• 한국세라믹학회지
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• 제52권2호
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• pp.165-170
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• 2015

We employed the high-pressure high temperature (HPHT) process to enhance the colors of natural sapphires to obtain a vivid blue. First, we analyze the content of the coloring agent $Fe_2O_3$ using the wavelength dispersive X-ray fluorescence (WD-XRF) method. The HPHT procedure operates under 1 GPa at various temperatures of 1700, 1750, and $1800^{\circ}C$ for 5 minutes using a cubic press. We determine the color changes using the optical microscopic images, UV-VIS near-infrared (NIR) spectra, micro-Raman spectra, and Fourier transform-infrared (FT-IR) spectra for all sapphire samples before and after the treatment. The optical microscopic results indicate that the HPHT process can enhance the sapphire color to a vivid blue at temperatures above $1750^{\circ}C$. The UV-VIS-NIR spectra identify the color changes explicitly and quantitatively through providing the Lab color scales and color differences. Both results demonstrate that the colors of natural sapphires can be enhanced to a vivid blue using the HPHT process above $1750^{\circ}C$ under 1 GPa for 5 minutes.

• 한국전기전자재료학회논문지
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• 제24권1호
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• pp.7-11
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• 2011

Sapphire substrate was patterned by a selective chemical wet etching technique, and GaN/InGaN structures were grown on this substrate by MOVPE (Metal Organic Vapor Phase Epitaxy). The surface of grown GaN on patterned sapphire substrate (PSS) has good morphology and uniformity. The patterned sapphire substrate LED showed better light output than conventional LED that improvement 50%. We think these results come from enhancement of internal quantum efficiency by decrease of threading dislocation and increase of light extraction efficiency. Also these LED showed more uniform emission distribution in angle than conventional LED.

• 대한기계학회논문집A
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• 제29권4호
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• pp.632-638
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• 2005

The surface lapping process on sapphire wafer was carried out for the epitaxial process of thin film growth of GaN semiconducting material. The planarization of the wafers was investigated by the introduction of the dummy wafers. The diamond lapping process causes the surface deformation of dislocation and micro-cracks. The material deformation due to the mechanical stress was analyzed by the X-ray diffraction and the Vickers indentation. The fracture toughness was increased with the increased annealing temperature indicating the recrystallization at the surface of the sapphire wafer The sudden increase at the temperature of $1200^{\circ}C$ was correlated with the surface phase transition of sapphire from a $-A1_{2}O_{3}\;to\;{\beta}-A1_{2}O_{3}$.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2003년도 추계학술대회
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• pp.1816-1821
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• 2003

The sapphire wafer for blue light emitting device was manufactured by the implementation of the chemical and mechanical polishing process. The surface polishing of crystalline sapphire wafer was characterized by zeta potential measurement. The reduction process with the alkali slurry provides the surface chemical reaction with sapphire atoms. The poly-urethane pad also provides the frictional force to take out the chemically-reacted surface layers. The surface roughness was measured by the atomic force microscope and the crystalline quality was characterized by the double crystal X -ray diffraction analysis.

• 한국결정성장학회지
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• 제10권5호
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• pp.350-355
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• 2000

수평 Bridgeman방식으로 성장된 C축 방향의 사파이어 결정기판을 연마 가공하였으며, 또한 유기금속 기상화학 증착 방법으로 사파이어 기판 위에 GaN 박막을 증착하였다. 사파이어 인고트를 성장하여 2인치 사파이어 기판으로 이용하였으며 웨이퍼 절편장치 및 연마장치를 개발하였다. 이러한 다단계의 연마 가공은 기판 표면을 경면화하였다. 표면 평탄도 및 조도는 원자힘현미경으로 측정하였다. 개발된 사파이어 기판위에 성장된 GaN 박막의 특성 및 청색광소자로의 응용 가능성을 확인하였다.

• 한국광물학회지
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• 제22권2호
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• pp.87-95
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• 2009

마다가스카르산 사파이어를 수평 알루미나 튜브의 전기로에서 대기중의 산화분위기 하에 $1650^{\circ}C$, 50시간의 조건으로 $Be^{2+}$의 확산 처리를 하였다. 자외선-가시광선 분광분석 결과는 각 시료 마다 차이는 있으나 전체적으로 $Fe^{2+}$에서 $Fe^{3+}$로 산화의 원인으로 청색이 옅어졌고 청자색 사파이어는 $Cr^{3+}$에 의한 분홍색이 나타났다. $Be^{2+}$의 확산 처리로 부분적인 갈색이 나타난 청색 사파이어에서는 진한 주황색 부분이 나타났고, 옥화메틸렌에 의한 침적실험 관찰 결과로 시료들의 가장자리에 주황색의 집중현상이 나타났음을 확인하였다. 또한 기존에 있던 내포물도 변화가 나타났다. 그러나 확산 처리 온도의 한계로 더 많은 양의 $Be^{2+}$의 확산이 이루어 지지는 못했다.

• 한국결정성장학회:학술대회논문집
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• 한국결정성장학회 1998년도 PROCEEDINGS OF THE 14TH KACG TECHNICAL MEETING AND THE 5TH KOREA-JAPAN EMGS (ELECTRONIC MATERIALS GROWTH SYMPOSIUM)
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• pp.157-159
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• 1998

Sapphire crystals were grown by Horizontal Bridgman method. The effects of sliding rate (growth rate) of Molybdenum container, growth atmosphere, temperature gradient and orientation of see on crystal qualities were investigated. The size of the crystals grown was up to 150-200 mm in length, 90 mm in width and 25-35 mm in thickness. Crystals grown under the optimum conditions were colorless, transparent and could not be observed and macroscopic defects, such as bubbles, cracks, twins and mosaic structure. With the grown crystals, prototypes of sapphire substrate for blue wafers were characterized. As a result, we can get hight quality of sapphire wafers with c-axis, 1.5 inches in diameters and 0.33 mm in thickess.

• Tribology and Lubricants
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• 제35권6호
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• pp.323-329
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• 2019

Sapphire is currently used as a substrate material for blue light-emitting diodes (LEDs). The market for sapphire substrates has expanded rapidly as the use of LEDs has extended into various industries. However, sapphire is classified as one of the most difficult materials to machine due to its hardness and brittleness. Recently, a lap-grinding process has been developed to combine the lapping and diamond mechanical polishing (DMP) steps in a single process. This paper studies, the effect of wafer surface roughness on the chemical mechanical polishing (CMP) process by pressure and abrasive concentration in the lap-grinding process of a sapphire wafer. In this experiment, the surface roughness of a sapphire wafer is measured after lap-grinding by varying the pressure and abrasive concentration of the slurry. CMP is carried out under pressure conditions of 4.27 psi, a plate rotation speed of 103 rpm, head rotation speed of 97 rpm, and slurry flow rate of 170 ml/min. The abrasive concentration of the CMP slurry was 20wt, implying that the higher the surface roughness after lapgrinding, the higher the material removal rate (MRR) in the CMP. This is likely due to the real contact area and actual contact pressure between the rough wafer and polishing pad during the CMP. In addition, wafers with low surface roughness after lap-grinding show lower surface roughness values in CMP processes than wafers with high surface roughness values; therefore, further research is needed to obtain sufficient surface roughness before performing CMP processes.

• 한국결정성장학회지
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• 제23권3호
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• pp.129-134
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• 2013

사파이어($Al_2O_3$) 단결정 웨이퍼는 청색 LED(light emitting diode) 제작을 위한 핵심 소재로 사용되고 있으며, 사파이어 단결정의 품질에 따라 LED의 성능이 크게 좌우하게 된다. 여러 가지 사파이어 단결정 제조방법 중 키로플러스(Kyropoulos)법은 도가니 직경에 근접한 크기로 잉곳 생산이 가능하며, 내부 전위밀도가 낮아 고품질의 대구경 사파이어 잉곳 제작이 가능하다. 키로플러스법 공정에서 용융 알루미나의 유동은 seed의 성장 형태, 도가니 및 단열재의 형상에 영향을 받으며, 유동양상에 따라 단결정 사파이어 잉곳의 품질이 좌우된다. 특히 온도구배는 hot-zone 내부의 히터 구조와 밀접한 관련이 있으므로 본 연구에서는 도가니 단위표면적당 하부와 측면 히터의 발열비율에 따른 CFD(computational fluid dynamics) 해석을 실시하고, 해석결과를 토대로 각각 용융 알루미나의 유동 및 remelting 현상에 대해 분석하였으며, 이상적인 히터 발열비율을 도출하였다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2010년도 제39회 하계학술대회 초록집
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• pp.207-207
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• 2010

Both ZnO and GaN have excellent physical properties in optoelectronic devices such as blue light emitting diode (LED), blue laser diode (LD), and ultra-violet (UV) detector. The ZnO/GaN heterostructure, which has a potential to achieve the cost efficient LED technology, has been fabricated by using radio frequency (RF) sputtering, pyrolysis, metal organic chemical vapor deposition (MOCVD), direct current (DC) arc plasmatron, and pulsed laser deposition (PLD) methods. Among them, the PLD system has a benefit to control the composition ratio of the grown film from the mixture target. A 500-nm-thick ZnO film was grown by PLD technique on c-plane GaN/sapphire substrates. The post annealing process was executed at some varied temperature between from $300^{\circ}C$ to $900^{\circ}C$. The morphology and crystal structural properties obtained by using atomic force microscope (AFM) and x-ray diffraction (XRD) showed that the crystal quality of ZnO thin films can be improved as increasing the annealing temperature. We will discuss the post-treatment effect on film quality (uniformity and reliability) of ZnO/GaN heterostructures.