Enhancement of Cu Wire Bondability by Increasing the Surface Roughness of Capillary
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Lee, Jong-Hyun
(Department of Materials Science & Engineering, Seoul National University of Science & Technology)
Kim, Ju-Hyung (Department of Materials Science & Engineering, Seoul National University of Science & Technology) Kang, Hong-Jeon (Department of Materials Science & Engineering, Seoul National University of Science & Technology) Kim, Hak-Bum (Material Department, PECO) Moon, Jung-Tak (MK Electron Co. Ltd) Riu, Doh-Hyung (Department of Materials Science & Engineering, Seoul National University of Science & Technology) |
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