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http://dx.doi.org/10.5515/KJKIEES.2018.29.6.401

E-Band Bond-Wire Modeling and Matching Network Design  

Kim, Kimok (School of Information and Communication Engineering, Sungkyunkwan University)
Kang, Hyunuk (School of Information and Communication Engineering, Sungkyunkwan University)
Lee, Wooseok (School of Information and Communication Engineering, Sungkyunkwan University)
Choi, Doohun (iU Plus Co., Ltd.)
Yang, Youngoo (School of Information and Communication Engineering, Sungkyunkwan University)
Publication Information
The Journal of Korean Institute of Electromagnetic Engineering and Science / v.29, no.6, 2018 , pp. 401-406 More about this Journal
Abstract
In this paper, we present E-band bond-wire modeling and a matching network to compensate for the effect of the bond-wire. The impedance of the bond-wires is extracted using three-dimensional electromagnetic simulation. The matching network was designed using a simple structure. The implemented matching network was verified with a commercial 71~81 GHz LNA IC and an interconnection based on the WR-12 waveguide. The matching network increases the transmission coefficient of the system by up to 4.5 dB, power gain by up to 3.12 dB, $P_{1dB}$ by up to 2.2 dB, and improves the gain flatness by ${\pm}1.07dB$.
Keywords
E-Band; Bondwire; Matching Network; Millimeter Wave System;
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