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Thermo-mechanical Behavior of WB-PBGA Packages with Pb-Sn Solder and Lead-free Solder Using Moire Interferometry  

Lee, Bong-Hee (Department of Mechanical Engineering, Chungbuk National University)
Kim, Man-Ki (Department of Mechanical Engineering, Chungbuk National University)
Joo, Jin-Won (Department of Mechanical Engineering, Chungbuk National University)
Publication Information
Journal of the Microelectronics and Packaging Society / v.17, no.3, 2010 , pp. 17-26 More about this Journal
Abstract
Pb-Sn solder is rapidly being replaced by lead-free solder for board-level interconnection in microelectronic package assemblies due to the environmental protection requirement. There is a general lack of mechanical reliability information available on the lead-free solder. In this study, thermo-mechanical behaviors of wire-bond plastic ball grid array (WB-PBGA) package assemblies are characterized by high-sensitivity moire interferometry. Experiments are conducted for two types of WB-PBGA packages that have Pb-Sn solder and lead-free solder as joint interconnections. Using real-time moire setup, fringe patterns are recorded and analyzed for several temperatures. Bending deformations of the assemblies and average strains of the solder balls are investigated and compared for the two type of WB-PBGA package assemblies. Results show that shear strain in #3 solder ball located near the chip shadow boundary is dominant for the failure of the package with Pb-Sn solder, while normal strain in #7 most outer solder ball is dominant for that with lead-free solder. It is also shown that the package with lead-free solder has much larger bending deformation and 10% larger maximum effective strain than the package with Pb-Sn solder at same temperature level.
Keywords
Lead-free solder; WB-PBGA package; Thermal deformation analysis; Moire Interferometry; Thermomechanical behavior;
Citations & Related Records
Times Cited By KSCI : 4  (Citation Analysis)
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