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J. W. Joo and D. H. Kim, "Thermo-mechanical Deformation Analysis of Flip Chip PBGA Packages subjected to Temperature Change", J. Microelectron. Packag. Soc., 13(4), 17 (2006).
과학기술학회마을
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MatWeb Material Property Data from http://www.Matweb.com (2010).
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J. Joo and B. Han, "Non-linear Temperature Dependent Deformation Anaysis of CBGA Package Assembly Using Moire Interferometry", J. Microelectron. Packag. Soc., 10(4), 17 (2003).
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I. Kim, T. Park and S.-B. Lee, "Comparative study of the Fatigue Behavior of SnAgCu and SnPb Solder Joits", Trans. of the KSME(A), 28(12), 1856 (2004).
과학기술학회마을
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J. W. Joo and N. J. Choi, "The Effect of Finite Element Models in Thermal Analysis of Electronic Packages", Trans. of the KSME(A), 33(4), 380 (2009).
과학기술학회마을
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B. Han, "Recent Advancements of Moire and Microscopic MoireInterferometry for Thermal Deformation Analysis of Microelectronics Devices", Experimental Mechanics, 38(4), 278 (1998).
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Y. Morita, K. Arakawa and M. Todo, "High-Sensitivity Measurement of Thermal Deformation in Stacked Multichip Package", IEEE Trans. Comp. Packag. Manufact. Technol., 30(1), 137 (2007).
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S. M. Cho. S. Y. Cho and B. Han, "Observing Real-Time Thermal Deformations in Electronic Packaging", Experimental Techniques, Vol. 26(3), 25 (2002).
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I. N. Jang, J. H. Park and Y. S. Ahn, "Mechanical Characteristic Evaluation of Sn-Ag-Cu Lead Free Solder Ball Joint on the Pad Geometry", J. Microelectron. Packag. Soc., 17(2), 41 (2010).
과학기술학회마을
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S. J. Ham and S. B. Lee, "Measurement of Creep and Relaxation Behaviors of Wafer-level CSP Assembly Using Moire Interferometry", J. Electronic Packaging, Trans. of the ASME, 125 (June), 282 (2003).
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C. T. Peng, K. N. Chiang, T. Ku and K. Chang, "Design, Fabrication and Comparison of Lead-free/Eutectic Solder Joint Reliability of Flip Chip Package", Proc. 5th Int. Conf. on Thermal and Mechanical Simulation and Experimental in Micro-electronics and Micro-System, EuroSimE2004, 149 (2004).
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