• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2018.06a
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• pp.102-102
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• 2018

Electronic industry had required the finer size and the higher performance of the device. Therefore, 3-D die stacking technology such as TSV (through silicon via) and micro-bump had been used. Moreover, by the development of the 3-D die stacking technology, 3-D structure such as chip to chip (c2c) and chip to wafer (c2w) had become practicable. These technologies led to the appearance of HBM (high bandwidth memory). HBM was type of the memory, which is composed of several stacked layers of the memory chips. Each memory chips were connected by TSV and micro-bump. Thus, HBM had lower RC delay and higher performance of data processing than the conventional memory. Moreover, due to the development of the IT industry such as, AI (artificial intelligence), IOT (internet of things), and VR (virtual reality), the lower pitch size and the higher density were required to micro-electronics. Particularly, to obtain the fine pitch, some of the method such as copper pillar, nickel diffusion barrier, and tin-silver or tin-silver-copper based bump had been utillized. TCB (thermal compression bonding) and reflow process (thermal aging) were conventional method to bond between tin-silver or tin-silver-copper caps in the temperature range of 200 to 300 degrees. However, because of tin overflow which caused by higher operating temperature than melting point of Tin ($232^{\circ}C$), there would be the danger of bump bridge failure in fine-pitch bonding. Furthermore, regulating the phase of IMC (intermetallic compound) which was located between nickel diffusion barrier and bump, had a lot of problems. For example, an excess of kirkendall void which provides site of brittle fracture occurs at IMC layer after reflow process. The essential solution to reduce the difficulty of bump bonding process is copper to copper direct bonding below $300^{\circ}C$. In this study, in order to improve the problem of bump bonding process, copper to copper direct bonding was performed below $300^{\circ}C$. The driving force of bonding was the self-annealing properties of electrodeposited Cu with high defect density. The self-annealing property originated in high defect density and non-equilibrium grain boundaries at the triple junction. The electrodeposited Cu at high current density and low bath temperature was fabricated by electroplating on copper deposited silicon wafer. The copper-copper bonding experiments was conducted using thermal pressing machine. The condition of investigation such as thermal parameter and pressure parameter were varied to acquire proper bonded specimens. The bonded interface was characterized by SEM (scanning electron microscope) and OM (optical microscope). The density of grain boundary and defects were examined by TEM (transmission electron microscopy).

• The korean journal of orthodontics
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• v.40 no.5
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• pp.342-348
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• 2010

Objective: The aim of this study was to compare the shear bond strengths (SBS) of orthodontic brackets bonded to enamel with a self-etching primer after bleaching, desensitizer application and combined treatment. Methods: Forty-eight premolars were randomly divided into four groups, each with n = 12 premolar samples. The four groups were; Group1: 15% hydrogen-peroxide office bleaching agent (Illumin$\acute{e}$ Office-IO), Group 2: IO + BisBlock Oxalate Dentin-Desensitizer, Group 3: Bis Block Oxalate Dentin-Desensitizer, Group 4: No treatment (control). Twenty-four hours after bonding, the specimens were tested in SBS at a crosshead speed of 5 mm/min until the brackets debonded. The failure mode of the brackets was determined by a modified adhesive remnant index. Results: Bleaching, bleaching and desensitizer treatment, and desensitizer treatment alone all significantly reduced SBS of the orthodontic brackets ($p$ = 0.001). No statistically significant difference was found between Group 1, Group 2 and Group 3 (Group 1-Group 2, $p$ = 0.564; Group 1-Group 3, $p$ = 0.371; Group 2-Group 3, $p$ = 0.133). The predominant mode of failure for the treatment groups (Group1, Group 2 and Group 3) was at the enamel-adhesive interface leaving 100% of the adhesive on the bracket base. Conclusions: Bleaching and desensitizer treatment should be delayed until the completion of orthodontic treatment.

• Restorative Dentistry and Endodontics
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• v.21 no.2
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• pp.602-618
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• 1996

The purpose of this study was to investigate the effect of acid treatment of fluoride applied dentin surface with various concentrations of phosphoric acid for various periods of time on dentin bonding. Dentin specimens prepared from freshly extracted bovine mandibular anterior teeth were divided into fluoridated and nonfluoridated groups. Specimens of nonfluoridated group were pretreated with 10% phosphoric acid for 15 seconds. Those of fluoridated groups were treated with 2% sodium fluoride or 2% stannous fluoride solution for 5 minutes and stored in $37^{\circ}C$ distilled water for 3 days, followed by phosphoric acid treatment. The concentrations of phosphoric acid were 10%, 32% or 50% and the treatment periods of time were 15, 30 or 60 seconds. All the specimens were bonded with All Bond$^{(R)}$ 2 and Bisfil$^{TM}$ composite resin. After bonded specimens were stored in $37^{\circ}C$ distilled water for 24 hours, tensile bond strengths of each specimens were measured and the pretreated dentin and the fractured dentin surfaces were examined under the scanning electron microscope. The results were as follows : The tensile bond strengths from the fluoridated groups were significantly lower than those from the nonfluoridated group when the concentrations of phosphoric acid and the treatment periods of time were equal in all the groups (p<0.05). In general, the higher the concentration of phosphoric acid and the longer the treatment period of time for acid etching on the fluoride applied dentin surface, the higher were the bond strength values. Recovery of bond strength of the dentin bonding agent was better in the NaF applied group than in the $SnF_2$ applied one. SEM findings of NaF applied and $SnF_2$ applied dentin surfaces demonstrated reaction product-covered and partially or completely obstructed dentinal tubules. SEM findings of dentin surfaces fluoridated for 5 minutes followed by etching showed wider tubular openings and more clean dentin surfaces when dentin was etched with higher concentration of phosphoric acid for longer period of time. On the SEM observations of the fractured dentin-resin interface, the etched specimens of fluoridated group showed an adhesive failure mode when the concentration of phosphoric acid and the treatment period of time were same as in the nonfluoridated group. As the concentration of phosphoric acid and the treatment period of time increase during acid etching, the cohesive failure area increased. However, excessive acid etching caused adhesive failure.

• Journal of the Korea Concrete Institute
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• v.14 no.1
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• pp.126-135
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• 2002

Plate bonding technique has been widely used in strengthening of existing concrete structures, although it has often a serious problem of premature falure such as interface separation and rip-off. However, this premature failure problem has not been well explored yet especially in view of local failure mechanism around the interface of plate ends. The purpose of the present study is, therefore, to identify the local failure of strengthened plates and to derive a separation criterion at the interface of plates. To this end, a comprehensive experimental program has been set up. The double lap pull-out tests considering pure shear force and half beam tests considering combined flexure-shear force were performed. The main experimental parameters include plate thickness, adhesive thickness, and plate end arrangement. The strains along the longitudinal direction of steel plates have been measured and the shear stress were calculated from those measures strains. The effects of plate thickness, bonded length, and plate end treatment have been also clarified from the present test results. Nonlinear finite element analysis has been performed and compared with test results. The Interface properties are also modeled to present the separation failure behavior of strengthened members. The cracking patterns as well as maximum failure loads agree well with test data. The relation between maximum shear and normal stresses at the interface has been derived to propose a separation failure criterion of strengthened members. The present study allows more realistic analysis and design of externally strengthened flexural member with steel plates.

• Journal of Korean Dental Science
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• v.2 no.2
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• pp.5-11
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• 2009

Objectives : This study investigated the hypothesis that the dentin bond strength of self-etching adhesives (SEAs) may be improved by applying a coat of hydrophobic, neutral adhesive resin in addition to SEA. Method and Materials : The bond strengths of two SEAs - Experimental SEA (EX) and Adper Prompt (AP) - were measured with three bonding protocols. The D/E resin of All-Bond 2 was applied as the hydrophobic, neutral adhesive. Clearfil SE Bond (SE, self-etching primer system) and All-Bond 2 (AB, total etching system) were used as references. The following protocols were used: (1) EX1 (EX 1 coat); (2) EX2 (EX 2 coats); (3) EX+ (EX 1 coat + D/E resin); (4) AP1 (AP 1 coat); (5) AP2 (AP 2 coats); (6) AP+ (AP 1 coat + D/E resin); (7) SE (SE primer + SE bond); (8) SE+ (SE primer + D/E resin); (9) AB (etching + AB primer + D/E resin). Filtek Z250 composite resin was built up and the microtensile bond strength (MTBS) values of the specimens were compared. The fractured surfaces were observed using SEM. Results : When SEA was used as self-etching primer and hydrophobic, neutral adhesive was applied as well, MTBS was significantly higher than that when either one coat or two coats of SEA only were used (p < 0.05). Conclusion : The hydrophobic, neutral adhesive improved the integrity of the bonded interface obtained with SEA.

• Journal of Welding and Joining
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• v.25 no.2
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• pp.82-88
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• 2007

Sn-3.0Ag-0.5Cu lead fee solder was generally utilized in electronics assemblies. But it is insufficient to research about activation energy(Q) that is applying to evaluate the solder joint reliability of environmental friendly electronics assemblies. Therefore this study investigated Q values which are needed to IMC formation and growth of Sn-3.0Ag-0.5Cu/Cu and Sn-40pb/Cu solder joints during aging treatment. We bonded Sn-3.0Ag-0.5Cu and Sn-40Pb solders on FR-4 PCB with Cu pad$(t=80{\mu}m)$. After reflow soldering, to observe the IMC formation and growth of the solder joints, test specimens were aged at 70, 150 and $170^{\circ}C$ for 1, 2, 5, 20, 60, 240, 960, 15840, 28800 and 43200 min, respectively. SEM and EDS were utilized to analysis the IMCS. From these results, we measured the total IMC$(Cu_6Sn_5+Cu_3Sn)$ thickness of Sn-3.0Ag-0.5Cu/Cu and Sn-40Pb/Cu interface, and then obtained Q values for the IMC$(Cu_6Sn_5,\;Cu_3Sn)$ growth of the solder joints.

• The Journal of Advanced Prosthodontics
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• v.8 no.2
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• pp.75-84
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• 2016

PURPOSE. To evaluate the effect of various surface treatments on the surface structure and shear bond strength (SBS) of different ceramics. MATERIALS AND METHODS. 288 specimens (lithium-disilicate, leucite-reinforced, and glass infiltrated zirconia) were first divided into two groups according to the resin cement used, and were later divided into four groups according to the given surface treatments: G1 (hydrofluoric acid (HF)+silane), G2 (silane alone-no heat-treatment), G3 (silane alone-then dried with $60^{\circ}C$ heat-treatment), and G4 (silane alonethen dried with $100^{\circ}C$ heat-treatment). Two different adhesive luting systems were applied onto the ceramic discs in all groups. SBS (in MPa) was calculated from the failure load per bonded area (in $N/mm^2$). Subsequently, one specimen from each group was prepared for SEM evaluation of the separated-resin-ceramic interface. RESULTS. SBS values of G1 were significantly higher than those of the other groups in the lithium disilicate ceramic and leucite reinforced ceramic, and the SBS values of G4 and G1 were significantly higher than those of G2 and G3 in glass infiltrated zirconia. The three-way ANOVA revealed that the SBS values were significantly affected by the type of resin cement (P<.001). FIN ceramics had the highest rate of cohesive failure on the ceramic surfaces than other ceramic groups. AFM images showed that the surface treatment groups exhibited similar topographies, except the group treated with HF. CONCLUSION. The heat treatment was not sufficient to achieve high SBS values as compared with HF acid etching. The surface topography of ceramics was affected by surface treatments.

• Journal of Dental Rehabilitation and Applied Science
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• v.23 no.1
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• pp.31-42
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• 2007

The purpose of this study was to compare the stress distribution according to the splinting condition and non-splinting conditions on the finite element models of the two units implant prostheses. The finite element model was designed with the parallel placement of two fixtures ($4.0mm{\times}11.5mm$) on the mandibular 1st and 2nd molars. A cemented abutment and gold screw were used for superstructures. A FEA models assumed a state of optimal osseointegration, as the bone quality, inner cancellous bone and outer 2 mm compact bone was designed. This concluded that the cortical and trabecular bone were assumed to be perfectly bonded to the implant. Splinting condition had 2 mm contact surface and non-splinting condition had $8{\mu}m$ gap between two implant prosthesis. Two group (Splinting and non-splinting) were loaded with 200 N magnitude in vertical axis direction and were divided with subdivision group. Subdivision group was composed of three loading point; Center of central fossa, the 2 mm and 4 mm buccal offset point from the central fossa. Von Mises stress value were recorded and compared in the fixture-bone interface and bucco-lingual sections. The results were as follows; 1. In the vertical loading condition of central fossa, splinting condition had shown a different von Mises stress pattern compared to the non-splinting condition, while the maximum von Mises stress was similar. 2. Stresses around abutment screw were more concentrated in the splinting condition than the non-splinting condition. As the distance from central fossa increased, the stress concentration increased around abutment screw. 3. The magnitude of the stress in the cortical bone, fixture, abutment and gold screw were greater with the 4 mm buccal offset loading of the vertical axis than with the central loading.

• Transactions of the Korean Society of Mechanical Engineers
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• v.16 no.10
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• pp.1890-1899
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• 1992

In bonded structures, there are V-notched cracks in dissimilar materials and the stress concentration of these V-notched cracks causes to occur interface cracks in dissimilar materials Therefore the strength evaluation of V-notched cracks in dissimliar materials seems to be important. The stress fields of a V-notched cracks is known as .sigma.$_{ij}$ .var. K $r_{p-1}$,where K is the stress intensity factor and p-1 is the stress singularity. When the distance, r, approaches to 0 at the stress fields of V-notched cracks, the stresses become infinites by two more stress singularities of p-1 and p-1 is no more -0.5. Stress singularities and stress intensity factors for V-notched cracks in dissimilar materials are treated and discussed. The Newton-Raphson method which is an efficient numerical method for solving a non-linear equation is used for solving stress sigularities. And stress intensity factors are solved by the collocation method using the Newton-Raphson and least squares method. The effects of stress intensity factors and stress singularities on stress fields of V-notched cracks in dissimilar materials are studied by using photoelasic isochromatic frings patterns obtained from computer graphics.s.

• Journal of the Korean Society for Precision Engineering
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• v.29 no.5
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• pp.563-571
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• 2012

In 3D integration package using TSV technology, bonding is the core technology for stacking and interconnecting the chips or wafers. During bonding process, however, warpage and high stress are introduced, and will lead to the misalignment problem between two chips being bonded and failure of the chips. In this paper, a finite element approach is used to predict the warpages and stresses during the bonding process. In particular, in-plane deformation which directly affects the bonding misalignment is closely analyzed. Three types of bonding technology, which are Sn-Ag solder bonding, Cu-Cu direct bonding and SiO2 direct bonding, are compared. Numerical analysis indicates that warpage and stress are accumulated and become larger for each bonding step. In-plane deformation is much larger than out-of-plane deformation during bonding process. Cu-Cu bonding shows the largest warpage, while SiO2 direct bonding shows the smallest warpage. For stress, Sn-Ag solder bonding shows the largest stress, while Cu-Cu bonding shows the smallest. The stress is mainly concentrated at the interface between the via hole and silicon chip or via hole and bonding area. Misalignment induced during Cu-Cu and Sn-Ag solder bonding is equal to or larger than the size of via diameter, therefore should be reduced by lowering bonding temperature and proper selection of package materials.