1 |
A. Gangulee, G. C. Das, and M. B. Bever : An X-Ray Diffraction and Calorimetric Investigation of the Compound , Metal Transaction, 4 (1973), 2063-2066
DOI
|
2 |
JEITA : Lead Free Soldering Technologies-From Basic Matters to Measures for Solder Joint Lift-Off, Corona Publishing Co., Tokyo, 2004, 26-29
|
3 |
H. A. H. Steen : Aging of Component Leads and Printed Circuit Boards, Research Report IM-1716, Swedish International for Metals Research (1982)
|
4 |
H. L. J. Pang, K. H. Tan, X. Q. Shi, and Z. P. Wang : Microstructure and Intermetallic Growth Effects on Shear and Fatigue Strength of Solder Joints Subjected to Thermal Cycling Aging, Materials Science and Engineering, A307 (2001), 42-50
|
5 |
Directive 2002/95/EC of the European Parliament and of the Council, Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment, EU (2003)
|
6 |
Anon : Copper-Tin Intermetallics, Circuit Manufacturing, 20-9 (1980), 56-64
|
7 |
R. Strauss : SMT Soldering Handbook(2nd Edition), Newnes, Oxford, 1998, 37-39
|
8 |
D. R. Frear, S. N. Burchett, H. S. Morgan, and J. H. Lau : The Mechanics of Solder Alloy Interconnects, Chapman & Hall, International Thomson Publication, New York (1994)
|
9 |
W. S. Hong, and K. B. Kim : Tafel Characteristics by Electrochemical Reaction of SnAgCu Pb-Free Solder, Korea Journal of Materials Research, 15-8 (2005), 536-542 (in Korean)
|
10 |
I. Y. Lee, C. B. Lee, S. B. Jung, C. C. Shur : Growth kinetics of intermetallic compound on Sn-3.5Ag/Cu, Ni pad solder joint with isothermal aging, Journal of KWS, 20-1 (2002), 97 (in Korean)
|
11 |
B. G. Le, and R. A. Baraczykowshi : Intermetallic Compound Growth on Tin and Solder Plating on Cu Alloys, Wire J. Int., 18-1 (1985), 66-71
|