On-line Cure Monitoring of Adhesive Joints by Dielectrometry |
권재욱
(LG디지털 디스플레이 연구소)
진우석 (한국과학기술원 기계공학과) 이대길 (한국과학기술원 기계공학과) |
1 |
In-Process Control of Epoxy Composite by Microdielectrometric Analysis. Part II: On-Line Real-Time Dielectric Measurements during a Compression Molding Process
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DOI ScienceOn |
2 |
Correlation of Dielectric Cure Index to Degree of Cure for 3051-3056 Graphite Epoxy
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3 |
A Role of Cure Monitoring Techniques for On-line Process Control
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4 |
Modeling the Dielectric Behavior of Epoxy Resin Blends during Curing
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DOI ScienceOn |
5 |
Measurement of the Degree of Cure of Glass Fiber Epoxy Composites Using Dielectrometry
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DOI |
6 |
Measurement of the Degree of Cure of Carbon Fiber Epoxy Composite Materials
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DOI ScienceOn |
7 |
Dielectric Monitoring of Epoxy Cure-Detailed Analysis
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8 |
Dielectric Analysis of Polymer Materials
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9 |
Time-Temperature-Transformation (TTT) Cure Diagram: Modeling the Cure Behavier of Themosets
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DOI ScienceOn |
10 |
Analysis of Dielectric Sensors for the Cure Monitoring of Resin Matrix Composite Materials
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DOI |
11 |
Dunamic Dielectric Analysis for Nondestructive Cure Monitoring and Process Controll
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12 |
Relationship between Viscoelastic Properties and Gelation in Thermosetting Systems
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DOI ScienceOn |
13 |
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14 |
On-Line Monitoring and Viscosity Measurement of Carbon Fiber Epoxy Composite Materials
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DOI |
15 |
The Effects of Surface Roughness and Bond Thickness on the Fatigue Life of Adhesively Bonded Tubular Single Lap Joints
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DOI ScienceOn |