Journal of Welding and Joining

  • 제25권2호
  • /
  • Pages.82-88
  • /
  • 2007
  • /
  • 2466-2232(pISSN)
  • /
  • 2466-2100(eISSN)
대한용접접합학회 (The Korean Welding and Joining Society)
권호 표지
DOI QR코드

DOI QR Code

Sn-40Pb/Cu 및 Sn-3.0Ag-0.5Cu/Cu 솔더 접합계면의 금속간화합물 형성에 필요한 활성화에너지

Activation Energy for Intermetallic Compound Formation of Sn-40Pb/Cu and Sn-3.0Ag-0.5Cu/Cu Solder Joints

  • 홍원식 (전자부품연구원 신뢰성평가센터) ;
  • 김휘성 (한국항공대학교 항공재료공학과) ;
  • 박노창 (전자부품연구원 신뢰성평가센터) ;
  • 김광배 (한국항공대학교 항공재료공학과)
  • Hong, Won-Sik (Reliability and Failure Analysis Center, Korea Electronics Technology Institute) ;
  • Kim, Whee-Sung (Department of Materials Engineering, Hankuk Aviation University) ;
  • Park, Noh-Chang (Reliability and Failure Analysis Center, Korea Electronics Technology Institute) ;
  • Kim, Kwang-Bae (Department of Materials Engineering, Hankuk Aviation University)
  • 발행 : 2007.04.30
PDF 다운로드
⟨ 이전 논문 다음 논문 ⟩

초록

Sn-3.0Ag-0.5Cu lead fee solder was generally utilized in electronics assemblies. But it is insufficient to research about activation energy(Q) that is applying to evaluate the solder joint reliability of environmental friendly electronics assemblies. Therefore this study investigated Q values which are needed to IMC formation and growth of Sn-3.0Ag-0.5Cu/Cu and Sn-40pb/Cu solder joints during aging treatment. We bonded Sn-3.0Ag-0.5Cu and Sn-40Pb solders on FR-4 PCB with Cu pad$(t=80{\mu}m)$. After reflow soldering, to observe the IMC formation and growth of the solder joints, test specimens were aged at 70, 150 and $170^{\circ}C$ for 1, 2, 5, 20, 60, 240, 960, 15840, 28800 and 43200 min, respectively. SEM and EDS were utilized to analysis the IMCS. From these results, we measured the total IMC$(Cu_6Sn_5+Cu_3Sn)$ thickness of Sn-3.0Ag-0.5Cu/Cu and Sn-40Pb/Cu interface, and then obtained Q values for the IMC$(Cu_6Sn_5,\;Cu_3Sn)$ growth of the solder joints.

키워드

참고문헌

  1. Directive 2002/95/EC of the European Parliament and of the Council, Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment, EU (2003)
  2. I. Y. Lee, C. B. Lee, S. B. Jung, C. C. Shur : Growth kinetics of intermetallic compound on Sn-3.5Ag/Cu, Ni pad solder joint with isothermal aging, Journal of KWS, 20-1 (2002), 97 (in Korean)
  3. Anon : Copper-Tin Intermetallics, Circuit Manufacturing, 20-9 (1980), 56-64
  4. B. G. Le, and R. A. Baraczykowshi : Intermetallic Compound Growth on Tin and Solder Plating on Cu Alloys, Wire J. Int., 18-1 (1985), 66-71
  5. R. Strauss : SMT Soldering Handbook(2nd Edition), Newnes, Oxford, 1998, 37-39
  6. H. A. H. Steen : Aging of Component Leads and Printed Circuit Boards, Research Report IM-1716, Swedish International for Metals Research (1982)
  7. A. Gangulee, G. C. Das, and M. B. Bever : An X-Ray Diffraction and Calorimetric Investigation of the Compound $Cu_6Sn_5$, Metal Transaction, 4 (1973), 2063-2066 https://doi.org/10.1007/BF02643268
  8. W. S. Hong, and K. B. Kim : Tafel Characteristics by Electrochemical Reaction of SnAgCu Pb-Free Solder, Korea Journal of Materials Research, 15-8 (2005), 536-542 (in Korean)
  9. H. L. J. Pang, K. H. Tan, X. Q. Shi, and Z. P. Wang : Microstructure and Intermetallic Growth Effects on Shear and Fatigue Strength of Solder Joints Subjected to Thermal Cycling Aging, Materials Science and Engineering, A307 (2001), 42-50
  10. D. R. Frear, S. N. Burchett, H. S. Morgan, and J. H. Lau : The Mechanics of Solder Alloy Interconnects, Chapman & Hall, International Thomson Publication, New York (1994)
  11. JEITA : Lead Free Soldering Technologies-From Basic Matters to Measures for Solder Joint Lift-Off, Corona Publishing Co., Tokyo, 2004, 26-29

피인용 문헌

  1. The Effect of Eutectic Structure on the Creep Properties of Sn-3.0Ag-0.5Cu and Sn-8.0Sb-3.0Ag Solders vol.7, pp.12, 2017, https://doi.org/10.3390/met7120540