International SAMPE Symposium
9 Time-Temperature-Transformation (TTT) Cure Diagram: Modeling the Cure Behavier of Themosets /
[ Enns,J.B.;Gillham,J.K. ] / Journal of Appllied Polymer Science   DOI   ScienceOn
10 Analysis of Dielectric Sensors for the Cure Monitoring of Resin Matrix Composite Materials /
[ Kim,J.S.;Lee,D.G. ] / Sensors and Actuators B   DOI
11 Dunamic Dielectric Analysis for Nondestructive Cure Monitoring and Process Controll /
[ Kranbuehl,D.E.;Delos,S.E.;Hoff,M.S.;Whitham,M.E.;Weller,L.W. ] / Proceeding of the 2nd Conference on Advanced Composites
12 Relationship between Viscoelastic Properties and Gelation in Thermosetting Systems /
[ Tung,C.Y.M.;Dynes,P.J. ] / Journal of Appllied Polymer Science   DOI   ScienceOn
13 /
[ Mallick,P.K. ] / Fiber Reinforced Composites
14 On-Line Monitoring and Viscosity Measurement of Carbon Fiber Epoxy Composite Materials /
[ Kim,J.S.;Lee,D.G. ] / Journal of Materials Processing Technology   DOI
15 The Effects of Surface Roughness and Bond Thickness on the Fatigue Life of Adhesively Bonded Tubular Single Lap Joints /
[ Kwon,J.W.;Lee,D.G. ] / Journal of Adhesion Science and Technology   DOI   ScienceOn