• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.07a
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• pp.85-86
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• 2005

In case of attaching thermoelectric module and heat source, the polymer sheet is attached on the $Al_2O_3$ plate, which is cooling side of thermoelectric module, in order to enhance mechanical safety of the system. It is impossible to calculate the exact distribution of temperature and flow pattern of inner gap of thermoelectric module. Therefore CFD analyses was executed to determine the thermo-fluid phenomena and distribution by Fluent. As the result of these analyses, heat transfer was dominated by conduction and the difference of temperature was linear distribution according to the thickness of polymer sheet.

• Journal of the Microelectronics and Packaging Society
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• v.11 no.3 s.32
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• pp.83-89
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• 2004

NTC thermistor embedded miniature thermoelectric module was fabricated for the precise temperature control of optical communication device such as laser diode (LD). The miniature thermoelectric module ($7.2 mm{\times}9 mm{\times}2.2 mm$) consists of 21 BiTe thermoelectric couples, the operating temperature is precisely controlled by embedded thermistor with quick response. The figure-of-merit (Z), maximum temperature difference (${\Delta}T_{max}$), maximum cooling capacity ($Q_{max}$) of the miniature thermoelectric module were $2.5{\times}10^{-3}$/K, 72 K, 2.2 W respectively and temperature could be controlled in range of ${\pm}0.1^{\circ}C$ accuracy in air. The fabricated miniature thermoelectric module is suitable for applications of the optical communication packaging.

• Journal of the Microelectronics and Packaging Society
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• v.26 no.4
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• pp.149-156
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• 2019

A stretchable thermoelectric module consisting of 5 pairs of Bi₂Te₃-based hot-pressed p-n thermoelectric legs was processed by filling the module inside with polydimethylsiloxane (PDMS) and removing the top and bottom substrates. Its stretchable characteristics and power generation properties were measured. The integrity of the module was kept well even after 10 strain cycles ranging from 0 to 0.1. With increasing the tensile strain to 0.2, the module circuitry became open because of joint failure between Cu electrodes and thermoelectric legs. The stretchable thermoelectric module exhibited an open circuit voltage of 4.6 mV with a temperature difference of 2.2K across both ends of thermoelectric legs, and changes in its open circuit voltage were below 5% for tensile strains of 0~0.1. Being elongated for a strain of 0.1, it exhibited the maximum output power of 18.5 ㎼ with the temperature difference of 2.2K across its both ends.

• Journal of the Microelectronics and Packaging Society
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• v.7 no.3
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• pp.1-6
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• 2000

A simple and compact type of thermoelectric generator was developed as the energy saving system using waste hot water and low temperature waste heat sources. Sixteen of Bi-Te thermoelectric modules were packaged in series for thermoelectric conversion system using hot water as heat source. The thermoelectric generator shows the power output of about 4.5 W with the temperature difference of about 75 K at 40 $\Omega$ and 0.35 A for the electrical resistance and current of the used thermoelectric module, respectively.

• Proceedings of the KIEE Conference
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• 2005.07c
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• pp.2025-2027
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• 2005

Thermal conductive polymer film was adopted to reduce the fracture of module during the fabrication of thermoelectric generator. We investigated the thermoelectric output power of module with the change of thickness of polymer film, direct contact and thermal-conductive grease. It is measured that thermoelectric output power is decreased with the increasing thickness of thermal-conductive polymer film. And

• Journal of the Microelectronics and Packaging Society
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• v.26 no.4
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• pp.119-126
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• 2019

A flexible thermoelectric module, which consisted of 18 pairs of Bi₂Te₃-based hot-pressed p-n thermoelectric legs, were processed by filling the module inside with polydimethylsiloxane (PDMS) and removing the top and bottom substrates. Its power generation properties and bending characteristics were measured. With putting the flexible module on the wrist, an open circuit voltage of 2.23 mV and a maximum output power of 1.69 ㎼ were generated during staying still. On the other hand, an open circuit voltage of 3.32 mV and a maximum output power of 3.41 ㎼ were obtained with walking motion. The resistance variation of the module was kept below 1% even after applying 30,000 bending cycles with a bending curvature radius of 25 mm.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.11a
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• pp.38-38
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• 2004

• Proceedings of the SAREK Conference
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• 2006.06a
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• pp.1144-1149
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• 2006

Electric power is generated by Seeback Effect if there is thermal difference in pettier module. Peltier module is composed by alumina, Bi-Te semiconductor and insulation (or air). If load is increased in pettier module, the alumina of module will be destroyed. One of the preventing method of module destruction is using damper between module and heat source. But the electric Power is dropped because of decrease of thermal difference, if thermal conductivity of damper was tourer than other thermoelectric materials. We design, Polymer Pad for enhancing thermoelectric porter. As the result of these experiment, Polymer Pad is more superior than the Rubber in the stability and thermal conduction.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2018.06a
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• pp.81-81
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• 2018

Bi-Te계 열전소자는 상온에서의 열전 효율이 우수하기 때문에 항공, 컴퓨터 등의 열전발전 또는 열전냉각 모듈에 널리 사용된다. 이 열전소자를 활용한 열전모듈은 다수의 n형 및 p형 열전소자가 세라믹 위에 형성된 Cu 전극에 전기적으로 직렬이 되도록 서로 솔더링 접합이 되어 있는 구조를 가지고 있다. 이처럼 직렬 연결된 방식에서는 높은 접합강도를 필요로 한다. 열전모듈 제작 시 Bi-Te 계 소자를 바로 Cu 기판에 접합시키면 솔더에 들어있는 Sn과 기판의 Cu가 접합하는 과정에서 소재 내로 확산하여 접합강도를 저하시킨다. 이러한 열전모듈의 접합강도 저하를 막기 위해 무전해 Ni-W-P 도금층을 확산 방지층으로 적용하였다. 본 연구에서는 Ni-W-P 도금이 Bi-Te 계 열전 모듈의 접합강도에 미치는 영향을 조사하였다. 본 연구에서는 Bi-Te계 열전소자에 양호한 밀착성을 가지는 Ni-W-P 도금층을 형성시키기 위해서 알루미나 분말을 이용한 sand-blasting 방법을 사용하여 Bi-Te 소재 표면에 분사하는 방법으로 표면을 거칠게 하였다. 그 후 무전해 Ni-W-P 도금을 $85^{\circ}C$에서 20분간 실시하여 약 4um의 Ni-W-P 도금층을 형성시켰다. 열전 모듈은 Sn-Ag-Cu 솔더를 사용하여 제작하였으며 접합강도는 Bonding tester를 사용하여 측정하였다. 제작한 열전 모듈의 단면 및 파단면 관찰을 통하여 접합강도가 변하는 요인을 조사하였다. 제작한 열전 모듈의 단면을 FE-EPMA로 관찰한 결과 Ni-W-P 도금층이 Bi-Te 소자와 Sn과 Cu사이의 확산을 방지하는 확산방지층 역할을 하는 것을 관찰할 수 있었다. 또한 열처리 전 열전모듈과 200도, 150시간 열처리 후 접합강도를 각각 측정해 본 결과, 열처리 후의 접합강도가 상승하는 것을 확인 할 수 있었다. 따라서 Bi-Te계 열전모듈 제작에 무전해 Ni-W-P 도금층을 형성시키므로 인해 확산방지층의 생성과 접합강도의 상승에 도움을 주었다.

• 제어로봇시스템학회:학술대회논문집
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• 2005.06a
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• pp.139-144
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• 2005

A rigorous research is underway in our team, for the design and development of high figure of merits (ZT= 1.5${\sim}$2.0) micro-thermoelectric coolers. This paper discusses the fabrication process that we are using for developing the $Sb_2Te_3-Bi_2Te_3$ micro-thermoelectric cooling modules. It describes how to obtain the mechanical properties of the thin film TEC elements and reports the results of an equation-based multiphysics modeling of the micro-TEC modules. In this study the thermoelectric thin films were deposited on Si substrates using co-sputtering method. The physical mechanical properties of the prepared films were measured by nanoindentation testing method while the thermal and electrical properties required for modeling were obtained from existing literature. A finite element model was developed using an equation-based multiphysics modeling by the commercial finite element code FEMLAB. The model was solved for different operating conditions. The temperature and the stress distributions in the P and N elements of the TEC as well as in the metal connector were obtained. The temperature distributions of the system obtained from simulation results showed good agreement with the analytical results existing in literature. In addition, it was found that the maximum stress in the system occurs at the bonding part of the TEC i.e. between the metal connectors and TE elements of the module.