• The korean journal of orthodontics
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• v.28 no.5 s.70
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• pp.783-789
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• 1998

The purpose of this study was to evaluate the changes of shear bond strengths and failure patterns in orthodontic resin adhesives according to the water immersion time. Metal brackets were bonded to the specimens involving the premolars with chemical-cured($Concise^{\circledR}$) and light-cured($Transbond^{\circledR}$) adhesives. The shear bond strength was measured on universal testing machine and the failure patterns were assessed with the adhesive remnant index(ARI) after storage in distilled water at $37^{\circ}C$ for 1 day, 1 week and 1, 3, and 6 months, respectively. The results were as follows. 1. The shear bond strengths at the 6 month in both Concise and Transbond were significantly higher than those at the 1 day, 1 week and 1 month(p<0.05). There were positive correlations between shear bond strength and water immersion time in both Concise and Transbond(P<0.01). 2. There were no significant differences in shear bond strength between Concise and Transbond. 3. The brackets were failed primarily at the bracket base-adhesive interface and there was no significant difference in the incidence of ARI scores according to the water immersion time.

• Journal of the Korea Concrete Institute
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• v.28 no.5
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• pp.535-544
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• 2016

This paper aims at examining the effects of sustained load and elevated temperature on the time-dependent deformation of a carbon fiber reinforced polymer (CFRP) sheets bonded to concrete as well as the pull-off strength of single-lap shear specimens after the sustained loading period using digital images. Elevated temperature during the sustained loading period resulted in increased slip of the CFRP composites, whereas increased curing time of the polymer resin prior to the sustained loading period resulted in reduced slip. Pull-off tests conducted after sustained loading period showed that the presence of sustained load resulted in increased pull-off strength and interfacial fracture energy. This beneficial effect decreased with increased creep duration. Based on analysis of digital images, results on strain distributions and fracture surfaces indicated that stress relaxation of the epoxy occurred in the 30 mm closest to the loaded end of the CFRP composites during sustained loading, which increased the pull-off strength provided the failure locus remained mostly in the concrete. For longer sustained loading duration, the failure mode of concrete-CFRP bond region can change from a cohesive failure in the concrete to an interfacial failure along the concrete/epoxy interface, which diminished part of the strength increase due to the stress relaxation of the adhesive.

• The korean journal of orthodontics
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• v.28 no.4 s.69
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• pp.641-657
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• 1998

This study was undertaken to compare the bond strength and the fracture site of new and recycled brackets according to the base design. 252 sound premolars extracted for orthodontic treatment were collected and Type I, Type II, Type III brackets were divided into four groups by recycling method Each bracket was then bonded to an extracted premolar. Instron Universal Testing Machine(model W) was used to measure the shear bond strength, and the surface of the recycled brackets were viewed in SEM For the analysis of the results, one way ANOVA and Scheffe's multiple range test was executed using the SPSSWIN program. 1. The shear bond strength showed statistically significant difference according to the bracket base design(p<0.001). Type III bracket(round indentation base, micro-etched) showed the highest bond strength, Type I bracket(foil-mesh base) was second, and Type II bracket(grooved integral base, micro-etched) was last. 2. The effect of recycling on the bond strength was different according to bracket type. The shear bond strength of Type I, Type II brackets showed the smallist reduction when treated for 1 minute in Big Jane(p<0.05), but the shear bond strength of Type III brackets showed no statistically significant difference according to recycling method(p>0.05). 3. In Type I, Type II brackets, frequent fracture site was bracket-resin interface, but in Type III brackets, about half of the resin was retained on the tooth surface frequently. 4. The shear bond strength was highest when about half of the resin was retained on the tooth surface(p<0.05). 5. The resin remnant on the bracket base after recycling had no effect on the shear bond strength.

• Journal of the Microelectronics and Packaging Society
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• v.11 no.2 s.31
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• pp.23-28
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• 2004

We utilized Ag capping layer for fluxless bonding. To investigate the effect of Ag capping layer, two sets of sample were used. One set was bare In and Sn solders. The other set was In and Sn solders with Ag capping layer. In ($10{\mu}m$) and Sn ($10{\mu}m$) solders were deposited on Cu/Ti/Si substrate using thermal-evaporation, and Ag ($0.1{\mu}m$) capping layers were deposited on In and Sn solders. Solder joints were made by joining two In and Sn deposited specimens at $130^{\circ}C$ for 30 s under 0.8, 1.6, 3.2 MPa using thermal compression bonder. The contact resistance was measured using four-point probe method. The shear strength of the solder joints was measured by the shear test of cross-bar sample in the direction. The microstructure of the solder joints was characterized with SEM and EDS. In and Sn solders without Ag capping layers were only bonded at $130^{\circ}C$ under high bonding pressure. Also the shear strength of the In-Sn solder joints under was lower than that of the Ag/In-Ag/Sn solder joints. The resistance of the solder joints was $2-4\;m{\Omega}$ The solder joints consisted of In-rich phase and Sn-rich phase and the intermixed compounds were found at the interface. As bonding pressure increased, the intermixed compounds formed more.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.2
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• pp.47-53
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• 2015

The effects of electroless nickel immersion gold (ENIG) and organic solderability preservative (OSP) surface finishes on the in-situ intermetallics reaction and the electromigration (EM) reliability of Sn-3.0Ag-0.5Cu (SAC305) solder bump were systematically investigated. After as-bonded, $(Cu,Ni)_6Sn_5$ intermetallic compound (IMC) was formed at the interface of the ENIG surface finish at solder top side, while at the OSP surface finish at solder bottom side,$ Cu_6Sn_5$ and $Cu_3Sn$ IMCs were formed. Mean time to failure on SAC305 solder bump at $130^{\circ}C$ with a current density of $5.0{\times}10^3A/cm^2$ was 78.7 hrs. EM open failure was observed at bottom OSP surface finish by fast consumption of Cu atoms when electrons flow from bottom Cu substrate to solder. In-situ scanning electron microscope analysis showed that IMC growth rate of ENIG surface finish was much lower than that of the OSP surface finish. Therefore, EM reliability of ENIG surface finish was higher than that of OSP surface finish due to its superior barrier stability to IMC reaction.

• Proceedings of the KACD Conference
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• 2001.11a
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• pp.577-577
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• 2001

The lastest concepts in bonding are "total etch", in which both enamel and dentin are etched with an acid to remove the smear layers, and "wet dentin" in which the dentin is not blown dry but left moist before application of the bonding primer. Ideally, the application of a bonding agent to tooth structure should be insensitive to minor contamination from oral fluids. Clinically contaminations such as saliva, gingival fluid, blood and handpiece lubricant are often encountered by dentists during preparation of a restoration. The aim of this study was to evaluate the effect of contamination by hem-ostatic agents on shear bond strength of compomer restorations. One hundred and ten extracted human maxillary and mandibular molar teeth were collected. The teeth were cleaned from soft tissue remnant and debris and stored in physiologic solution until they were used. Small flat area on dentin of the buccal surface were wet ground serially with 400, 800 and 1200 abrasive paper on automatic polishing machine. The teeth were randomly divided into 11 groups. Each group was conditioned as follows: Group 1 : Dentin surface was not etched and not contaminated by hemostatic agents. Group2 : Dentin surface was not etched but was contaminated by Astringedent (Ultradent product Inc., Utah, U.S.A.). Group3 : Dentin surface was not etched but was contaminated by Bosmin (Jeil Phann, Korea.). Group4 : Dentin surface was not etched but was contaminated by Epri-dent (Epr Industries, NJ, U.S.A.). Group5: Dentin surface was etched and not contaminated by hemostatic agents. Group 6 : Dentin surface was etched and contaminated by Astringedent. Group7 : Dentin surface was etched and contaminated by Bosmin. Group8 : Dentin surface was etched and contaminated by Epri-dent. Group9 : Dentin surface was contaminated by Astringedent. The contaminated surface was rinsed by water and dried by compressed air. Group10 : Dentin surface was contaminated by Bosmin. The contaminated surface was rinsed by water aud dried by compresfed air. Group 11 : Dentin surface was contaminated by Epri-dent. The contaminated surface was rinsed by water and dried by compresfed air. After surface conditioning, F2000 was applicated on the conditoned dentin surface. The teeth were thermocycled in distilled water at $5^{\circ}C\;and\;55^{\circ}C$ for 1000 cycles. The samples were placed on the binder with the bonded compomer-dentin interface parallel to the lmife-edge shearing rod of the Universal testing machine(Zwick 020, Germany) running at a cross head speed of 1.0mmimin. There were no significant differences in shear bond strength between groups 1 and group 3 and 4, but group 2 showed significant decrease in shear bond strength compared with group 1. There were no significant differences in shear bond strength between group 5 and group 7 and 8, but group 6 showed significant decrease in shear bond strength compared with group 5. There were no significant differences in shear bond strength between group 5 and group 9, 10 and 11.

• Restorative Dentistry and Endodontics
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• v.30 no.3
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• pp.204-214
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• 2005

This study compared the microtensile bond strength (${\mu}$TBS) and microscopic change of two 2-step and two 1-step self-etching adhesives to dentin according to storage times in distilled water. Occlusal dentin was exposed in 48 human molars. They were divided to four groups by different adhesives: SE Bond group (Clearfil SE Bond), AdheSE group (AdheSE). Adper group (Adper Prompt L-Pop), and Xeno group (Xeno III) . Each group was stored in 37$^{\circ}C$ distilled water for 1, 15, and 30 days. Resin-bonded specimens were sectioned into beams and subjected to ${\mu}$TBS testing with a crosshead speed of 1 mm/minute. For SEM observation, one specimen was selected and sectioned in each group after each stroage time. Resin-dentin interface was observed under FE-SEM. In all storage times, mean ${\mu}$TBS of SE group was significantly higher than those of other groups (p < 0.05). There was no significant difference between mean ${\mu}$TBS of SE group and AdheSE group among all storage times, but significant difference between 1- and 30-day storage in mean y${\mu}$TBS of Adper group and Xeno group (p > 0.05). For 1-and 15-day storage, all groups showed the close adaptation between resin-dentin interfaces. For 30-day storage, resin-dentin interfaces showed wide gap in Adper group and separate pattern in Xeno III group.

• The korean journal of orthodontics
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• v.32 no.1 s.90
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• pp.51-57
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• 2002

The purpose of this study was to compare in vitro shear bonding strength with three different enamel surface preparations (1) 30% sulfated polyacrylic acid with 0.3M lithium sulfate (2) 40% sulfated polyacrylic acid with 0.3M lithium sulfate (3) 37% phosphoric acid. 105 extracted human premolar teeth were divided into each three groups of 35. Metal brackets were bonded to teeth in the three groups. The same self curing resin was used for all groups. A shearing force was applied to the teeth. After debonding, bases of bracket and enamel surfaces were examined under steroscopic microscope to determine the failure modes. Statistical analysis of the data was carried out with one way ANOVA and Student t- test. The results were as follows. 1. Shear bond strength values for the 30% polyacrylic acid and 40% polyacrylic acid group were approximately two thirds of the phosphoric acid group. It maintains clinically acceptable but not enough bond strength. 2. There was no statistically significant difference in shear bond strengths between 30% and 40% polyacrylic acid group. 3. The failure modes of brackets had some differences. In polyacrylic acid groups, the percentage of adhesive/enamel failure was higher than that of adhesive/ bracket interface failure. On the contrary in phosphoric acid groups, the results were reversed. Further study of bond strength could be required. If polyacrylic acid enamel conditioning is used clinically.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.15 no.4
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• pp.301-307
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• 2002

Direct bonded SOI wafer pairs with $Si ll SiO_2/Si_3N_4 ll Si$ the heterogeneous insulating layers of SiO$_2$-Si$_3$N$_4$are able to apply to the micropumps and MEMS applications. Direct bonding should be executed at low temperature to avoid the warpage of the wafer pairs and inter-diffusion of materials at the interface. 10 cm diameter 2000 ${\AA}-SiO_2/Si(100}$ and 560 $\AA$- ${\AA}-Si_3N_4/Si(100}$ wafers were prepared, and wet cleaned to activate the surface as hydrophilic and hydrophobic states, respectively. Cleaned wafers were pre- mated with facing the mirror planes by a specially designed aligner in class-100 clean room immediately. We employed a heat treatment equipment so called fast linear annealing(FLA) with a halogen lamp to enhance the bonding of pre mated wafers We kept the scan velocity of 0.08 mm/sec, which implied bonding process time of 125 sec/wafer pairs, by varying the heat input at the range of 320~550 W. We measured the bonding area by using the infrared camera and the bonding strength by the razor blade clack opening method, respective1y. It was confirmed that the bonding area was between 80% and to 95% as FLA heat input increased. The bonding strength became the equal of $1000^{\circ}C$ heat treated $Si ll SiO_2/Si_3N_4 ll Si$ pair by an electric furnace. Bonding strength increased to 2500 mJ/$\textrm{m}^2$as heat input increased, which is identical value of annealing at $1000^{\circ}C$-2 hr with an electric furnace. Our results implies that we obtained the enough bonding strength using the FLA, in less process time of 125 seconds and at lowed annealing temperature of $400^{\circ}C$, comparing with the conventional electric furnace annealing.

• Restorative Dentistry and Endodontics
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• v.30 no.4
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• pp.283-293
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• 2005

The purpose of this study was to evaluate the effect of dual bonding technique by comparing microshear bond strength between two different luting methods of resin cement to tooth dentin. Three dentin bonding systems(All-Bond 2, One-Step, Clearfil SE Bond), two temporary cements (Propac, Freegenol) were used in this study. In groups used conventional luting procedure, dentin surfaces were left untreated. In groups used dual bonding technique, three dentin bonding systems were applied to each dentin surface. All specimens were covered with each temporary cement. The temporary cements were removed and each group was treated using one of three different dentin bonding system. A resin cement was applied to the glass cylinder surface and the cylinder was bonded to the dentin surface. Then, micro-shear bond strength test was performed. For the evaluation of the morphology at the resin/dentin interface, SEM examination was also performed. 1. Conventional luting procedure showed higher micro-shear bond strengths than dual boning technique. However, there were no significant differences. 2. Freegenol showed higher micro-shear bond strengths than Propac, but there were no significant differences. 3. In groups used dual bonding technique, SE Bond showed significantly higher micro-shear bond strengths in One-Step and All-Bond 2 (p<0.05), but there was no significant difference between One-Step and All-Bond 2. 4. In SEM observation, with the use of All-Bond 2 and One-Step, very long and numerous resin tags were observed. This study suggests that there were no findings that the dual bonding technique would be better than the conventional luting procedure.