• Title/Summary/Keyword: Bond wire

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Development of a Powder-type Thin Spray-on Liner and Its Performance Evaluation at Different Curing Ages (분말형 박층 뿜칠 라이너 시작품의 제작과 성능평가)

  • Chang, Soo-Ho;Lee, Gyu-Phil;Han, Jin-Tae;Choi, Soon-Wook;Hwang, Gwi-Sung;Choi, Myung-Sik
    • Tunnel and Underground Space
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    • v.25 no.3
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    • pp.293-302
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    • 2015
  • Thin Spray-on Liner (TSL) has been considered as a new rock support to replace shotcrete as well as wire mesh. However, the development of its original production technology is highly in demand since it is not open to the public. Therefore, two kinds of powder-type TSL prototypes were developed as the first development stage. Then, their mechanical properties were experimentally compared with those of a two-component foreign TSL material including both of liquid and powder components. From a series of experiments, the first TSL prototype mixing condition satisfied every TSL performance requirements specified by EFNRAC (2008), and showed much higher tensile and bond strengths than those of the two-component foreign TSL, even though the other TSL prototype cannot be used as a support member since its elongation at break is much lower than its corresponding EFNARC (2008) performance criterion. In addition, a further study to increase the ductility of the first TSL prototype might be necessary to guarantee its higher applicability to field conditions.

An L-band Stacked SOI CMOS Amplifier

  • Kim, Young-Gi;Hwang, Jae-Yeon
    • Journal of IKEEE
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    • v.20 no.3
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    • pp.279-284
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    • 2016
  • This paper presents a two stage L-band power amplifier realized with a $0.32{\mu}m$ Silicon-On-Insulator (SOI) CMOS technology. To overcome a low breakdown voltage limit of MOSFET, stacked-FET structures are employed, where three transistors in the first stage amplifier and four transistors in the second stage amplifier are connected in series so that their output voltage swings are added in phase. The stacked-FET structures enable the proposed amplifier to achieve a 21.5 dB small-signal gain and 15.7 dBm output 1-dB compression power at 1.9 GHz with a 122 mA DC current from a 4 V supply. The amplifier delivers a 19.7 dBm. This paper presents a two stage L-band power amplifier realized with a $0.32{\mu}m$ Silicon-On-Insulator (SOI) CMOS technology. To overcome a low breakdown voltage limit of MOSFET, stacked-FET structures are employed, where three transistors in the first stage amplifier and four transistors in the second stage amplifier are connected in series so that their output voltage swings are added in phase. The stacked-FET structures enable the proposed amplifier to achieve a 21.5 dB small-signal gain and 15.7 dBm output 1-dB compression power at 1.9 GHz with a 122 mA DC current from a 4 V supply. The amplifier delivers a 19.7 dBm saturated output power with a 16 % maximum Power Added Efficiency (PAE). A bond wire fine tuning technology enables the amplifier a 23.67 dBm saturated output power with a 20.4 % maximum PAE. The die area is $1.9mm{\times}0.6mm$.

THE EFFECT OF ADDITIONAL ENAMEL ETCHING ON MICROLEAKAGE OF THE ADHESION OF SELF-ETCHING PRIMER SYSTEM (자가 산부식 프라이머 시스템 사용시 인산에 의한 부가적인 산부식이 미세누출에 미치는 영향)

  • Yoon, Jung-Jin;Min, Kyung-San;Hong, Chan-Ui
    • Restorative Dentistry and Endodontics
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    • v.28 no.5
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    • pp.363-368
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    • 2003
  • The purpose of this study is to evaluate the effect of additional enamel etching with phosphoric acid on the microleakage of the adhesion of self-etching primer system. Class V cavity($4mm{\times}3mm{\times}1.5mm$) preparations with all margins in enamel were prepared on buccal surface of 42 extracted human upper central incisor teeth. Prepared teeth were randomly divided into 3 groups. Group 1:no additional pretreatment with 37% phosphoric acid (NE). Group 2:additional pretreatment with 37% phosphoric acid for 10 seconds (E10s). Group 3:additional pretreatment with 37% phosphoric acid for 20 seconds (E20s). The adhesives(Clearfil SE $Bond^{\circledR}$, Kuraray, Osaka, Japan) and composite resins(Clearfil $AP-X^{\circledR}$, Osaka, Kuraray, Japan) were applied following the manufacturer's instructions. All the specimens were finished with the polishing disc(3M dental product, St Paul, MN, USA), thermocycled for 500 cycles between $5^{\circ}C$ and $55^{\circ}C$ and resected apical 3-mm root. 0.028 stainless steel wire was inserted apically into the pulp chamber of each tooth and sealed into position with sticky wax. Surrounding tooth surface was covered with a nail varnish 2 times except areas 1mm far from all the margins. After drying for one day, soaked the samples in the distilled water. Microleakage was assessed by electrochemical method(System 6514, $Electrometer^{\circledR}$), Keithley, USA) in the distilled water. In this study, the microleakage was the lowest in group 1 (NE) and the highest in group 3(E20s)(NE

Thermo-mechanical Behavior of WB-PBGA Packages with Pb-Sn Solder and Lead-free Solder Using Moire Interferometry (무아레 간섭계를 이용한 유연 솔더와 무연 솔더 실장 WB-PBGA 패키지의 열-기계적 변형 거동)

  • Lee, Bong-Hee;Kim, Man-Ki;Joo, Jin-Won
    • Journal of the Microelectronics and Packaging Society
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    • v.17 no.3
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    • pp.17-26
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    • 2010
  • Pb-Sn solder is rapidly being replaced by lead-free solder for board-level interconnection in microelectronic package assemblies due to the environmental protection requirement. There is a general lack of mechanical reliability information available on the lead-free solder. In this study, thermo-mechanical behaviors of wire-bond plastic ball grid array (WB-PBGA) package assemblies are characterized by high-sensitivity moire interferometry. Experiments are conducted for two types of WB-PBGA packages that have Pb-Sn solder and lead-free solder as joint interconnections. Using real-time moire setup, fringe patterns are recorded and analyzed for several temperatures. Bending deformations of the assemblies and average strains of the solder balls are investigated and compared for the two type of WB-PBGA package assemblies. Results show that shear strain in #3 solder ball located near the chip shadow boundary is dominant for the failure of the package with Pb-Sn solder, while normal strain in #7 most outer solder ball is dominant for that with lead-free solder. It is also shown that the package with lead-free solder has much larger bending deformation and 10% larger maximum effective strain than the package with Pb-Sn solder at same temperature level.

Histologic changes of tooth and periodontal tissues applying to contraction & intrusion force for the maxillary four incisors of dogs (성견 상악 4절치의 Contraction과 압하시 치아 및 주위 조직의 조직학적 변화에 관한 실험 연구)

  • Kim, Young-Kuk;Cha, Kyung-Suk;Lee, Jin-Woo
    • The korean journal of orthodontics
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    • v.29 no.5 s.76
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    • pp.535-549
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    • 1999
  • The Purposes of this study were to investigate the initial tissue changes on the teeth and surrounding tissues under contraction and intrusive force by contraction UTA. A control and experimental dogs, 10-months in age, were studied. Contraction and intrusive force(60gm) were applied at upper four incisors by contraction UTA. Experimental dogs were sacrificed at 2 weeks and 4 weeks after force application, respectively. In this study, 2 experimental groups were designed by the duration of force applied(E1, E2). The specimens were taken around the upper first and second incisor in each groups and were prepared for the H-E and MT stain for light microscopic observation. From the results of the study, the following conclusions may be drown. : 1. In control group, the periodontal ligament width was constant from apical third to cervical third of the root and periodontal fiber arrangement was horizontal or oblique in cervical third, oblique in middle third and apical third. In alveolar bond, smooth appearance was shown with osteoblast. 2. In experimental group 1, in proportion to force was concentrated at labial middle third and apical third of root of the upper first and second incisors, root of these tooth tipped labially and intruded at a time. 3. In experimental group 2, periodontal ligament width and arrangement was similar to control and observed strong calcified response at the labial middle third of root. But, alveolar bond resorption and cementum resorption were as before seen at labial middle third and apical third of root that force was concentrated.

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