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http://dx.doi.org/10.5781/KWJS.2007.25.2.082

Activation Energy for Intermetallic Compound Formation of Sn-40Pb/Cu and Sn-3.0Ag-0.5Cu/Cu Solder Joints  

Hong, Won-Sik (Reliability and Failure Analysis Center, Korea Electronics Technology Institute)
Kim, Whee-Sung (Department of Materials Engineering, Hankuk Aviation University)
Park, Noh-Chang (Reliability and Failure Analysis Center, Korea Electronics Technology Institute)
Kim, Kwang-Bae (Department of Materials Engineering, Hankuk Aviation University)
Publication Information
Journal of Welding and Joining / v.25, no.2, 2007 , pp. 82-88 More about this Journal
Abstract
Sn-3.0Ag-0.5Cu lead fee solder was generally utilized in electronics assemblies. But it is insufficient to research about activation energy(Q) that is applying to evaluate the solder joint reliability of environmental friendly electronics assemblies. Therefore this study investigated Q values which are needed to IMC formation and growth of Sn-3.0Ag-0.5Cu/Cu and Sn-40pb/Cu solder joints during aging treatment. We bonded Sn-3.0Ag-0.5Cu and Sn-40Pb solders on FR-4 PCB with Cu pad$(t=80{\mu}m)$. After reflow soldering, to observe the IMC formation and growth of the solder joints, test specimens were aged at 70, 150 and $170^{\circ}C$ for 1, 2, 5, 20, 60, 240, 960, 15840, 28800 and 43200 min, respectively. SEM and EDS were utilized to analysis the IMCS. From these results, we measured the total IMC$(Cu_6Sn_5+Cu_3Sn)$ thickness of Sn-3.0Ag-0.5Cu/Cu and Sn-40Pb/Cu interface, and then obtained Q values for the IMC$(Cu_6Sn_5,\;Cu_3Sn)$ growth of the solder joints.
Keywords
Activation energy; SnAgCu; Intermetallic compound; Solder joints;
Citations & Related Records
Times Cited By KSCI : 1  (Citation Analysis)
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