• Journal of Welding and Joining
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• 제32권3호
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• pp.34-42
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• 2014

Flexible devices have been developed from their rigid, heavy origins to become bendable, stretchable and portable. Such a paper displays, e-skin, textile electronics are emerging research areas and became a mainstream of overall industry. Thin film transistors, diodes and sensors built on plastic sheets, textile and other unconventional substrates have a potential applications in wearable displays, biomedical devices and electronic system. In this review, we describe current trends in technologies for flexible/wearable electronics.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2012년도 제43회 하계 정기 학술대회 초록집
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• pp.67-67
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• 2012

Graphene, two-dimensional one-atom-thick planar sheet of carbon atoms densely packed in a honeycomb crystal lattice, exhibits fascinating electrical properties, such as a linear energy dispersion relation and high mobility in addition to a wide-range optical absorption and high thermal conductivity. Graphene's outstanding tensile strength allows graphene-based electronic and photonic devices to be flexible, bendable, or even stretchable. Recently many groups have reported high performance electronic and optoelectronic devices based on graphene materials, i.e. field-effect transistors, gas sensors, nonvolatile memory devices, and plasmonic waveguides, in which versatile properties of graphene materials have been incorporated into a flexible electronic or optoelectronic platform. However, there are several fundamental or technological hurdles to be overcome in real applications of graphene in electronics and optoelectronics. In this tutorial we will present a short introduction to the basic material properties and recent progresses in applications of graphene to electronics and optoelectronics and discuss future outlook of graphene-based devices.

• Journal of Welding and Joining
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• 제31권3호
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• pp.84-88
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• 2013

These days embedded technology may be the most significant development in the electronics industry. The study focused on the development of active device embedding using flexible printed circuit in view of process and materials. The authors fabricated 30um thickness Si chip without any crack, chipping defects with a dicing before grinding process. In order to embed chips into flexible PCB, the chip pads on a chip are connected to bonding pad on flexible PCB using an ACF film. After packaging, all sample were tested by the O/S test and carried out the reliability test. All samples passed environmental reliability test. In the future, this technology will be applied to the wearable electronics and flexible display in the variety of electronics product.

• Journal of Welding and Joining
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• 제31권3호
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• pp.4-10
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• 2013

In electronic industry, the trend of future electronics will be flexible, bendable, wearable electronics. Until now, there is few study on bonding technology and reliability of bonding joint between chip with micro solder bump and flexible substrate. In this study, we investigated joint properties of Si chip with eutectic Sn-58Bi solder bump on Cu pillar bump bonded on flexible substrate finished with ENIG by flip chip process. After flip chip bonding, we observed microstructure of bump joint by SEM and then evaluated properties of bump joint by die shear test, thermal shock test, and bending test. After thermal shock test, we observed that crack initiated between $Cu_6Sn_5IMC$ and Sn-Bi solder and then propagated within Sn-Bi solder and/or interface between IMC and solder. On the other hands, We observed that fracture propated at interface between Ni3Sn4 IMC and solder and/or in solder matrix after bending test.

• 마이크로전자및패키징학회지
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• 제20권2호
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• pp.1-9
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• 2013

Recently flexible electronic devices have attracted a great deal of attention because of new application possibilities including flexible display, flexible memory, flexible solar cell and flexible sensor. In particular, development of flexible memory is essential to complete the flexible integrated systems such as flexible smart phone and wearable computer. Research of flexible memory has primarily focused on organic-based materials. However, organic flexible memory has still several disadvantages, including lower electrical performance and long-term reliability. Therefore, emerging research in flexible electronics seeks to develop flexible and stretchable technologies that offer the high performance of conventional wafer-based devices as well as superior flexibility. Development of flexible memory with inorganic silicon materials is based on the design principle that any material, in sufficiently thin form, is flexible and bendable since the bending strain is directly proportional to thickness. This article reviews progress in recent technologies for flexible memory and flexible electronics with inorganic silicon materials, including transfer printing technology, wavy or serpentine interconnection structure for reducing strain, and wafer thinning technology.

• 전자통신동향분석
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• 제27권1호
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• pp.1-18
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• 2012

미래 사회는 나노기술(NT)을 바탕으로 IT-ET-BT 기술이 융합된 유비쿼터스 사회로 진화하고 있으며, 미래 산업 사회로의 전환을 위해서는 성능개선이 아닌 성능한계 돌파의 패러다임 전환이 가능한 임계성능의 나노 소재/신소자의 개발이 절실히 요구되고 있다. 또한 차세대 단말기는 휴대성의 편리함, 융복합화/다기능화, 인간 친화형이 요구되고, flexible/stretchable/bendable한 형태로 발전하고 있는 상황이다. 나노 피에조트로닉스(nanopiezotronics) 기술은 역학적 에너지를 전기적 에너지로 변환하는 나노 발전 소자(nanogenerator)의 원리를 기반으로 하며 나노선, 나노벨트와 같은 1차원적 나노구조 소재의 압전성과 반전도성이 결합된 특성을 이용한 신기능의 미래 IT 융합 나노 전자/에너지 소자를 구현하는 기술로서 미래 유망 기술로 부각되고 있다. 현재 기술 수준은 압전 전계 효과 트랜지스터, 압전-다이오드, 압전 센서, 압전 나노 발전 소자 등과 같은 prototype 소자를 제작하는 수준에 머무르고 있으나 향후 초고감도 압전 센서, 자가발전 MEMS/NEMS 및 나노 시스템, 스마트 웨어러블 시스템, 건강 모니터링 시스템, 인체 삽입형 소자, portable 및 투명 유연 전자소자 등의 다양한 미래 융합 나노 소자 및 시스템에 광범위한 활용이 가능하며, 향후 신기능의 소자/부품/시스템 창출을 위한 기술로 자리매김할 것으로 전망된다. 본고에서는 압전 나노선, 나노튜브, 나노섬유 등의 1차원적 나노구조체 기반의 nanopiezotronics 기술과 최근의 연구결과들을 소개한다.

• 한국기계가공학회지
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• 제19권1호
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• pp.63-71
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• 2020

Recently, to improve convenience, flexible electronics are quickly being developed for a number of application areas. Flexible electronic devices comprise characters such as being bendable, stretchable, foldable, and wearable. Effectively manufacturing flexible electronic devices requires high efficiency, low costs, and simple processes for manufacturing technology. Through this study, we enabled the rapid production of multifunctional flexible bending sensors using a simple, low-cost Fused Deposition Modeling (FDM) 3D printer. Furthermore, we demonstrated the possibility of the rapid production of a range of functional flexible bending sensors using a simple, low-cost FDM 3D printer. Accurate and reproducible functional materials made by FDM 3D printers are an effective tool for the fabrication of flexible sensor electronic devices. The 3D-printed flexible bending sensor consisted of polyurethane and a conductive filament. Two patterns of electrodes (straight and Hilbert curve) for the 3D printing flexible sensor were fabricated and analyzed for the characteristics of bending displacement. The experimental results showed that the straight curve electrode sensor sensing ability was superior to the Hilbert curve electrode sensor, and the electrical conductivity of the Hilbert curve electrode sensor is better than the straight curve electrode sensor. The results of this study will be very useful for the fabrication of various 3D-printed flexible sensor devices with multiple degrees of freedom that are not limited by size and shape.