• Journal of the Microelectronics and Packaging Society
• /
• v.9 no.4
• /
• pp.35-45
• /
• 2002

The stresses of the underfill/chip interface due to thermal loading was studied using the finite element method. At first, the effective properties of underfill for several volume fractions of silica particles were calculated by Mori-Tanaka method for three different material sets, and the parameters of singularity for the bimaterial edge and the bimaterial wedge were calculated. Consequently, the stresses at the underfill/chip interface with volume fraction of silica particles were investigated. Five different geometric models of flip-chip assembly involving two kinds of bimaterial strips and three kinds of three-layer models were considered under the assumption that the underfill is homogeneous. It was assumed that all components of the flip-chip assembly were linear elastic and isotropic, and their properties were temperature independent. The analysis was conducted in the context of the uncoupled plane thermo-elasticity under a plane strain assumption.

• Transactions of the Korean Society of Mechanical Engineers
• /
• v.17 no.10
• /
• pp.2398-2406
• /
• 1993

Abdi's numerical method(ref.13) for representing a stress singularity by shifting the mid-side nodes of isoparametric elements is reviewed. A simple technique to obtain the optimal position of the mid-side nodes in quadratic isoparametric finite element is presented. From this technique we can directly obtain the position of the side-nodes adjacent to the crack tip. It is also observed that the present technique provides good accuracy for the expression of the opening displacement and the determination of the mid-side nodes for more wide range of material properties than that obtained by Abdicant the finite element method is applied to determine stress intensity factors for pressurized crack perpendicular to and terminating at the interface of two bonded dissimilar materials. A proper definition for stress intensity factors of a crack perpendicular to bimaterial interface is provided. It is based upon a near-tip displacement solutions on the crack surface for interface crack between two dissimilar materials. Numerical testing is carried out with the eight-node and six-node elements. The results obtained are compared with the previous solutions.

• Journal of Mechanical Science and Technology
• /
• v.16 no.1
• /
• pp.39-45
• /
• 2002

Initiation and propagation of interfacial crack along bimaterial interface are considered in this study. A biaxial loading device for a single specimen is used for obtaining a wide range of mode-mixities. The specimen is an edge-cracked bimaterial strip of glass and epoxy; the biaxial loading device, being capable of controlling displacements in two perpendicular directions, is developed. A series of interfacial crack initiation and Propagation experiments are conducted using the biaxial loading device for various mixed modes. Normal crack opening displacement (NCOD) is measured near crack front by a crack opening interferometry and used for extracting fracture parameters. From mixed mode interfacial crack initiation experiments, large increase in toughness with shear components is observed. The behavior of interfacial crack propagation analyzed as a function of mode-mix shows that initial crack propagation is delayed with increase of mode-mixity, and its velocity is increased with positive mode-mixity but decreased with negative case. However, it is found that crack propagation is less accelerated with positive mode-mixity than the negative mode-mixity, which may be caused by contact and/or effects of friction between far field and near-tip Held along the interfacial crack.

• Transactions of the Korean Society of Mechanical Engineers A
• /
• v.25 no.7
• /
• pp.1055-1063
• /
• 2001

When the interfacial crack of isotropic/orthotropic bi-materials is propagated with constant velocity along the interface, stress and displacement components are derived in this research. The dynamic photoelastic experimental hybrid method for the bimaterial is introduced. It is assured that stress components and dynamic photoelastic hybrid developed in this research are valid. Separating method of stress components is introduced from only dynamic photoelastic fringe patterns. Crack propagating velocity of interfacial crack is 69∼71% of Rayleigh wave velocity of epoxy resin. The near-field stress components of bonded interface of bimaterial are similar with those of pure isotopic material and two dissimilar isotropic bimaterials under static or dynamic loading, but very near-field stress components of bonded interface of bimaterial are different from those.

• Proceedings of the KSME Conference
• /
• 2003.11a
• /
• pp.1216-1221
• /
• 2003

The specimen materials used in this research is bimaterial. The static photoelastic experiment was applied to them. And then the specimens used in photoelastic experiment were fractured under static load. The static photoelastic hybrid method was introduced and it's validity had been assured. The static photoelastic hybrid method was applied to the Minimum Strain Energy Density Criterion, the Maximum Tangential Stress Criterion and Mode Mixity. Crack propagation criterion by the static photoelastic hybrid method was introduced and it was applied to the above various failure theories. Comparing the experimental initial angle of crack propagation with the theoretical initial angle of crack propagation from the various failure criterions. And then the optimal crack propagation criterion was suggested and it's validity was assured.

• Transactions of the Korean Society of Mechanical Engineers
• /
• v.15 no.1
• /
• pp.201-208
• /
• 1991

In case that an interface crack exists in an infinite two-dimensional elastic bimaterial, the crack surface is insulated under traction free and the uniform heat flow vertical to the crack from infinite boundary is given. Temperature and stress potentials are obtained by using complex variable approach to solve Hilbert problems. The results are used to obtain thermal stress intensity factors. Only mode I thermal stress intensity factor occurs in case of the homogeneous material. Otherwise, mode I and II thermal stress intensity factor is much smaller than one of mode II.

• Transactions of the Korean Society of Mechanical Engineers
• /
• v.18 no.3
• /
• pp.540-547
• /
• 1994

Contact and frictional locking conditions and the effect of shielding due to contact at the facet, which could be represented by the difference in energy release rate, as a function of phase angle of loading are analyzed in this study for the case of interfacial cracks by assuming single crack-kink model. The analysis of contact effects on interfacial fracture resistance shows that relative shielding increases as the shear component was increased, which indicates a qualitative agreement with the previous experimental results.

• Transactions of the Korean Society of Mechanical Engineers A
• /
• v.28 no.10
• /
• pp.1500-1508
• /
• 2004

Stress and displacement fields for a crack propagating along interface between isotropic material and functionally gradient one with linear property gradation along X direction are developed. The stress and displacement fields are obtained from the complex function of steady plane motion for isotropic and functionally gradient material (FGM). The stresses and displacement in isotropic material of bimaterial are not influenced by nonhomogeneity, however, the fields in FCM are influenced by nonhomogeneity in the terms of higher order, n$\geq$3. When the nonhomogeneous parameter in FGM is zero, or in area close to crack tip, the fields are identical to those of isotropic-isotropic bimaterial. Using these stress components, the effects of nonhomogeneity on stresses are discussed.

• Journal of Mechanical Science and Technology
• /
• v.16 no.12
• /
• pp.1594-1603
• /
• 2002

In this paper, when the initial propagation angle of a branched crack is calculated from the maximum tangential stress criterion (MTSC) and the minimum strain energy density criterion (MSEDC), it is essential that you use stress components in which higher order terms are considered and stress components at the position in a distance 0.005㎜ from the crack tip (=r). When an interfacial crack propagates along the interface at a constant velocity, the initial propagation angles of the branched crack are similar. to the mode mixities (phase angle) and the theoretical values obtained from MTSC and MSEDC. The initial propagation angle of the branched crack depends considerably on the stress intensity factor K$_2$.

• Proceedings of the KSME Conference
• /
• 2000.04a
• /
• pp.170-175
• /
• 2000

Bimaterial containing an in-plane or an out-of-plane singularity embedded in the inclusion or in the unbounded matrix is first analyzed by using analytic continuation. Next, the series forms of solutions for the trimaterial with two concentric circular inclusions having an identical singularity are found based on an alternating technique using the solution for the bimaterial case. The sum of the first three or four terms of solutions derived provides an excellent approximation for most of material combinations. By applying continuous distributions of dislocations, the trimaterial solution obtained in this study may be used to solve crack problems in the same material.