• 제목/요약/키워드: Bimaterial

검색결과 49건 처리시간 0.032초

언더필/칩 계면의 응력 해석 (Analysis of Stresses Along the Underfill/chip Interface)

  • Park, Ji-Eun;Iwona Jasiuk;Lee, Ho-Young
    • 마이크로전자및패키징학회지
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    • 제9권4호
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    • pp.35-45
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    • 2002
  • 열하중에 의한 언더필/칩 계면의 응력을 유한요소법을 이용하여 구하였다. 먼저 실리카 입자의 부피 분율이 언더필 재료의 물성에 미치는 영향을 알아보기 위하여 세 가지 재료 세트에 대하여 실리카 입자의 부피 분율에 따른 영계수, 포아슨비, 영팽창 계수를 Mori-Tanaka방법을 이용하여 계산하였고, 언더필과 칩이 형성하는 edge및 wedge에 대한 singularity를 계산하였다. 그 다음에는 앞에서 계산한 재료물성치를 가지고 실리카 입자의 부피 분율에 따른 언더필/칩 계면의 응력을 몇 가지 플립칩 형상에 대하여 살펴보았다. 언더필이 균일한 재료라는 가정과 플립칩 어셈블리를 구성하고 있는 재료들이 선형탄 성적거동을 하고 등방성을 보이며 그들의 성질이 온도에 무관하다는 가정 하에 다섯 가지의 플립칩 어셈블리 모델이 고려되었다.

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유한요소법에 의한 이종재료 접합면에 수직인 균열의 응력확대계수 결정 (Determination of Stress Intensity Factor for a Crack Perpendicular to Bimaterial Interface by Finite Element Method)

  • 임원균;김상철;이창수
    • 대한기계학회논문집
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    • 제17권10호
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    • pp.2398-2406
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    • 1993
  • Abdi's numerical method(ref.13) for representing a stress singularity by shifting the mid-side nodes of isoparametric elements is reviewed. A simple technique to obtain the optimal position of the mid-side nodes in quadratic isoparametric finite element is presented. From this technique we can directly obtain the position of the side-nodes adjacent to the crack tip. It is also observed that the present technique provides good accuracy for the expression of the opening displacement and the determination of the mid-side nodes for more wide range of material properties than that obtained by Abdicant the finite element method is applied to determine stress intensity factors for pressurized crack perpendicular to and terminating at the interface of two bonded dissimilar materials. A proper definition for stress intensity factors of a crack perpendicular to bimaterial interface is provided. It is based upon a near-tip displacement solutions on the crack surface for interface crack between two dissimilar materials. Numerical testing is carried out with the eight-node and six-node elements. The results obtained are compared with the previous solutions.

Interfacial Crack Propagation Under Various Mode-Mixes

  • Park, Byung-Sun;Chai, Young-Suck
    • Journal of Mechanical Science and Technology
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    • 제16권1호
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    • pp.39-45
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    • 2002
  • Initiation and propagation of interfacial crack along bimaterial interface are considered in this study. A biaxial loading device for a single specimen is used for obtaining a wide range of mode-mixities. The specimen is an edge-cracked bimaterial strip of glass and epoxy; the biaxial loading device, being capable of controlling displacements in two perpendicular directions, is developed. A series of interfacial crack initiation and Propagation experiments are conducted using the biaxial loading device for various mixed modes. Normal crack opening displacement (NCOD) is measured near crack front by a crack opening interferometry and used for extracting fracture parameters. From mixed mode interfacial crack initiation experiments, large increase in toughness with shear components is observed. The behavior of interfacial crack propagation analyzed as a function of mode-mix shows that initial crack propagation is delayed with increase of mode-mixity, and its velocity is increased with positive mode-mixity but decreased with negative case. However, it is found that crack propagation is less accelerated with positive mode-mixity than the negative mode-mixity, which may be caused by contact and/or effects of friction between far field and near-tip Held along the interfacial crack.

등방성/직교이방성 이종재료의 진전 계면균열에 대한 동적 광탄성 실험 하이브리드 법 개발 (Development of the Dynamic Photoelastic Hybrid Method for Propagating Interfacial Crack of Isotropic/Orthotropic Bi-materials)

  • 황재석;신동철;김태규
    • 대한기계학회논문집A
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    • 제25권7호
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    • pp.1055-1063
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    • 2001
  • When the interfacial crack of isotropic/orthotropic bi-materials is propagated with constant velocity along the interface, stress and displacement components are derived in this research. The dynamic photoelastic experimental hybrid method for the bimaterial is introduced. It is assured that stress components and dynamic photoelastic hybrid developed in this research are valid. Separating method of stress components is introduced from only dynamic photoelastic fringe patterns. Crack propagating velocity of interfacial crack is 69∼71% of Rayleigh wave velocity of epoxy resin. The near-field stress components of bonded interface of bimaterial are similar with those of pure isotopic material and two dissimilar isotropic bimaterials under static or dynamic loading, but very near-field stress components of bonded interface of bimaterial are different from those.

정적 광탄성 실험 하이브리드 법에 의한 두 상이한 등방성 이종재료의 계면균열전파 기준에 관한 연구 (A Study on the Interfacial Crack Propagation Criterion for Two Dissimilar Isotropic Bimaterial by the Static Photoelastic Experimental Hybrid Method)

  • 최콘스탄틴;황재석;신동철;남성수;남정환
    • 대한기계학회:학술대회논문집
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    • 대한기계학회 2003년도 추계학술대회
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    • pp.1216-1221
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    • 2003
  • The specimen materials used in this research is bimaterial. The static photoelastic experiment was applied to them. And then the specimens used in photoelastic experiment were fractured under static load. The static photoelastic hybrid method was introduced and it's validity had been assured. The static photoelastic hybrid method was applied to the Minimum Strain Energy Density Criterion, the Maximum Tangential Stress Criterion and Mode Mixity. Crack propagation criterion by the static photoelastic hybrid method was introduced and it was applied to the above various failure theories. Comparing the experimental initial angle of crack propagation with the theoretical initial angle of crack propagation from the various failure criterions. And then the optimal crack propagation criterion was suggested and it's validity was assured.

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수직 균일 열유동하에 있는 접합 경계면 균열의 열응력세기계수 결정 (Determination of Thermal Dtress Intensity Factors for the Interface Crack under Vertical Uniform Heat Flow)

  • 이강용;설창원
    • 대한기계학회논문집
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    • 제15권1호
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    • pp.201-208
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    • 1991
  • 본 연구에서는 균일 열유동이 접합면에 수직으로 흐르고 접합 경계면 균열의 열경계조건이 단열되어 있는 경우에 균질 및 접합재료 모두에 적용될 수 있는 열응세 기계수를 복소해석방법을 이용하여 구하고자 한다.

균열 표면거칠기에 의한 이종재료 계면의 차단효과 (Shielding Effects of Bimaterial Interfaces by Crack Surface Asperities)

  • 채영석;권용수;최병선
    • 대한기계학회논문집
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    • 제18권3호
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    • pp.540-547
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    • 1994
  • Contact and frictional locking conditions and the effect of shielding due to contact at the facet, which could be represented by the difference in energy release rate, as a function of phase angle of loading are analyzed in this study for the case of interfacial cracks by assuming single crack-kink model. The analysis of contact effects on interfacial fracture resistance shows that relative shielding increases as the shear component was increased, which indicates a qualitative agreement with the previous experimental results.

등방성과 X방향 선형함수구배 재료의 접합계면을 따라 전파하는 모드 III 균열의 특성 (Characteristics for a Mode III Crack Propagating along Interface between Isotropic and Functionally Gradient Material with Linear Property Gradation along X Direction)

  • 이광호
    • 대한기계학회논문집A
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    • 제28권10호
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    • pp.1500-1508
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    • 2004
  • Stress and displacement fields for a crack propagating along interface between isotropic material and functionally gradient one with linear property gradation along X direction are developed. The stress and displacement fields are obtained from the complex function of steady plane motion for isotropic and functionally gradient material (FGM). The stresses and displacement in isotropic material of bimaterial are not influenced by nonhomogeneity, however, the fields in FCM are influenced by nonhomogeneity in the terms of higher order, n$\geq$3. When the nonhomogeneous parameter in FGM is zero, or in area close to crack tip, the fields are identical to those of isotropic-isotropic bimaterial. Using these stress components, the effects of nonhomogeneity on stresses are discussed.

A Study on the Initial Crack Curving Angle of Isotropic/Orthotropic Bimaterial

  • Hawong, Jai-Sug;Shin, Dong-Chul;Lee, Ouk-Sub
    • Journal of Mechanical Science and Technology
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    • 제16권12호
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    • pp.1594-1603
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    • 2002
  • In this paper, when the initial propagation angle of a branched crack is calculated from the maximum tangential stress criterion (MTSC) and the minimum strain energy density criterion (MSEDC), it is essential that you use stress components in which higher order terms are considered and stress components at the position in a distance 0.005㎜ from the crack tip (=r). When an interfacial crack propagates along the interface at a constant velocity, the initial propagation angles of the branched crack are similar. to the mode mixities (phase angle) and the theoretical values obtained from MTSC and MSEDC. The initial propagation angle of the branched crack depends considerably on the stress intensity factor K$_2$.

두 개의 동심 원형 개재물을 가지는 삼종 재료에서의 특이성 (A Singularity in a Trimaterial with Two Concentric Circular Inclusions)

  • 이택균;최승태;이경우;엄윤용
    • 대한기계학회:학술대회논문집
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    • 대한기계학회 2000년도 춘계학술대회논문집A
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    • pp.170-175
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    • 2000
  • Bimaterial containing an in-plane or an out-of-plane singularity embedded in the inclusion or in the unbounded matrix is first analyzed by using analytic continuation. Next, the series forms of solutions for the trimaterial with two concentric circular inclusions having an identical singularity are found based on an alternating technique using the solution for the bimaterial case. The sum of the first three or four terms of solutions derived provides an excellent approximation for most of material combinations. By applying continuous distributions of dislocations, the trimaterial solution obtained in this study may be used to solve crack problems in the same material.

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