The Journal of Korean Institute of Electromagnetic Engineering and Science (한국전자파학회논문지)

The Korean Institute of Electromagnetic Engineering and Science (한국전자파학회)
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E-Band Bond-Wire Modeling and Matching Network Design

E-대역 본드와이어 모델링 및 정합회로 설계

  • Kim, Kimok (School of Information and Communication Engineering, Sungkyunkwan University) ;
  • Kang, Hyunuk (School of Information and Communication Engineering, Sungkyunkwan University) ;
  • Lee, Wooseok (School of Information and Communication Engineering, Sungkyunkwan University) ;
  • Choi, Doohun (iU Plus Co., Ltd.) ;
  • Yang, Youngoo (School of Information and Communication Engineering, Sungkyunkwan University)
  • 김기목 (성균관대학교 정보통신대학) ;
  • 강현욱 (성균관대학교 정보통신대학) ;
  • 이우석 (성균관대학교 정보통신대학) ;
  • 최두헌 ((주)아이유플러스) ;
  • 양영구 (성균관대학교 정보통신대학)
  • Received : 2017.11.30
  • Accepted : 2018.05.23
  • Published : 2018.06.30
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Abstract

In this paper, we present E-band bond-wire modeling and a matching network to compensate for the effect of the bond-wire. The impedance of the bond-wires is extracted using three-dimensional electromagnetic simulation. The matching network was designed using a simple structure. The implemented matching network was verified with a commercial 71~81 GHz LNA IC and an interconnection based on the WR-12 waveguide. The matching network increases the transmission coefficient of the system by up to 4.5 dB, power gain by up to 3.12 dB, $P_{1dB}$ by up to 2.2 dB, and improves the gain flatness by ${\pm}1.07dB$.

본 논문에서는 E-대역에서 본드와이어의 기생성분을 예측하고, 그에 따른 전송손실을 줄이기 위한 정합회로를 설계하였다. 본드와이어의 임피던스는 3D EM 시뮬레이션을 통해 예측하였고, 정합회로는 간단한 구조로 구성하여 공간 활용 및 시스템 적용에 용이하도록 하였다. 설계된 정합회로는 WR-12 규격의 도파관 기구와 71~86 GHz의 사용주파수를 갖는 상용 LNA 소자에 적용하였다. 정합회로는 시스템의 전달계수를 최대 4.5 dB, 전력 이득은 최대 3.12 dB, $P_{1dB}$를 최대 2.2 dB 증가시켰으며 이득 평탄도를 ${\pm}1.07dB$ 개선시켰다.

Keywords

References

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