• 반도체디스플레이기술학회지
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• 제1권1호
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• pp.21-28
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• 2002

This paper presents a dynamic modeling and a robust PID controller design process for the wire bonder head assembly. For modeling elements, the system is divided into electrical part, magnetic part, and mechanical part. Each part is modeled using the bond graph method. The PID controller is used for high speed/high accuracy position control of the wire bonder assembly. The Taguchi method is used to obtain the more robust PID gain combinations than conventional one. This study makes use of an L18 array with three parameters varied on three levels. Results of simulations and experimental show that the designed PID controller provides a improved ratio of signal to noise and a reduced sensitivity improved to the conventional PID controller.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2001년도 춘계학술대회논문집B
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• pp.747-753
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• 2001

This paper presents a dynamic modeling and a robust PID controller design process for the wire bonder head assembly. For the modeling elements, the system is divided into electrical system, magnetic system, and mechanical system. Each system is modeled by using the bond graph method. The PID controller is used for high speed/high accuracy position control of the wire bonder assembly. The Taguchi method is used to evaluate the more robust PID gain combinations. This study makes use of an L18 array with three parameters varied on three levels. Computer simulations and experimental results show that the designed PID controller provides more improved signal to noise ratio and reduced sensitivity than the conventional PID controller.

• 한국터널지하공간학회 논문집
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• 제19권3호
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• pp.533-549
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• 2017

본 연구에서는 지하 콘크리트 구조물 내로 누수된 지하수를 유도하여 배수하는 유도배수공법을 제시하였다. 유도배수공법은 유도배수판, 철망, 고정핀, 광물질 혼입 모르타르로 구성된다. 시공성 향상을 위하여 유도배수판 및 철망은 공압타카와 고정핀를 사용하여 콘크리트 표면에 부착하였다. 고로슬래그미분말을 30% 혼입한 모르타르는 뿜어 붙임 모르타르 장비를 사용하여 유도배수판 및 철망 표면에 타설하였다. 유도배수공법의 현장 시공성 및 성능 검증을 위하여 재래식 콘크리트라이닝 터널과 콘크리트 옹벽에서 시험시공을 수행하였다. 시험시공 완료 3년 후 유도배수공법은 성능저하의 문제점이 없는 것으로 판단되었다. 재령 14일과 3년에 뿜어 붙임 모르타르의 부착력 실험을 수행하였다. 유도배수판 표면에 철망을 적용한 경우 뿜어 붙인 모르타르의 부착력은 재령 14일에 1.04 MPa, 재령 3년에 1.46 MPa로 측정되었다. 철망을 적용하지 않은 경우의 부착력은 재령 14일에 1.13 MPa로 측정되었지만, 재령 3년에는 0.89 MPa로 기준 부착력 1 MPa보다 낮게 측정되었다.

• Advances in concrete construction
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• 제7권3호
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• pp.191-201
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• 2019

Bamboo concrete bond behaviour is investigated through pullout test in this work. The bamboo strip to be used as reinforcement inside concrete is first treated with chemical adhesive to make the bamboo surface impermeable. Various surface coatings are explored to understand their water repellant properties. The chemical action at the bamboo concrete interface is studied through different chemical coatings, sand blasting, and steel wire wrapping treatment. Whereas mechanical action at the bamboo concrete interface is studied by developing mechanical interlock. The result of pullout tests revealed a unique combination of surface treatment and grooved bamboo profile. This combination of surface treatment and a grooved bamboo profile together enhances the strength of bond. Performance of a newly developed grooved bamboo strip is verified against equivalent plain rectangular bamboo strip. The test results show that the proposed grooved bamboo reinforcement, when treated, shows highest bond strength compared to treated plain, untreated plain and untreated grooved bamboo reinforcement. Also, it is observed that bond strength is majorly influenced by the type of surface treatment, size and spacing of groove. The changes in bamboo-concrete bond behavior are observed during the experimentation.

• 한국전자파학회논문지
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• 제29권6호
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• pp.401-406
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• 2018

본 논문에서는 E-대역에서 본드와이어의 기생성분을 예측하고, 그에 따른 전송손실을 줄이기 위한 정합회로를 설계하였다. 본드와이어의 임피던스는 3D EM 시뮬레이션을 통해 예측하였고, 정합회로는 간단한 구조로 구성하여 공간 활용 및 시스템 적용에 용이하도록 하였다. 설계된 정합회로는 WR-12 규격의 도파관 기구와 71~86 GHz의 사용주파수를 갖는 상용 LNA 소자에 적용하였다. 정합회로는 시스템의 전달계수를 최대 4.5 dB, 전력 이득은 최대 3.12 dB, $P_{1dB}$를 최대 2.2 dB 증가시켰으며 이득 평탄도를 ${\pm}1.07dB$ 개선시켰다.

• 한국지반공학회:학술대회논문집
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• 한국지반공학회 1996년도 가을 학술발표회 논문집
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• pp.81-90
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• 1996

• 마이크로전자및패키징학회지
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• 제24권1호
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• pp.103-111
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• 2017

본 연구에서는 전동차의 전력 변환 장치로 많이 사용되고 있는 고전압 대전류용(3,300 V/1200 A급) insulated gate bipolar transistor(IGBT) 모듈에 대하여 열 사이클 조건하에서의 열-기계적 응력해석 및 피로수명해석을 수행하였다. 특히 최근 고전압 IGBT용으로 개발되고 있는 구리(copper) 와이어, 리본(ribbon) 와이어를 사용하였을 경우의 응력 및 피로수명을 기존의 알루미늄 와이어와 비교하여 분석하였다. 알루미늄 와이어 보다는 구리 와이어에 응력이 3배 이상 많이 발생하였다. 리본 와이어의 경우 원형 와이어 보다 응력이 더 크게 발생하며, 구리 리본 와이어의 응력이 제일 높았다. 칩과 direct bond copper(DBC)를 접합하고 있는 칩 솔더부의 피로해석을 수행한 결과, 솔더의 크랙은 주로 솔더의 모서리에서 발생하였다. 원형 와이어를 사용할 경우 솔더의 크랙은 약 35,000 사이클에서 발생하기 시작하였으며, 알루미늄 와이어 보다는 구리 와이어에서의 크랙의 발생 면적이 더 컸다. 반면 리본 와이어를 사용하였을 경우 크랙의 면적은 원형 와이어를 사용하였을 경우보다 적음을 알 수 있다. DBC와 베이스 플레이트 사이에 존재하는 솔더의 경우 크랙의 성장 속도는 와이어의 재질이나 형태에 관계없이 비슷하였다. 그러나 칩 솔더에 비하여 크랙의 발생이 일찍 시작하며, 40,000 사이클이 되면 전체 솔더의 반 이상이 파괴됨을 알 수 있었다. 따라서 칩 솔더 보다는 DBC와 베이스 플레이트 사이에 존재하는 솔더의 신뢰성이 더 큰 문제가 될 것으로 판단된다.

• Transactions on Electrical and Electronic Materials
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• 제15권4호
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• pp.221-225
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• 2014

Although gold wire bonding techniques have already matured in semiconductor manufacturing, weakly bonded wires in semiconductor chip assembly can jeopardize the reliability of the final product. In this paper, weakly bonded or failed aluminum bonding pads are analyzed using X-ray photoelectron spectroscopy (XPS), Auger electron Spectroscopy (AES), and energy dispersive X-ray analysis (EDX) to investigate potential contaminants on the bond pad. We found the source of contaminants is related to the dry etching process in the previous manufacturing step, and fluorocarbon plasma etching of a passivation layer showed meaningful evidence of the formation of fluorinated by-products of $AlF_x$ on the bond pads. Surface analysis of the contaminated aluminum layer revealed the presence of fluorinated compounds $AlOF_x$, $Al(OF)_x$, $Al(OH)_x$, and $CF_x$.

• 대한금속재료학회지
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• 제50권12호
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• pp.913-920
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• 2012

In spite of some problems in processability and bondability, Au wires in the microelectronics industry are gradually being replaced by copper wires to reduce the cost of raw material. In this article, the effects of surface roughness enhanced capillaries on thermosonic Cu wire bonding were evaluated. The roughness-enhanced zirconia toughened alumina (ZTA) capillaries were fabricated via a thermal grooving technique. As a result, the shear bond strength of first bonds (ball bonds) bonded using the roughness-enhanced capillary was enhanced by 15% as compared with that of normal bonds due to more effective plastic deformation and flow of a Cu ball. In the pull-out test of second bonds (stitch bonds), processed at two limit conditions on combinations of process parameters, the bond strength of bonds formed using the roughness-enhanced capillary also resulted in values higher by 55.5% than that of normal bonds because of the increase in the bonding area, indicating the expansion of a processing window for Cu wire bonding. These results suggest that the adoption of roughness-enhanced capillaries is a promising approach for enhancing processability and bondability in Cu wire bonding.

• Steel and Composite Structures
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• 제32권5호
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• pp.559-569
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• 2019

The bond strength between composite laminates and concrete is a key factor that controls the behavior of concrete members strengthened with fiber reinforced polymer (FRP) sheets, which can be affected by several parameters such as thermal stresses and surface preparation. This article presents the result of an experimental study on the bond strength between FRP sheets and concrete at ambient temperature after specimens had been exposed to elevated temperatures of up to $200^{\circ}C$. For this purpose, 30 specimens of plain concrete with dimensions of $150{\times}150{\times}350mm$ were prepared. Three different conventional surface preparation methods (sandblasting, wire brushing and hole drilling) were considered and compared with a new efficient method (fiber implantation). Deformation field during each experiment was monitored using particle image velocimetry. The results showed that, the specimens which were prepared by conventional surface preparation methods, preserved their bond integrity when exposed to temperature below glass transition temperature of epoxy resin (about $60^{\circ}C$). Beyond this temperature, the bond strength and stiffness decreased significantly (about 50%) in comparison with control specimens. However, the specimens prepared by the proposed method displayed higher bond strengths of up to 32% and 90% at $25^{\circ}C$ and $200^{\circ}C$, respectively.